BALL Digital Transmission Interfaces 199

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Hybrid Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Reference Point Moisture Sensitivity Level (MSL) Maximum Seated Height Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Minimum Power Supply Rejection Ratio (PSRR) Battery Feed JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

DS21348GN

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

49

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

.1 mA

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA49,7X7,32

Digital Transmission Interfaces

.8 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B49

3

1.5 mm

7 mm

Not Qualified

e0

7 mm

DS21348GN+

Analog Devices

PCM TRANSCEIVER

INDUSTRIAL

BALL

49

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

.1 mA

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA49,7X7,32

Digital Transmission Interfaces

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B49

3

1.5 mm

7 mm

Not Qualified

e1

30

260

7 mm

82P2288BBG8

Renesas Electronics

PCM TRANSCEIVER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

1.8 V

1.8,3.3

GRID ARRAY

BGA256,16X16,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

3.5 mm

T-1(DS1)

T-1(DS1)

17 mm

Not Qualified

e1

17 mm

IDT82P2288BBG8

Renesas Electronics

PCM TRANSCEIVER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

1.8 V

1.8,3.3

GRID ARRAY

BGA256,16X16,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

3.5 mm

T-1(DS1)

T-1(DS1)

17 mm

Not Qualified

e1

17 mm

82P2284BBG8

Renesas Electronics

PCM TRANSCEIVER

INDUSTRIAL

BALL

208

BGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

1.8 V

1.8,3.3

GRID ARRAY

BGA208,16X16,40

Other Telecom ICs

T-1C(DS1C)

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B208

3

1.97 mm

T-1(DS1)

T-1(DS1)

17 mm

Not Qualified

e1

17 mm

DS21348G

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

49

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

.1 mA

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA49,7X7,32

Digital Transmission Interfaces

.8 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B49

3

1.5 mm

7 mm

Not Qualified

e0

7 mm

DS21348G+

Analog Devices

PCM TRANSCEIVER

COMMERCIAL

BALL

49

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

.1 mA

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA49,7X7,32

Digital Transmission Interfaces

.8 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B49

3

1.5 mm

7 mm

Not Qualified

e1

30

260

7 mm

IDT82P2284BBG8

Renesas Electronics

PCM TRANSCEIVER

INDUSTRIAL

BALL

208

BGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

1.8 V

1.8,3.3

GRID ARRAY

BGA208,16X16,40

Other Telecom ICs

T-1C(DS1C)

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B208

3

1.97 mm

T-1(DS1)

T-1(DS1)

17 mm

Not Qualified

e1

17 mm

FLLXT3108BE.B3

Cortina Systems

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

.00001 mA

3.3 V

3.3

GRID ARRAY

BGA256,16X16,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

Not Qualified

DS26303G-075

Analog Devices

PCM TRANSCEIVER

COMMERCIAL

BALL

160

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.478 mA

3.3 V

3.3

GRID ARRAY

BGA160(UNSPEC)

Digital Transmission Interfaces

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B160

Not Qualified

e0

DS26303G-120

Analog Devices

PCM TRANSCEIVER

COMMERCIAL

BALL

160

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.478 mA

3.3 V

3.3

GRID ARRAY

BGA160(UNSPEC)

Digital Transmission Interfaces

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B160

Not Qualified

e0

DS26303GN-120

Analog Devices

PCM TRANSCEIVER

INDUSTRIAL

BALL

160

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.478 mA

3.3 V

3.3

GRID ARRAY

BGA160(UNSPEC)

Digital Transmission Interfaces

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B160

Not Qualified

e0

DS32508+

Analog Devices

PCM TRANSCEIVER

COMMERCIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

1.8,3.3

GRID ARRAY

BGA484,22X22,40

Digital Transmission Interfaces

1 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

BOTTOM

S-PBGA-B484

2.41 mm

23 mm

Not Qualified

e3

23 mm

DS26303GN-075

Analog Devices

PCM TRANSCEIVER

INDUSTRIAL

BALL

160

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.478 mA

3.3 V

3.3

GRID ARRAY

BGA160(UNSPEC)

Digital Transmission Interfaces

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B160

Not Qualified

e0

DS21448+

Analog Devices

PCM TRANSCEIVER

COMMERCIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.4 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,50

Digital Transmission Interfaces

1.27 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

BOTTOM

S-PBGA-B144

2.22 mm

17 mm

Not Qualified

e3

17 mm

DS21448N+

Analog Devices

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.4 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,50

Digital Transmission Interfaces

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

BOTTOM

S-PBGA-B144

2.22 mm

17 mm

Not Qualified

e3

17 mm

DS21448N

Analog Devices

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.4 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,50

Digital Transmission Interfaces

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B144

2.22 mm

17 mm

Not Qualified

e0

17 mm

PEB2256EV1.2

Infineon Technologies

PCM JITTER ATTENUATOR

INDUSTRIAL

BALL

81

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

GRID ARRAY, LOW PROFILE

BGA81,9X9,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B81

3

1.5 mm

T-1(DS1)

CEPT PCM-30/E-1

10 mm

Not Qualified

220

10 mm

PEB20954E

Infineon Technologies

ISDN ECHO CANCELLER

COMMERCIAL

BALL

160

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.35 mA

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA160,14X14,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B160

1.5 mm

13 mm

Not Qualified

13 mm

PEF20954E

Infineon Technologies

ISDN ECHO CANCELLER

INDUSTRIAL

BALL

160

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.35 mA

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA160,14X14,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B160

1.5 mm

13 mm

Not Qualified

13 mm

PEF22504E

Infineon Technologies

PCM TRANSCEIVER

INDUSTRIAL

BALL

160

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B160

1.6 mm

15 mm

Not Qualified

e1

15 mm

PEF22508E

Infineon Technologies

PCM TRANSCEIVER

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

1.5 mm

17 mm

Not Qualified

17 mm

DS3253N#

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B144

1.76 mm

13 mm

NOT SPECIFIED

NOT SPECIFIED

13 mm

DS32508N

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

1.8,3.3

GRID ARRAY

BGA484,22X22,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B484

3

2.41 mm

23 mm

Not Qualified

e0

23 mm

DS32504N+

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

1.76 mm

13 mm

Not Qualified

e3

13 mm

DS3151N

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.1 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B144

3

1.76 mm

13 mm

Not Qualified

e0

13 mm

DS32503+

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

70 Cel

0 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

1.76 mm

13 mm

Not Qualified

e3

13 mm

DS3152N

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.2 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B144

3

1.76 mm

13 mm

Not Qualified

e0

13 mm

DS32503N+

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

1.76 mm

13 mm

Not Qualified

e3

13 mm

DS3253N

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.28 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B144

3

1.76 mm

13 mm

Not Qualified

245

13 mm

DS32512

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.6 mA

1.8 V

1.8,3.3

GRID ARRAY

BGA484,22X22,40

Digital Transmission Interfaces

1 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B484

3

2.41 mm

23 mm

Not Qualified

e0

245

23 mm

DS3152

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.2 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,40

Digital Transmission Interfaces

1 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B144

3

1.76 mm

13 mm

Not Qualified

e0

13 mm

DS3150GN

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

49

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.09 mA

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA49,7X7,32

Digital Transmission Interfaces

.8 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B49

1.5 mm

7 mm

Not Qualified

e0

7 mm

DS32506

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.3 mA

1.8 V

1.8,3.3

GRID ARRAY

BGA484,22X22,40

Digital Transmission Interfaces

1 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B484

3

2.41 mm

23 mm

Not Qualified

e0

23 mm

DS26334G

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.1 mA

3.3 V

3.3

GRID ARRAY

BGA256,16X16,40

Digital Transmission Interfaces

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B256

3

1.76 mm

17 mm

Not Qualified

245

17 mm

DS32512W

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B484

2.41 mm

23 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

23 mm

DS3253N+

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.28 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B144

3

1.76 mm

13 mm

Not Qualified

e1

30

260

13 mm

DS3252N+

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B144

3

1.76 mm

13 mm

Not Qualified

e1

30

260

13 mm

DS26324GN+T&R

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

3

1.7 mm

17 mm

17 mm

DS3251

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.12 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,40

Digital Transmission Interfaces

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B144

3

1.76 mm

13 mm

Not Qualified

245

13 mm

DS26334GNA2

Maxim Integrated

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1100 mA

3.3 V

3.3

GRID ARRAY

BGA256,16X16,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

Not Qualified

DS32501

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B144

1.76 mm

13 mm

Not Qualified

e0

13 mm

DS32501+

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

70 Cel

0 Cel

MATTE TIN

BOTTOM

S-PBGA-B144

1.76 mm

13 mm

Not Qualified

e3

13 mm

DS3251N

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.12 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B144

3

1.76 mm

13 mm

Not Qualified

245

13 mm

DS32506+

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.3 mA

1.8 V

1.8,3.3

GRID ARRAY

BGA484,22X22,40

Digital Transmission Interfaces

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B484

3

2.41 mm

23 mm

Not Qualified

e1

30

260

23 mm

DS32506W

Maxim Integrated

PCM TRANSCEIVER

COMMERCIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B484

3

2.41 mm

23 mm

Not Qualified

e0

245

23 mm

DS3154N

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.4 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B144

3

1.76 mm

13 mm

Not Qualified

e0

13 mm

DS3151N+

Maxim Integrated

PCM TRANSCEIVER

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B144

3

1.76 mm

13 mm

Not Qualified

e1

13 mm

Digital Transmission Interfaces

Digital Transmission Interfaces are electronic components that enable the efficient transfer of digital signals between devices in communication systems. These interfaces are used in a wide range of applications, including computer networking, telecommunications, and consumer electronics. They provide a means of transmitting digital data over various communication channels, such as Ethernet networks, USB cables, and wireless communication protocols.

Digital Transmission Interfaces use a variety of protocols and standards to ensure the reliable and efficient transmission of data. These protocols include packet framing, which involves adding header and footer information to each data packet to enable proper routing and error detection. Error correction techniques are also used to ensure that the transmitted data is accurately received, even in the presence of noise or other transmission errors. Flow control is another important aspect of digital transmission, which helps to prevent data loss or congestion by regulating the flow of data between the transmitting and receiving devices.

There are several different types of Digital Transmission Interfaces, each designed for a specific communication channel or protocol. Ethernet is a popular interface used for wired networking, while USB is commonly used for connecting peripherals to computers and mobile devices. Bluetooth and Wi-Fi are wireless communication protocols used for short-range and long-range data transmission, respectively. Serial Interfaces, such as RS-232 and RS-485, are used for point-to-point data communication over long distances.

Digital Transmission Interfaces offer several advantages over analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems. However, Digital Transmission Interfaces also require specialized hardware and software, and may be susceptible to data loss or corruption due to transmission errors.