400 Digital Transmission Controllers 18

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS3171+	Analog Devices	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.273 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3173N+	Analog Devices	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.449 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3173+	Analog Devices	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.449 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3172	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3172+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3172N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3174N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3174N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3173N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.449 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3171N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.273 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3173	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.449 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3171N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.273 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3174	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3172N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified				27 mm
DS3174+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1			27 mm
DS3171	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.273 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS33R41+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e1	30	260	27 mm
DS33R41	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400	3	2.54 mm	27 mm	Not Qualified	e0			27 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.