PCM TRANSCEIVER Digital Transmission Interfaces 511

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS32504	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B144		1.76 mm	13 mm	Not Qualified	e0			13 mm
DS26303LN-120+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.478 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	Digital Transmission Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G144	3	1.6 mm	20 mm	Not Qualified	e3	30	260	20 mm
DS26303LN-120A3	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G144		1.6 mm	20 mm			NOT SPECIFIED	NOT SPECIFIED	20 mm
DS3150Q	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		.11 mA	3.3 V	3.3	CHIP CARRIER	LDCC28,.5SQ	Digital Transmission Interfaces	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	1	4.57 mm	11.505 mm	Not Qualified	e0			11.505 mm
DS3254N#	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.76 mm	13 mm			NOT SPECIFIED	NOT SPECIFIED	13 mm
DS3152+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.2 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified	e3			13 mm
DS26303LN-75A3	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G144		1.6 mm	20 mm			NOT SPECIFIED	NOT SPECIFIED	20 mm
DS3254+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.36 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified	e1	30	260	13 mm
DS32512N	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.6 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B484	3	2.41 mm	23 mm	Not Qualified	e0			23 mm
DS3251+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.12 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified	e1	30	260	13 mm
DS32502N+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B144		1.76 mm	13 mm	Not Qualified	e3			13 mm
DS3254NA3	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.76 mm	13 mm			NOT SPECIFIED	NOT SPECIFIED	13 mm
DS32512A2	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B484		2.41 mm	23 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	23 mm
DS32508A2	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B484		2.41 mm	23 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	23 mm
DS26303L-120+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.478 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G144	3	1.6 mm	20 mm	Not Qualified	e3	30	260	20 mm
DS32504+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B144		1.76 mm	13 mm	Not Qualified	e3			13 mm
DS26303LN-075+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.478 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	Digital Transmission Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G144		1.6 mm	20 mm	Not Qualified	e3			20 mm
DS32501N	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144		1.76 mm	13 mm	Not Qualified	e0			13 mm
DS26303L-75+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G144	3	1.6 mm	20 mm	Not Qualified	e3	30	260	20 mm
DS3252+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.2 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified	e1	30	260	13 mm
DS3252N	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.2 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified			245	13 mm
DS26334GNA3+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.7 mm	17 mm					17 mm
DS26334GN+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm	17 mm	Not Qualified	e1	30	260	17 mm
DS32502	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B144		1.76 mm	13 mm	Not Qualified	e0			13 mm
DS3151+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B144		1.76 mm	13 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	13 mm
DS26324GNA2	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm	17 mm	Not Qualified				17 mm
DS32506N+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.3 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B484	3	2.41 mm	23 mm	Not Qualified	e1	30	260	23 mm
DS3154NA2	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.76 mm	13 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	13 mm
DS3154N+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.4 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified	e0			13 mm
DS26334GNA3	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.7 mm	17 mm					17 mm
DS26303L-75A3	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G144		1.6 mm	20 mm			NOT SPECIFIED	NOT SPECIFIED	20 mm
DS32501N+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B144		1.76 mm	13 mm	Not Qualified	e3			13 mm
DS3254N+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.36 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified	e1	30	260	13 mm
DS32504N	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B144		1.76 mm	13 mm	Not Qualified	e0			13 mm
DS3153	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.3 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified	e0			13 mm
DS26324GN+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.1 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm	17 mm	Not Qualified	e1	30	260	17 mm
DS3253+	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.28 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified	e1	30	260	13 mm
DS26334GN	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.1 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3	1.76 mm	17 mm	Not Qualified			245	17 mm
DS3252	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.2 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified			245	13 mm
DS3150QNB4TR	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28	1	4.57 mm	11.5062 mm	Not Qualified	e0			11.5062 mm
DS3150G	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.09 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	Digital Transmission Interfaces	.8 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B49		1.5 mm	7 mm	Not Qualified	e0			7 mm
DS26303L-75	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G144	1	1.6 mm	20 mm	Not Qualified				20 mm
DS3251N+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.12 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified	e1	30	260	13 mm
DS3150Q/T&R	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD	S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	11.5062 mm
DS3253	Maxim Integrated	PCM TRANSCEIVER	COMMERCIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	3.3 V	3.3	GRID ARRAY	BGA144,12X12,40	Digital Transmission Interfaces	1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B144	3	1.76 mm	13 mm	Not Qualified			245	13 mm
DS32506NW	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B484	3	2.41 mm	23 mm	Not Qualified	e0		245	23 mm
DS32508NA2	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B484		2.41 mm	23 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	23 mm
DS32508N+	Maxim Integrated	PCM TRANSCEIVER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,3.3	GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B484	3	2.41 mm	23 mm	Not Qualified	e3			23 mm

Digital Transmission Interfaces

Digital Transmission Interfaces are electronic components that enable the efficient transfer of digital signals between devices in communication systems. These interfaces are used in a wide range of applications, including computer networking, telecommunications, and consumer electronics. They provide a means of transmitting digital data over various communication channels, such as Ethernet networks, USB cables, and wireless communication protocols.

Digital Transmission Interfaces use a variety of protocols and standards to ensure the reliable and efficient transmission of data. These protocols include packet framing, which involves adding header and footer information to each data packet to enable proper routing and error detection. Error correction techniques are also used to ensure that the transmitted data is accurately received, even in the presence of noise or other transmission errors. Flow control is another important aspect of digital transmission, which helps to prevent data loss or congestion by regulating the flow of data between the transmitting and receiving devices.

There are several different types of Digital Transmission Interfaces, each designed for a specific communication channel or protocol. Ethernet is a popular interface used for wired networking, while USB is commonly used for connecting peripherals to computers and mobile devices. Bluetooth and Wi-Fi are wireless communication protocols used for short-range and long-range data transmission, respectively. Serial Interfaces, such as RS-232 and RS-485, are used for point-to-point data communication over long distances.

Digital Transmission Interfaces offer several advantages over analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems. However, Digital Transmission Interfaces also require specialized hardware and software, and may be susceptible to data loss or corruption due to transmission errors.