256 Digital Transmission Interfaces 39

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
82P2288BBG8	Renesas Electronics	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	3.5 mm	T-1(DS1)	T-1(DS1)	17 mm	Not Qualified	e1			17 mm
IDT82P2288BBG8	Renesas Electronics	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	3.5 mm	T-1(DS1)	T-1(DS1)	17 mm	Not Qualified	e1			17 mm
FLLXT3108BE.B3	Cortina Systems		INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES			.00001 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256						Not Qualified
PEF22508E	Infineon Technologies	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.5 mm			17 mm	Not Qualified				17 mm
DS26334G	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.1 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified			245	17 mm
DS26324GN+T&R	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.7 mm			17 mm					17 mm
DS26334GNA2	Maxim Integrated		INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES			1100 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256						Not Qualified
DS26324GNA2+W	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26324GA2+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26324G	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.1 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e0			17 mm
DS26324GA2+W	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26334G+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.1 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26324GN	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.1 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified			245	17 mm
DS26334GNA3+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.7 mm			17 mm					17 mm
DS26334GN+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26324GNA2	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified				17 mm
DS26334GNA3	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.7 mm			17 mm					17 mm
DS26324GN+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.1 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26334GN	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.1 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified			245	17 mm
DS26324GNA2+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26324G+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.1 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS21Q552	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	4	CMOS		5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified			245	27 mm
DS21Q552+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	4	CMOS		5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified				27 mm
DS21Q554	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	4	CMOS		5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified			245	27 mm
DS21Q352N	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	4	CMOS		5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified				27 mm
DS21Q55N	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.54 mm	T-1(DS1)	CEPT PCM-30/E-1	27 mm	Not Qualified	e0			27 mm
DS21Q352B+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	4	CMOS		5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified	e1			27 mm
DS21Q354	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	4	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified			245	27 mm
DS21Q55	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.54 mm	T-1(DS1)	CEPT PCM-30/E-1	27 mm	Not Qualified	e0			27 mm
DS21Q352B	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	4	CMOS		5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256		2.54 mm			27 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	27 mm
DS21Q352	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	4	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256	3	2.54 mm			27 mm	Not Qualified			245	27 mm
82P2288BCG	Renesas Electronics	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.7 mm			17 mm		e1	30	260	17 mm
82P2288BB8	Renesas Electronics	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	3.5 mm		T-1(DS1)	17 mm	Not Qualified	e0	30	225	17 mm
82P2288BC	Renesas Electronics	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.7 mm			17 mm		e0			17 mm
IDT82P2288BB8	Renesas Electronics	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	3.5 mm		T-1(DS1)	17 mm	Not Qualified	e0	30	225	17 mm
82P2288BB	Renesas Electronics	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	3.5 mm		T-1(DS1)	17 mm	Not Qualified	e0	30	225	17 mm
82P2288BBG	Renesas Electronics	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	3.5 mm	T-1(DS1)	T-1(DS1)	17 mm	Not Qualified	e1		260	17 mm
IDT82P2288BBG	Renesas Electronics	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	3.5 mm	T-1(DS1)	T-1(DS1)	17 mm	Not Qualified	e1	40	260	17 mm
IDT82P2288BB	Renesas Electronics	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	3.5 mm		T-1(DS1)	17 mm	Not Qualified	e0	30	225	17 mm

Digital Transmission Interfaces

Digital Transmission Interfaces are electronic components that enable the efficient transfer of digital signals between devices in communication systems. These interfaces are used in a wide range of applications, including computer networking, telecommunications, and consumer electronics. They provide a means of transmitting digital data over various communication channels, such as Ethernet networks, USB cables, and wireless communication protocols.

Digital Transmission Interfaces use a variety of protocols and standards to ensure the reliable and efficient transmission of data. These protocols include packet framing, which involves adding header and footer information to each data packet to enable proper routing and error detection. Error correction techniques are also used to ensure that the transmitted data is accurately received, even in the presence of noise or other transmission errors. Flow control is another important aspect of digital transmission, which helps to prevent data loss or congestion by regulating the flow of data between the transmitting and receiving devices.

There are several different types of Digital Transmission Interfaces, each designed for a specific communication channel or protocol. Ethernet is a popular interface used for wired networking, while USB is commonly used for connecting peripherals to computers and mobile devices. Bluetooth and Wi-Fi are wireless communication protocols used for short-range and long-range data transmission, respectively. Serial Interfaces, such as RS-232 and RS-485, are used for point-to-point data communication over long distances.

Digital Transmission Interfaces offer several advantages over analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems. However, Digital Transmission Interfaces also require specialized hardware and software, and may be susceptible to data loss or corruption due to transmission errors.