Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Fax Rate | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
260 |
4 mm |
|||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF |
e4 |
30 |
260 |
4 mm |
|||||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
||||||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.15SQ,20 |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF |
e4 |
NOT SPECIFIED |
260 |
4 mm |
||||||||||
Lapis Semiconductor |
MODEM |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
10 mA |
3/5 |
SMALL OUTLINE |
SOP24,.45 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
e0 |
||||||||||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.15SQ,20 |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF |
e4 |
NOT SPECIFIED |
260 |
4 mm |
||||||||||
|
Cml Microcircuits |
MODEM |
INDUSTRIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
3.3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
Modems |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
.0384 Mbps |
R-PDSO-G24 |
2 mm |
5.3 mm |
Not Qualified |
e3 |
40 |
260 |
8.2 mm |
||||||||
|
Silicon Labs |
MODEM |
COMMERCIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
.056 Mbps |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
7.8 mm |
|||||||||||||
Silicon Labs |
MODEM |
COMMERCIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
DUAL |
.0336 Mbps |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7.8 mm |
||||||||||||||
Texas Instruments |
MODEM |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
5 V |
5 |
SMALL OUTLINE |
SOP24,.4 |
Modems |
1.27 mm |
DUAL |
R-PDSO-G24 |
Not Qualified |
||||||||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
FULL DUPLEX |
15.4 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
16 mA |
5 V |
5 |
SMALL OUTLINE |
SOP24,.4 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
15.4 mm |
|||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
16 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
FULL DUPLEX |
15.4 mm |
|||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
12 mA |
5 V |
5 |
SMALL OUTLINE |
SOP24,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
15.4 mm |
|||||||||
|
Analog Devices |
MODEM-DEMODULATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N24 |
1 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
|||||||||||
|
Analog Devices |
MODEM-DEMODULATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N24 |
1 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
|||||||||||
Onsemi |
MODEM-DEMODULATOR |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3/5 |
SMALL OUTLINE |
SOP24,.4 |
Other Telecom ICs |
1.27 mm |
TIN LEAD |
DUAL |
R-PDSO-G24 |
Not Qualified |
e0 |
||||||||||||||||||
Onsemi |
MODEM-DEMODULATOR |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
1.27 mm |
DUAL |
1 Mbps |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
15.4 mm |
||||||||||||||||||||
Onsemi |
MODEM-DEMODULATOR |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3/5 |
SMALL OUTLINE |
SOP24,.4 |
Other Telecom ICs |
1.27 mm |
TIN LEAD |
DUAL |
R-PDSO-G24 |
Not Qualified |
e0 |
||||||||||||||||||
|
STMicroelectronics |
PROGRAMMABLE MODEM |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
-5 V |
.03 mA |
5 V |
+-5 |
IN-LINE |
DIP24,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
.0012 Mbps |
R-PDIP-T24 |
15.24 mm |
Not Qualified |
e3 |
|||||||||
STMicroelectronics |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
-5 V |
.03 mA |
5 V |
+-5 |
IN-LINE |
DIP24,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T24 |
15.24 mm |
Not Qualified |
e0 |
|||||||||||
Infineon Technologies |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
V.32, V.34 AND V.90 COMPATIBILITY |
7.8 mm |
A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.
Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.
Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.
There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.
Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.