BALL Digital Transmission Controllers 205

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS3112N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e0			27 mm
DS3112N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e3			27 mm
DS3112+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e3			27 mm
DS3112	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e0			27 mm
DS3112DK	Analog Devices	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.34 mm			27 mm	Not Qualified	e0			27 mm
DS21458N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	1.5 mm			17 mm	Not Qualified	e3			17 mm
DS21458N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm			17 mm	Not Qualified	e0			17 mm
PM4351-RGI	Microchip Technology	FRAMER	INDUSTRIAL	BALL	81	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY				85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B81							e3
DS34S104GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS34T102GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.55 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B484	3	2.41 mm			23 mm	Not Qualified	e1	30	260	23 mm
DS26514GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.25 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e1	30	260	17 mm
DS26518GN	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.45 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified			245	17 mm
DS34T108GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.55 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B484	3	2.41 mm			23 mm	Not Qualified	e1	30	260	23 mm
DS26514	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	UNSPECIFIED	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-XBGA-B256		1.76 mm			17 mm	Not Qualified	e0			17 mm
DS34S108GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B484	3	2.41 mm			23 mm	Not Qualified	e1	30	260	23 mm
DS26514GN	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.25 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified				17 mm
DS26518GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.45 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified		30	260	17 mm
DS34S101GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS34S102GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified				17 mm
DS34T104GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.55 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B484	3	2.41 mm			23 mm	Not Qualified	e1	30	260	23 mm
DS3171+	Analog Devices	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.273 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e1			27 mm
DS3173N+	Analog Devices	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.449 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e1			27 mm
DS3173+	Analog Devices	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.449 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e1			27 mm
DS3112D1+	Analog Devices	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified				27 mm
DS2155GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100					10 mm	Not Qualified	e1			10 mm
DS2155G/T	Analog Devices	FRAMER	COMMERCIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B100					10 mm	Not Qualified	e0			10 mm
PEF22558E	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256		1.5 mm			17 mm	Not Qualified	e1			17 mm
PEF20256E	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B388		2.54 mm			35 mm	Not Qualified				35 mm
PEF22552PG	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	160	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B160		1.6 mm			15 mm	Not Qualified				15 mm
PEB3445E	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V	2.5,3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B272		2.35 mm			27 mm	Not Qualified				27 mm
PEF2256E	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	81	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.145 mA	1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B81	1	1.5 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified				10 mm
PEF22552P	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	160	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B160		1.6 mm			15 mm	Not Qualified	e1			15 mm
PEF22557E	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.5 mm			17 mm	Not Qualified				17 mm
PEF3445E	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B272		2.35 mm			27 mm	Not Qualified				27 mm
PEB20256E	Infineon Technologies	FRAMER	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B388		2.54 mm			35 mm	Not Qualified				35 mm
PEF22554HT	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	160	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE	QFP144,.87SQ,20	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B160		1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	15 mm	Not Qualified	e1			15 mm
PEB3456E	Infineon Technologies	FRAMER	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B388		2.54 mm			35 mm	Not Qualified				35 mm
DS3172	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3172+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified	e1			27 mm
DS3172N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3174N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified	e1			27 mm
DS3144N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.32 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3144	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.32 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3142	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.17 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3174N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3120	Maxim Integrated	FRAMER	COMMERCIAL	BALL	316	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B316		2.53 mm			27 mm	Not Qualified	e0			27 mm
DS3112+W	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e3			27 mm
DS3141N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.09 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.