LFQFP Digital Transmission Controllers 87

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS2155L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS2155L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2155LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS2155LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS21Q59LN+	Analog Devices	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e3	30	260	14 mm
DS21Q59L+	Analog Devices	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
PEB22554	Infineon Technologies	FRAMER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.33 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G144		1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	20 mm	Not Qualified	e0			20 mm
PEF22554E	Infineon Technologies	FRAMER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	BGA160,14X14,40	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G144		1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	20 mm	Not Qualified	e3			20 mm
DS3160	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
DS3170LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
DS3160C01	Maxim Integrated	FRAMER	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Digital Transmission Interfaces	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
DS3160N	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Digital Transmission Interfaces	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
DS3170L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
DS26504LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26502LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26521LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.11 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26503L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26503LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26521LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.11 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26502LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26503LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26503L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26504LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26504L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26502L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26502LN+T	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm			10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
DS26502L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26504L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS2154L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2156L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS21Q58LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS21Q44TN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	R-PQFP-G128		1.6 mm			14 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	20 mm
DS2154LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0	20	240	14 mm
DS2152L-C01	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G100		1.6 mm			14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
DS2196LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e0		245	14 mm
DS21Q42TN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Digital Transmission Controllers	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e0			20 mm
DS21Q42T+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Digital Transmission Controllers	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e3			20 mm
DS2155L-DC	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS2154LA2+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e3	30	260	14 mm
DS21Q41BT	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Digital Transmission Controllers	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e0			20 mm
DS21Q41BT+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e3			20 mm
DS2152L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm		T-1(DS1)	14 mm	Not Qualified	e3	30	260	14 mm
DS2155LNB	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100	1	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified				14 mm
DS21Q43AT+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	4	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e3			20 mm
DS2155LNB+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e3	30	260	14 mm
DS2152LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm		T-1(DS1)	14 mm	Not Qualified	e3	30	260	14 mm
DS21Q44T	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87	Digital Transmission Controllers	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	1.6 mm			14 mm	Not Qualified	e0			20 mm
DS2156LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.