32 Modems 51

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Fax Rate Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

A5191HRTLG-XTD

Onsemi

MODEM

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.0006 mA

3.3 V

3.3/5

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

Modems

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.0012 Mbps

S-PQFP-G32

3

1.6 mm

7 mm

Not Qualified

e3

30

260

7 mm

A5191HRTLG-XTP

Onsemi

MODEM

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.0006 mA

3.3 V

3.3/5

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

Modems

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.0012 Mbps

S-PQFP-G32

3

1.6 mm

7 mm

Not Qualified

e3

30

260

7 mm

A5191HRTNG-XTP

Onsemi

MODEM

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0006 mA

3.3 V

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Modems

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.0012 Mbps

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

NCN5192MNRG

Onsemi

MODEM

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0006 mA

3.3 V

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Modems

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

73M2901CE-IGV/F

Analog Devices

MODEM

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

15.5 mA

3/3.3

FLATPACK

TQFP32,.35SQ,32

Modems

.8 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G32

Not Qualified

20437-11

Synaptics

MODEM-DATA/FAX/VOICE

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

2 mA

3.3 V

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

.8 mm

70 Cel

14.4 kbps

0 Cel

QUAD

.056 Mbps

S-PQFP-G32

1.6 mm

7 mm

7 mm

DAC8742HPBSR

Texas Instruments

PROGRAMMABLE MODEM

MILITARY

GULL WING

32

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

.5 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

QUAD

.03125 Mbps

S-PQFP-G32

3

1.2 mm

5 mm

e4

30

260

5 mm

DAC8742HPBS

Texas Instruments

PROGRAMMABLE MODEM

MILITARY

GULL WING

32

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

.5 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

QUAD

.03125 Mbps

S-PQFP-G32

3

1.2 mm

5 mm

e4

30

260

5 mm

73K224L-32IH

Texas Instruments

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

.0024 Mbps

R-PQCC-J32

3.56 mm

11.455 mm

Not Qualified

FULL DUPLEX

13.995 mm

73K312L-32IH

Texas Instruments

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

.0012 Mbps

R-PQCC-J32

3.56 mm

11.455 mm

Not Qualified

FULL DUPLEX

13.995 mm

73K324L-32IH

Texas Instruments

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

.0024 Mbps

R-PQCC-J32

3.56 mm

11.455 mm

Not Qualified

FULL DUPLEX

13.995 mm

AD9970

Analog Devices

MODEM-SUPPORT CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

85 Cel

-25 Cel

QUAD

S-XQCC-N32

73M2901C/5V-32IH

Analog Devices

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

62 mA

5 V

5

CHIP CARRIER

LDCC32,.5X.6

Modems

1.27 mm

85 Cel

-40 Cel

QUAD

R-PQCC-J32

Not Qualified

73M2901-32IH/5

Analog Devices

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

.0024 Mbps

R-PQCC-J32

3.55 mm

11.43 mm

Not Qualified

13.97 mm

73M2901CL-IH

Analog Devices

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

.0024 Mbps

R-PQCC-J32

3.56 mm

11.455 mm

Not Qualified

13.995 mm

73M2901CL-IGV

Analog Devices

MODEM

INDUSTRIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, THIN PROFILE

.8 mm

85 Cel

-40 Cel

QUAD

.0024 Mbps

S-PQFP-G32

1.2 mm

7 mm

Not Qualified

7 mm

73K324BL-IH

Analog Devices

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

.0024 Mbps

R-PQCC-J32

3.55 mm

11.43 mm

Not Qualified

DATA RATE MIN:300BPS

13.97 mm

73K222BL-IH

Analog Devices

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

12 mA

5 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

.0012 Mbps

R-PQCC-J32

3.55 mm

11.43 mm

Not Qualified

FULL DUPLEX

13.97 mm

73M2901CE-IM

Analog Devices

MODEM

INDUSTRIAL

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

15.5 mA

3/3.3

CHIP CARRIER

LCC32,.2SQ,20

Modems

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N32

Not Qualified

73M2901CE-IGV

Analog Devices

MODEM

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

15.5 mA

3/3.3

FLATPACK

TQFP32,.35SQ,32

Modems

.8 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G32

Not Qualified

73K224BL-IH

Analog Devices

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

.0024 Mbps

R-PQCC-J32

3.56 mm

11.455 mm

Not Qualified

DATA RATE MIN:300BPS

13.995 mm

73K222BL-IHR

Analog Devices

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

.0012 Mbps

R-PQCC-J32

3.56 mm

11.455 mm

Not Qualified

FULL DUPLEX

13.995 mm

73M2901CE-IGVR/F

Analog Devices

MODEM

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

15.5 mA

3/3.3

FLATPACK

TQFP32,.35SQ,32

Modems

.8 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G32

Not Qualified

12197-507-XTP

Onsemi

MODEM

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

QUAD

.0012 Mbps

S-PQFP-G32

1.6 mm

7 mm

Not Qualified

e3/e4

40

260

7 mm

12197-503

Onsemi

MODEM

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

QUAD

.0012 Mbps

S-PQFP-G32

1.6 mm

7 mm

Not Qualified

7 mm

12197-507-XTD

Onsemi

MODEM

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

QUAD

.0012 Mbps

S-PQFP-G32

1.6 mm

7 mm

Not Qualified

7 mm

11564-504-XTP

Onsemi

MODEM-DEMODULATOR

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3/5

FLATPACK

QFP32,.35SQ,32

Other Telecom ICs

.8 mm

TIN

QUAD

S-PQFP-G32

3

Not Qualified

e3

260

12197-503-XTP

Onsemi

MODEM

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

.0012 Mbps

S-PQFP-G32

1.6 mm

7 mm

Not Qualified

e0

7 mm

11564-503-XTP

Onsemi

MODEM-DEMODULATOR

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3/5

FLATPACK

QFP32,.35SQ,32

Other Telecom ICs

.8 mm

TIN LEAD

QUAD

S-PQFP-G32

Not Qualified

e0

11564-503-XTD

Onsemi

MODEM-DEMODULATOR

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3/5

FLATPACK

QFP32,.35SQ,32

Other Telecom ICs

.8 mm

TIN LEAD

QUAD

S-PQFP-G32

Not Qualified

e0

11564-504-XTD

Onsemi

MODEM-DEMODULATOR

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3/5

FLATPACK

QFP32,.35SQ,32

Other Telecom ICs

.8 mm

TIN

QUAD

S-PQFP-G32

3

Not Qualified

e3

260

A5191HRTL-XTP

Onsemi

MODEM

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

.6 mA

3.3/5

FLATPACK

QFP32,.35SQ,32

Modems

.8 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G32

Not Qualified

A5191HRTNG-XTD

Onsemi

MODEM

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

.0012 Mbps

S-XQCC-N32

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

A5191HRTL

Onsemi

MODEM

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

.0012 Mbps

S-PQFP-G32

1.6 mm

7 mm

Not Qualified

e0

7 mm

A5191HRTLG

Onsemi

MODEM

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

TIN

QUAD

.0012 Mbps

S-PQFP-G32

3

1.6 mm

7 mm

Not Qualified

e3

7 mm

NCN5192MNG

Onsemi

MODEM

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

5 mm

A5191HRTL-XTD

Onsemi

MODEM

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

.6 mA

3.3/5

FLATPACK

QFP32,.35SQ,32

Modems

.8 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G32

Not Qualified

TDA8263HN/C1,518

NXP Semiconductors

MODEM-DEMODULATOR

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e4

5 mm

TDA8262HN

NXP Semiconductors

MODEM-DEMODULATOR

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-20 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

Not Qualified

5 mm

TDA8262HN/C1,118

NXP Semiconductors

MODEM-DEMODULATOR

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e4

5 mm

TDA8263HN

NXP Semiconductors

MODEM-DEMODULATOR

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

Not Qualified

5 mm

73M2901CE-IM/F

Maxim Integrated

MODEM

INDUSTRIAL

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

15.5 mA

3/3.3

CHIP CARRIER

LCC32,.2SQ,20

Modems

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N32

3

Not Qualified

30

260

73K222BL-IH/F

Maxim Integrated

MODEM

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

12 mA

5 V

CHIP CARRIER

LDCC32,.5X.6

1.27 mm

85 Cel

-40 Cel

QUAD

.0012 Mbps

R-PQCC-J32

3.56 mm

11.455 mm

13.995 mm

73K222BL-IHR/F

Maxim Integrated

MODEM

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

12 mA

5 V

CHIP CARRIER

LDCC32,.5X.6

1.27 mm

85 Cel

-40 Cel

QUAD

.0012 Mbps

R-PQCC-J32

3.56 mm

11.455 mm

13.995 mm

73M2901CE-IMR/F

Maxim Integrated

MODEM

INDUSTRIAL

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

15.5 mA

3/3.3

CHIP CARRIER

LCC32,.2SQ,20

Modems

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N32

3

Not Qualified

30

260

73K324BL-IHR/F

Maxim Integrated

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

.0024 Mbps

R-PQCC-J32

3.56 mm

11.455 mm

Not Qualified

14 mm

73M2901CL-IGV/F

Maxim Integrated

MODEM

INDUSTRIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, THIN PROFILE

.8 mm

85 Cel

-40 Cel

QUAD

.0024 Mbps

S-PQFP-G32

1.2 mm

7 mm

Not Qualified

7 mm

73K224BL-IHR/F

Maxim Integrated

MODEM

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

.0024 Mbps

R-PQCC-J32

3.56 mm

11.455 mm

Not Qualified

13.995 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.