INDUSTRIAL Digital Transmission Controllers 234

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PEF22554E	Infineon Technologies	FRAMER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	BGA160,14X14,40	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G144		1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	20 mm	Not Qualified	e3			20 mm
PEB3456E	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B388		2.54 mm			35 mm	Not Qualified				35 mm
DS3172N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3174N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified	e1			27 mm
DS3144N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.32 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3174N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3141N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.09 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3112N+W	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e3			27 mm
DS3173N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.449 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3170N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B100	3	1.5 mm			11 mm	Not Qualified	e0			11 mm
DS3171N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.273 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3171N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.273 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified	e1			27 mm
DS3172N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified				27 mm
DS3148N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	349	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.64 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA349,19X19,50	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B349		2.35 mm			27 mm	Not Qualified	e0			27 mm
DS3170LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
DS3170N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B100	3	1.5 mm			11 mm	Not Qualified	e3			11 mm
DS3160N	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Digital Transmission Interfaces	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
DS3143N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.25 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3142N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified				13 mm
DS3120N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	316	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B316		2.53 mm			27 mm	Not Qualified	e0			27 mm
DS31412N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	349	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.96 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA349,19X19,50	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B349		2.35 mm			27 mm	Not Qualified	e0			27 mm
DS3146N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	349	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.48 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA349,19X19,50	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B349		2.35 mm			27 mm	Not Qualified	e0			27 mm
DS26504LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS34S108GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B484	3	2.41 mm			23 mm	Not Qualified	e0		245	23 mm
DS26502LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26522GN	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.22 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.75 mm	T-1(DS1)	CEPT PCM-30/E-1	13 mm	Not Qualified	e1		245	13 mm
DS34T101GN+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.55 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B484	3	2.41 mm			23 mm	Not Qualified	e1	30	260	23 mm
DS34T102GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.55 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B484	3	2.41 mm			23 mm	Not Qualified	e0		245	23 mm
DS26521LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.11 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26503LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS26519	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	484	HBGA	SQUARE	UNSPECIFIED	YES	1			1.8 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-XBGA-B484		2.41 mm			23 mm	Not Qualified	e0			23 mm
DS26521LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.11 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26518	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	UNSPECIFIED	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-XBGA-B256		1.76 mm			17 mm	Not Qualified	e0			17 mm
DS33R11+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified	e1	30	260	27 mm
DS26502LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS33R41+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified	e1	30	260	27 mm
DS26522GN+	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.22 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.75 mm	T-1(DS1)	CEPT PCM-30/E-1	13 mm	Not Qualified	e1	30	260	13 mm
DS34T104GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.55 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B484	3	2.41 mm			23 mm	Not Qualified	e0		245	23 mm
DS34S132GNA2	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			.35 mA		1.8,2.5,3.3	GRID ARRAY	BGA676,26X26,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B676						Not Qualified
DS26503LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26528GNA5+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified				17 mm
DS26401NA2	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.75 mm			17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
DS26401NA2+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.75 mm			17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
DS34T108GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.55 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B484		2.41 mm			23 mm	Not Qualified	e1		225	23 mm
DS26528N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified				17 mm
DS26519GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.925 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA484,22X22,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B484	3	2.41 mm		CEPT PCM-30/E-1	23 mm	Not Qualified	e0		245	23 mm
DS33R41	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified	e0			27 mm
DS26504LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.