QCCJ Digital Transmission Support 5

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Manufacturers
    • Maxim Integrated
    • Microchip Technology
Telecom IC Type
    • ELASTIC BUFFER
Temperature Grade
    • COMMERCIAL
    • INDUSTRIAL
Terminal Form
    • BALL
    • GULL WING
    • J BEND
    • THROUGH-HOLE
No. of Terminals
    • 16
    • 24
    • 28
    • 64
Package Code (1)
    • QCCJ
    • BGA
    • DIP
    • SOP
Package Shape
    • RECTANGULAR
    • SQUARE
Package Body Material
    • PLASTIC/EPOXY
Surface Mount
    • NO
    • YES
No. of Functions
    • 1
Technology
    • CMOS
Maximum Supply Current
    • .01 mA
    • .016 mA
    • 153 mA
Nominal Supply Voltage
    • 1.8 V
    • 5 V
Power Supplies (V)
    • 1.8,3.3
    • 5
Package Style (Meter)
    • CHIP CARRIER
    • GRID ARRAY
    • IN-LINE
    • SMALL OUTLINE
Package Equivalence Code
    • BGA64,8X8,40
    • DIP16,.3
    • DIP24,.3
    • LDCC28,.5SQ
    • SOP16,.4
Sub-Category
    • Digital Transmission Interfaces
    • Other Telecom ICs
Terminal Pitch
    • 1 mm
    • 1.27 mm
    • 2.54 mm
Maximum Operating Temperature
    • 70 Cel
    • 85 Cel
Minimum Operating Temperature
    • -40 Cel
    • 0 Cel
Terminal Finish
    • MATTE TIN
    • TIN LEAD
    • TIN SILVER COPPER
Terminal Position
    • BOTTOM
    • DUAL
    • QUAD
Data Rate
    • 2.048 Mbps
JESD-30 Code
    • R-PDIP-T16
    • R-PDIP-T24
    • R-PDSO-G16
    • S-PBGA-B64
    • S-PQCC-J28
Moisture Sensitivity Level (MSL)
    • 1
    • 3
Maximum Seated Height
    • 1.72 mm
    • 2.65 mm
    • 4.57 mm
    • 4.572 mm
Carrier Type-2
    • T-1(DS1)
Carrier Type-1
    • CEPT PCM-30/E-1
Width
    • 11.505 mm
    • 11.5062 mm
    • 7.5 mm
    • 7.62 mm
    • 9 mm
Qualification
    • Not Qualified
Additional Features
    • ALSO REQUIRED 3.3V SUPPLY
JESD-609 Code
    • e0
    • e1
    • e3
Maximum Time At Peak Reflow Temperature (s)
    • 30
Peak Reflow Temperature (C)
    • 245
    • 260
Length
    • 10.3 mm
    • 11.505 mm
    • 11.5062 mm
    • 19.175 mm
    • 30.545 mm
    • 9 mm
Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Carrier Type-2 Carrier Type-1 Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

DS2176QN/T&R

Maxim Integrated

ELASTIC BUFFER

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.01 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

2.048 Mbps

S-PQCC-J28

1

4.57 mm

T-1(DS1)

CEPT PCM-30/E-1

11.505 mm

Not Qualified

e0

11.505 mm

DS2176Q/T&R

Maxim Integrated

ELASTIC BUFFER

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.01 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

70 Cel

0 Cel

TIN LEAD

QUAD

2.048 Mbps

S-PQCC-J28

1

4.57 mm

T-1(DS1)

CEPT PCM-30/E-1

11.505 mm

Not Qualified

e0

11.505 mm

DS2176QN

Maxim Integrated

ELASTIC BUFFER

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.01 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

2.048 Mbps

S-PQCC-J28

1

4.57 mm

T-1(DS1)

CEPT PCM-30/E-1

11.505 mm

Not Qualified

e0

11.505 mm

DS2176Q+

Maxim Integrated

ELASTIC BUFFER

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER

1.27 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-J28

1

4.57 mm

11.5062 mm

Not Qualified

e3

245

11.5062 mm

DS2176Q

Maxim Integrated

ELASTIC BUFFER

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.01 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

70 Cel

0 Cel

TIN LEAD

QUAD

2.048 Mbps

S-PQCC-J28

1

4.57 mm

T-1(DS1)

CEPT PCM-30/E-1

11.505 mm

Not Qualified

e0

11.505 mm
Digital Transmission Support

Digital Transmission Support refers to the various tools and technologies used to ensure the efficient and reliable transmission of digital signals over communication networks. These tools and technologies are designed to address issues such as signal interference, transmission errors, and network congestion, which can degrade the quality and speed of digital transmission.

One important aspect of Digital Transmission Support is the use of error detection and correction techniques. These techniques involve adding redundancy to the transmitted data, allowing the receiver to detect and correct any errors that may occur during transmission. Error detection and correction techniques are commonly used in communication protocols such as TCP/IP and Ethernet, and can help to ensure reliable data transmission even in the presence of noise or other transmission errors.

Another important aspect of Digital Transmission Support is the use of network congestion control techniques. These techniques are designed to prevent network congestion, which can occur when too many data packets are transmitted simultaneously, leading to delays and dropped packets. Network congestion control techniques include methods such as packet queuing, traffic shaping, and flow control, which help to regulate the flow of data over the network and prevent congestion.

Digital Transmission Support also includes technologies such as encryption and compression, which are used to protect data privacy and reduce transmission bandwidth. Encryption involves encoding data in such a way that it can only be decoded by authorized parties, while compression involves reducing the size of data by removing redundant or unnecessary information.