Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Fax Rate | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
MODEM |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
.000285 mA |
3/3.3 |
CHIP CARRIER |
LCC20,.20SQ,25 |
Modems |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N20 |
1 |
Not Qualified |
e3 |
||||||||||||||
|
Analog Devices |
MODEM |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.000285 mA |
3/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.20SQ,25 |
Modems |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.0012 Mbps |
S-XQCC-N20 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||
|
Digi International |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
20 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
.375 Mbps |
R-XXMA-T20 |
POWER REQUIREMENTS AVAILABLE AT 3.3VDC INPUT POWER |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||
Nimbus Technology |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
20 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
.375 Mbps |
R-XDMA-T20 |
6.858 mm |
28.95 mm |
TRANSMITTING DATE RATE IS 300KBITPS |
33.88 mm |
||||||||||||||||||
NXP Semiconductors |
MODEM |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
12.8 mm |
||||||||||||||||
National Semiconductor |
MODEM |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
10 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
.0003 Mbps |
R-PDSO-G20 |
2.6 mm |
7.5 mm |
Not Qualified |
FULL DUPLEX |
e0 |
12.8 mm |
||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
-5 V |
5 V |
+-5 |
SMALL OUTLINE |
SOP20,.4 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
e0 |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Modems |
2.54 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T20 |
Not Qualified |
e0 |
|||||||||||||||
NXP Semiconductors |
MODEM-DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
50 mA |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T20 |
4.2 mm |
7.62 mm |
Not Qualified |
HALF DUPLEX; FULL DUPLEX |
26.73 mm |
|||||||||||||||
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
.3 Mbps |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
12.8 mm |
||||||||||||||||
NXP Semiconductors |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
12 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
.3 Mbps |
R-PDIP-T20 |
4.2 mm |
7.62 mm |
Not Qualified |
26.73 mm |
||||||||||||||||
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.3 Mbps |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
12.8 mm |
||||||||||||||
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Modems |
1.27 mm |
70 Cel |
-20 Cel |
TIN LEAD |
DUAL |
.0003 Mbps |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
SIMPLEX; HALF DUPLEX; FULL DUPLEX |
e0 |
12.8 mm |
|||||||||
NXP Semiconductors |
MODEM |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
10 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
.0003 Mbps |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
12.8 mm |
|||||||||
NXP Semiconductors |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Modems |
2.54 mm |
70 Cel |
-20 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
|||||||||||||||||
NXP Semiconductors |
MODEM |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.01 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
.0003 Mbps |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
12.8 mm |
|||||||||
NXP Semiconductors |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0003 Mbps |
R-PDIP-T20 |
4.57 mm |
7.62 mm |
Not Qualified |
26.415 mm |
|||||||||||||||
NXP Semiconductors |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
10 mA |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Modems |
2.54 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
.0003 Mbps |
R-PDIP-T20 |
4.57 mm |
7.62 mm |
Not Qualified |
e0 |
26.415 mm |
A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.
Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.
Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.
There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.
Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.