LBGA Digital Transmission Controllers 14

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Length
DS21458N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	1.5 mm			17 mm	Not Qualified	e3	17 mm
DS21458N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm			17 mm	Not Qualified	e0	17 mm
PEF22558E	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256		1.5 mm			17 mm	Not Qualified	e1	17 mm
PEF22552PG	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	160	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B160		1.6 mm			15 mm	Not Qualified		15 mm
PEF2256E	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	81	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.145 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B81	1	1.5 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified		10 mm
PEF22552P	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	160	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B160		1.6 mm			15 mm	Not Qualified	e1	15 mm
PEF22557E	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.5 mm			17 mm	Not Qualified		17 mm
PEF22554HT	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	160	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	QFP144,.87SQ,20	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B160		1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	15 mm	Not Qualified	e1	15 mm
DS3170N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B100	3	1.5 mm			11 mm	Not Qualified	e0	11 mm
DS3170N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B100	3	1.5 mm			11 mm	Not Qualified	e3	11 mm
DS3170+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B100	3	1.5 mm			11 mm	Not Qualified	e3	11 mm
DS3170	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B100	3	1.5 mm			11 mm	Not Qualified	e0	11 mm
DS21458	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm			17 mm	Not Qualified	e0	17 mm
DS21458+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B256	3	1.5 mm			17 mm	Not Qualified	e1	17 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.