Maxim Integrated Digital Transmission Controllers 332

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS2141AQ+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3	30	260	16.585 mm
DS2141AQ	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Digital Transmission Controllers	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
DS2155L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS2155L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2155LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS2155LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2143Q	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm		CEPT PCM-30/E-1	16.585 mm	Not Qualified	e0		245	16.585 mm
DS2143Q+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3	30	260	16.585 mm
DS3112N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e0			27 mm
DS3112N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e3			27 mm
DS3112+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e3			27 mm
DS3112	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e0			27 mm
DS21458N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	1.5 mm			17 mm	Not Qualified	e3			17 mm
DS21458N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm			17 mm	Not Qualified	e0			17 mm
DS3172	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3172+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified	e1			27 mm
DS3172N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3174N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified	e1			27 mm
DS3144N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.32 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3144	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.32 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3142	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.17 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3174N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3120	Maxim Integrated	FRAMER	COMMERCIAL	BALL	316	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B316		2.53 mm			27 mm	Not Qualified	e0			27 mm
DS3112+W	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e3			27 mm
DS3141N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.09 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3142+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B144		1.75 mm			13 mm			NOT SPECIFIED	NOT SPECIFIED	13 mm
DS3170N+T&R	Maxim Integrated	FRAMER																													NOT SPECIFIED	NOT SPECIFIED
DS3112N+W	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified	e3			27 mm
DS3148	Maxim Integrated	FRAMER	COMMERCIAL	BALL	349	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.64 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA349,19X19,50	Digital Transmission Controllers	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B349		2.35 mm			27 mm	Not Qualified	e0			27 mm
DS3173N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.449 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3170N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B100	3	1.5 mm			11 mm	Not Qualified	e0			11 mm
DS3160	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
DS3112D1	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	2.34 mm			27 mm	Not Qualified				27 mm
DS3141	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.09 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3142N+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B144		1.75 mm			13 mm			NOT SPECIFIED	NOT SPECIFIED	13 mm
DS3171N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.273 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3173	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.449 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3171N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.273 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified	e1			27 mm
DS3174	Maxim Integrated	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.725 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B400		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS3141+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e1			13 mm
DS3172N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.328 mA	3.3 V	3.3	GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B400	3	2.54 mm			27 mm	Not Qualified				27 mm
DS3148N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	349	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.64 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA349,19X19,50	Digital Transmission Controllers	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B349		2.35 mm			27 mm	Not Qualified	e0			27 mm
DS3170LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
DS3160C01	Maxim Integrated	FRAMER	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Digital Transmission Interfaces	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm
DS3170N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B100	3	1.5 mm			11 mm	Not Qualified	e3			11 mm
DS3170+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		.145 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B100	3	1.5 mm			11 mm	Not Qualified	e3			11 mm
DS3143	Maxim Integrated	FRAMER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.25 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Controllers	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.75 mm			13 mm	Not Qualified	e0			13 mm
DS3160N	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Digital Transmission Interfaces	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100		1.6 mm			14 mm	Not Qualified	e0			14 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.