LFQFP Modems 29

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Fax Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TRF3520PT	Texas Instruments	MODEM-MODULATOR	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.75 V	3.75	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7 mm
73K312L-IGT	Texas Instruments	MODEM	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	FULL DUPLEX				10 mm
AD9975ABST	Analog Devices	MODEM-SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.227 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
AD1801JST	Analog Devices	MODEM-DATA/FAX/VOICE	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		0 Cel	TIN LEAD	QUAD	1.4 Mbps	R-PQFP-G128		1.6 mm	14 mm	Not Qualified		e0			20 mm
AD9975ABSTZ	Analog Devices	MODEM-SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3			7 mm
ADSP-21MOD870-110	Analog Devices	MODEM		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm		8 kbps		TIN LEAD	QUAD	.056 Mbps	S-PQFP-G100		1.6 mm	14 mm	Not Qualified		e0			14 mm
AD9975ABSTRL	Analog Devices	MODEM-SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.227 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
AD1801JST-REEL	Analog Devices	MODEM-DATA/FAX/VOICE	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		0 Cel	TIN LEAD	QUAD	1.4 Mbps	R-PQFP-G128		1.6 mm	14 mm	Not Qualified		e0			20 mm
AD9975ABSTZRL	Analog Devices	MODEM-SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3			7 mm
ADSP-21MOD870-100	Analog Devices	MODEM		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm		8 kbps		TIN LEAD	QUAD	.056 Mbps	S-PQFP-G100		1.6 mm	14 mm	Not Qualified		e0			14 mm
ADSP-21MOD870-000	Analog Devices	MODEM	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Modems	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G100		1.6 mm	14 mm	Not Qualified		e0			14 mm
ST70136G	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				3.3,5	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e4			10 mm
STLC7550TQF7TR	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
ST7554TQF7	STMicroelectronics	MODEM-DATA/FAX/VOICE	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
STLC7550TQF7	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
STLC60134	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	QUAD	8 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	DATA RATE:1MBPS UPSTREAM WITH 32KBPS GRANULARITY	e0			10 mm
ST75951	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm
ST70137TQFP	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	12.03 Mbps	S-PQFP-G144		1.6 mm	20 mm	Not Qualified	IT ALSO REQUIRES 3.3V SUPPLY	e4			20 mm
STLC60134TR	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		QUAD	8 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	DATA RATE:1MBPS UPSTREAM WITH 32KBPS GRANULARITY				10 mm
STLC60134S	STMicroelectronics	MODEM-SUPPORT CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3/3.3,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	80 Cel		-40 Cel	TIN LEAD	QUAD	.008192 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	DATA RATE: 640K BITS/SEC UPSTREAM	e0			10 mm
E-STLC7550TQF7	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel		0 Cel		QUAD	.056 Mbps	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e3/e4			7 mm
UCB1100LP/X3	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel		0 Cel	TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3			7 mm
UCB1300BE	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
UCB1200BE	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
UCB1300BE-T	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
UCB1200BE-T	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
MAX2982GCD+	Maxim Integrated	MODEM	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Modems	.5 mm	105 Cel		-40 Cel	MATTE TIN	QUAD	14 Mbps	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified		e3	30	260	20 mm
MAX2982GCD/V+	Maxim Integrated	MODEM	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Modems	.5 mm	105 Cel		-40 Cel	MATTE TIN	QUAD	14 Mbps	R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified		e3	30	260	20 mm
S5N8952X	Samsung	MODEM	COMMERCIAL	GULL WING	208	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V	1.8,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel		QUAD	8 Mbps	S-PQFP-G208		1.6 mm	28 mm	Not Qualified					28 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.