24 Modems 27

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Fax Rate Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

AD5700-1ACPZ-RL7

Analog Devices

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N24

3

.8 mm

4 mm

30

260

4 mm

AD5700-1BCPZ-R5

Analog Devices

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

.8 mm

4 mm

e3

30

260

4 mm

AD5700-1BCPZ-RL7

Analog Devices

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N24

3

.8 mm

4 mm

30

260

4 mm

AD5700BCPZ-R5

Analog Devices

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

.8 mm

4 mm

e3

260

4 mm

AD5700ACPZ-RL7

Analog Devices

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N24

3

.8 mm

4 mm

30

260

4 mm

AD5700BCPZ-RL7

Analog Devices

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N24

3

.8 mm

4 mm

30

260

4 mm

DAC8741HRGET

Texas Instruments

PROGRAMMABLE MODEM

MILITARY

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.03125 Mbps

S-PQCC-N24

2

1 mm

4 mm

DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF

e4

30

260

4 mm

DAC8741HRGER

Texas Instruments

PROGRAMMABLE MODEM

MILITARY

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.03125 Mbps

S-PQCC-N24

2

1 mm

4 mm

e4

30

260

4 mm

DAC8740HRGET

Texas Instruments

PROGRAMMABLE MODEM

MILITARY

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.15SQ,20

.5 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.03125 Mbps

S-PQCC-N24

2

1 mm

4 mm

DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF

e4

NOT SPECIFIED

260

4 mm

MSM7510GS-K

Lapis Semiconductor

MODEM

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

10 mA

3/5

SMALL OUTLINE

SOP24,.45

Modems

1.27 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G24

Not Qualified

e0

DAC8740HRGER

Texas Instruments

PROGRAMMABLE MODEM

MILITARY

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.15SQ,20

.5 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.03125 Mbps

S-PQCC-N24

2

1 mm

4 mm

DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF

e4

NOT SPECIFIED

260

4 mm

CMX909BD5

Cml Microcircuits

MODEM

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Modems

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

.0384 Mbps

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

e3

40

260

8.2 mm

SI2456-FT

Silicon Labs

MODEM

COMMERCIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

.056 Mbps

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

e3

7.8 mm

SI2433-KT

Silicon Labs

MODEM

COMMERCIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

DUAL

.0336 Mbps

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7.8 mm

TCM3105DW

Texas Instruments

MODEM

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

5 V

5

SMALL OUTLINE

SOP24,.4

Modems

1.27 mm

DUAL

R-PDSO-G24

Not Qualified

TCM3105DWLR

Texas Instruments

MODEM

COMMERCIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

12 mA

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

FULL DUPLEX

15.4 mm

TCM3105DWE

Texas Instruments

MODEM

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

16 mA

5 V

5

SMALL OUTLINE

SOP24,.4

Modems

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

FULL DUPLEX

NOT SPECIFIED

NOT SPECIFIED

15.4 mm

TCM3105DWER

Texas Instruments

MODEM

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

16 mA

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

FULL DUPLEX

15.4 mm

TCM3105DWL

Texas Instruments

MODEM

COMMERCIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

12 mA

5 V

5

SMALL OUTLINE

SOP24,.4

Modems

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

FULL DUPLEX

NOT SPECIFIED

NOT SPECIFIED

15.4 mm

LTC5585IUF#TRPBF

Analog Devices

MODEM-DEMODULATOR

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N24

1

.8 mm

4 mm

e3

30

260

4 mm

LTC5585IUF#PBF

Analog Devices

MODEM-DEMODULATOR

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N24

1

.8 mm

4 mm

e3

30

260

4 mm

11564-502-XTD

Onsemi

MODEM-DEMODULATOR

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3/5

SMALL OUTLINE

SOP24,.4

Other Telecom ICs

1.27 mm

TIN LEAD

DUAL

R-PDSO-G24

Not Qualified

e0

SX061S

Onsemi

MODEM-DEMODULATOR

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

1.27 mm

DUAL

1 Mbps

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

15.4 mm

11564-502-XTP

Onsemi

MODEM-DEMODULATOR

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3/5

SMALL OUTLINE

SOP24,.4

Other Telecom ICs

1.27 mm

TIN LEAD

DUAL

R-PDSO-G24

Not Qualified

e0

TS7514CP

STMicroelectronics

PROGRAMMABLE MODEM

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

-5 V

.03 mA

5 V

+-5

IN-LINE

DIP24,.6

Modems

2.54 mm

70 Cel

0 Cel

MATTE TIN

DUAL

.0012 Mbps

R-PDIP-T24

15.24 mm

Not Qualified

e3

TS68950CP

STMicroelectronics

MODEM-SUPPORT CIRCUIT

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

-5 V

.03 mA

5 V

+-5

IN-LINE

DIP24,.6

Modems

2.54 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDIP-T24

15.24 mm

Not Qualified

e0

DM207DAA

Infineon Technologies

MODEM-SUPPORT CIRCUIT

COMMERCIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

V.32, V.34 AND V.90 COMPATIBILITY

7.8 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.