STMicroelectronics Digital Transmission Interfaces 26
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Minimum Power Supply Rejection Ratio (PSRR) | Battery Feed | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
.09 mA |
6 V |
2-4 CONVERSION |
4.5/12 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Analog Transmission Interfaces |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
26 dB |
CONSTANT CURRENT |
e4 |
10 mm |
||||||||||||||||
|
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
5 |
BASIC |
CHIP CARRIER |
LDCC44,.7SQ |
Digital Transmission Interfaces |
1.27 mm |
85 Cel |
2.4 V |
.4 V |
ANSI T1.601 |
-40 Cel |
TIN LEAD |
QUAD |
.16 Mbps |
S-PQCC-J44 |
U |
4.57 mm |
16.5862 mm |
Not Qualified |
7 Amp |
e0 |
16.5862 mm |
|||||||||||||
|
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
.14 mA |
6 V |
2-4 CONVERSION |
5.5/14.5 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Analog Transmission Interfaces |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
26 dB |
CONSTANT CURRENT |
e4 |
10 mm |
||||||||||||||||
|
STMicroelectronics |
DIGITAL SLIC |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
5 |
BASIC |
IN-LINE |
DIP28,.6 |
Digital Transmission Interfaces |
2.54 mm |
4 V |
.4 V |
CCITT V.29 |
TIN LEAD |
DUAL |
.144 Mbps |
R-PDIP-T28 |
U |
15.24 mm |
Not Qualified |
.7 Amp |
e0 |
36.83 mm |
||||||||||||||||||
|
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
5 V |
5 |
BASIC |
IN-LINE |
DIP28,.6 |
Digital Transmission Interfaces |
2.54 mm |
70 Cel |
2.4 V |
.4 V |
ANSI T1.601 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
.16 Mbps |
R-XDIP-T28 |
U |
Not Qualified |
7 Amp |
e0 |
|||||||||||||||||||
|
STMicroelectronics |
DIGITAL SLIC |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
5 |
BASIC |
IN-LINE |
DIP28,.6 |
Digital Transmission Interfaces |
2.54 mm |
70 Cel |
2.4 V |
.4 V |
ANSI T1.601 |
0 Cel |
TIN LEAD |
DUAL |
.16 Mbps |
R-PDIP-T28 |
U |
15.24 mm |
Not Qualified |
7 Amp |
e0 |
36.83 mm |
|||||||||||||||
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
.09 mA |
6 V |
2-4 CONVERSION |
4.5/12 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Analog Transmission Interfaces |
.8 mm |
85 Cel |
-64 |
-40 Cel |
QUAD |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
26 dB |
CONSTANT CURRENT |
10 mm |
||||||||||||||||||
|
STMicroelectronics |
OTHER |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
16 V |
16 |
IN-LINE |
DIP8,.3 |
Digital Transmission Interfaces |
2.54 mm |
65 Cel |
-25 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T8 |
Not Qualified |
e0 |
||||||||||||||||||||||||||
|
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
2.5,3.3,5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
24 Mbps |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
e4 |
14 mm |
|||||||||||||||||||
|
STMicroelectronics |
ISDN LOOP EXTENDER CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
5 |
BASIC |
IN-LINE |
DIP20,.3 |
Digital Transmission Interfaces |
2.54 mm |
70 Cel |
2.4 V |
.4 V |
CCITT I.430 |
0 Cel |
TIN LEAD |
DUAL |
.192 Mbps |
R-PDIP-T20 |
S/T |
3.93 mm |
7.62 mm |
Not Qualified |
3.2 Amp |
e0 |
|||||||||||||||
|
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
.14 mA |
6 V |
2-4 CONVERSION |
5.5/14.5 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Analog Transmission Interfaces |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
26 dB |
CONSTANT CURRENT |
e0 |
10 mm |
||||||||||||||||
|
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
.09 mA |
6 V |
2-4 CONVERSION |
4.5/12 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Analog Transmission Interfaces |
.8 mm |
85 Cel |
-74 |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G44 |
3 |
1.6 mm |
10 mm |
Not Qualified |
26 dB |
CONSTANT CURRENT |
e3 |
30 |
260 |
10 mm |
||||||||||||
|
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
.14 mA |
6 V |
2-4 CONVERSION |
5.5/14.5 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Analog Transmission Interfaces |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
26 dB |
CONSTANT CURRENT |
e4 |
10 mm |
||||||||||||||||
|
STMicroelectronics |
DIGITAL SLIC |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
5 |
BASIC |
CHIP CARRIER |
LDCC28,.5SQ |
Digital Transmission Interfaces |
1.27 mm |
4 V |
.4 V |
CCITT V.29 |
TIN LEAD |
QUAD |
.144 Mbps |
S-PQCC-J28 |
U |
4.57 mm |
11.5062 mm |
Not Qualified |
.7 Amp |
e0 |
11.5062 mm |
|||||||||||||||||
|
STMicroelectronics |
DIGITAL SLIC |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
5 |
BASIC |
CHIP CARRIER |
LDCC44,.7SQ |
Digital Transmission Interfaces |
1.27 mm |
70 Cel |
2.4 V |
.4 V |
ANSI T1.601 |
0 Cel |
TIN LEAD |
QUAD |
.16 Mbps |
S-PQCC-J44 |
U |
4.57 mm |
16.5862 mm |
Not Qualified |
7 Amp |
e0 |
16.5862 mm |
||||||||||||||
|
STMicroelectronics |
ISDN LOOP EXTENDER CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
5 |
BASIC |
CHIP CARRIER |
LDCC28,.5SQ |
Digital Transmission Interfaces |
1.27 mm |
70 Cel |
2.4 V |
.4 V |
CCITT I.430 |
0 Cel |
TIN LEAD |
QUAD |
.192 Mbps |
S-PQCC-J28 |
S/T |
4.57 mm |
11.5062 mm |
Not Qualified |
3.2 Amp |
e0 |
11.5062 mm |
||||||||||||||
|
STMicroelectronics |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
5 V |
5 |
BASIC |
IN-LINE |
DIP28,.6 |
Digital Transmission Interfaces |
2.54 mm |
4 V |
.4 V |
CCITT V.29 |
Tin/Lead (Sn/Pb) |
DUAL |
.144 Mbps |
R-XDIP-T28 |
U |
Not Qualified |
.7 Amp |
e0 |
||||||||||||||||||||||
|
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
.09 mA |
6 V |
2-4 CONVERSION |
5.5/12 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Analog Transmission Interfaces |
.8 mm |
85 Cel |
-74 |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G44 |
3 |
1.6 mm |
10 mm |
Not Qualified |
26 dB |
CONSTANT CURRENT |
e3 |
30 |
260 |
10 mm |
||||||||||||
|
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
.09 mA |
6 V |
2-4 CONVERSION |
5.5/12 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Analog Transmission Interfaces |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
26 dB |
CONSTANT CURRENT |
e4 |
10 mm |
||||||||||||||||
|
STMicroelectronics |
DIGITAL SLIC |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
5 |
BASIC |
IN-LINE |
DIP20,.3 |
Digital Transmission Interfaces |
2.54 mm |
70 Cel |
2.4 V |
.4 V |
CCITT I.430 |
0 Cel |
TIN LEAD |
DUAL |
.192 Mbps |
R-PDIP-T20 |
S/T |
3.93 mm |
7.62 mm |
Not Qualified |
1 Amp |
e0 |
25.15 mm |
||||||||||||||
|
STMicroelectronics |
DIGITAL SLIC |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
5 |
BASIC |
IN-LINE |
DIP20,.3 |
Digital Transmission Interfaces |
2.54 mm |
70 Cel |
2.4 V |
.4 V |
CCITT I.430 |
0 Cel |
TIN LEAD |
DUAL |
.192 Mbps |
R-PDIP-T20 |
S/T |
3.93 mm |
7.62 mm |
Not Qualified |
3.2 Amp |
e0 |
25.15 mm |
||||||||||||||
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
5 |
BASIC |
IN-LINE |
DIP28,.6 |
Digital Transmission Interfaces |
2.54 mm |
85 Cel |
2.4 V |
.4 V |
ANSI T1.601 |
-40 Cel |
TIN LEAD |
DUAL |
.16 Mbps |
R-PDIP-T28 |
U |
15.24 mm |
Not Qualified |
7 Amp |
e0 |
36.83 mm |
|||||||||||||||
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
Not Qualified |
16.5862 mm |
||||||||||||||||||||||||||
|
STMicroelectronics |
DIGITAL SLIC |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
5 V |
5 |
BASIC |
IN-LINE |
DIP28,.6 |
Digital Transmission Interfaces |
2.54 mm |
70 Cel |
2.4 V |
.4 V |
ANSI T1.601 |
0 Cel |
TIN LEAD |
DUAL |
.144 Mbps |
R-GDIP-T28 |
U |
5.71 mm |
15.24 mm |
Not Qualified |
1 Amp |
e0 |
|||||||||||||||
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
.09 mA |
6 V |
2-4 CONVERSION |
4.5/12 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Analog Transmission Interfaces |
.8 mm |
85 Cel |
-64 |
-40 Cel |
QUAD |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
26 dB |
CONSTANT CURRENT |
10 mm |
||||||||||||||||||
|
|
STMicroelectronics |
DIGITAL SLIC |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
.14 mA |
6 V |
2-4 CONVERSION |
5.5/14.5 |
FLATPACK, LOW PROFILE |
QFP44,.47SQ,32 |
Analog Transmission Interfaces |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
26 dB |
CONSTANT CURRENT |
e0 |
10 mm |
Digital Transmission Interfaces are electronic components that enable the efficient transfer of digital signals between devices in communication systems. These interfaces are used in a wide range of applications, including computer networking, telecommunications, and consumer electronics. They provide a means of transmitting digital data over various communication channels, such as Ethernet networks, USB cables, and wireless communication protocols.
Digital Transmission Interfaces use a variety of protocols and standards to ensure the reliable and efficient transmission of data. These protocols include packet framing, which involves adding header and footer information to each data packet to enable proper routing and error detection. Error correction techniques are also used to ensure that the transmitted data is accurately received, even in the presence of noise or other transmission errors. Flow control is another important aspect of digital transmission, which helps to prevent data loss or congestion by regulating the flow of data between the transmitting and receiving devices.
There are several different types of Digital Transmission Interfaces, each designed for a specific communication channel or protocol. Ethernet is a popular interface used for wired networking, while USB is commonly used for connecting peripherals to computers and mobile devices. Bluetooth and Wi-Fi are wireless communication protocols used for short-range and long-range data transmission, respectively. Serial Interfaces, such as RS-232 and RS-485, are used for point-to-point data communication over long distances.
Digital Transmission Interfaces offer several advantages over analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems. However, Digital Transmission Interfaces also require specialized hardware and software, and may be susceptible to data loss or corruption due to transmission errors.