Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Fax Rate | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
.068 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
3 |
Not Qualified |
260 |
|||||||||||||
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
28 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
5 V |
5,9 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Modems |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.0048 Mbps |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
||||||
|
STMicroelectronics |
MODEM |
INDUSTRIAL |
GULL WING |
28 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
5 V |
5,9 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Modems |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.0048 Mbps |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
||||||
|
Digi International |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
20 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
.375 Mbps |
R-XXMA-T20 |
POWER REQUIREMENTS AVAILABLE AT 3.3VDC INPUT POWER |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||
|
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
.068 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
3 |
Not Qualified |
260 |
|||||||||||||
|
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
68 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
Not Qualified |
||||||||||||||||
|
Cml Microcircuits |
MODEM |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0025 mA |
5 V |
3/5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
.0012 Mbps |
R-PDSO-G16 |
2.67 mm |
7.49 mm |
Not Qualified |
HALF DUPLEX |
e3 |
40 |
260 |
10.26 mm |
|||||
|
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
68 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
Not Qualified |
||||||||||||||||
|
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.068 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.0012 Mbps |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
DATA RATE MIN:600BPS |
e4 |
10.3 mm |
|||||||
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
.0012 Mbps |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
DATA RATE MIN:600BPS |
10.3 mm |
|||||||||||||||
NXP Semiconductors |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.068 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
.0012 Mbps |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
10.3 mm |
|||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
16 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
|||||||||
Lapis Semiconductor |
MODEM |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
10 mA |
3/5 |
SMALL OUTLINE |
SOP24,.45 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
e0 |
||||||||||||||||
Cml Microcircuits |
MODEM |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0025 mA |
5 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.4 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDSO-G16 |
2.67 mm |
7.49 mm |
Not Qualified |
10.26 mm |
|||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
16 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
19.304 mm |
|||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
12 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
19.304 mm |
|||||||||
|
Cml Microcircuits |
MODEM |
INDUSTRIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
3.3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
Modems |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
.0384 Mbps |
R-PDSO-G24 |
2 mm |
5.3 mm |
Not Qualified |
e3 |
40 |
260 |
8.2 mm |
||||||||
Nimbus Technology |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
20 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
.375 Mbps |
R-XDMA-T20 |
6.858 mm |
28.95 mm |
TRANSMITTING DATE RATE IS 300KBITPS |
33.88 mm |
||||||||||||||||||
|
IXYS Corporation |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
PIN/PEG |
9 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
5 V |
MICROELECTRONIC ASSEMBLY |
70 Cel |
0 Cel |
DUAL |
R-XDMA-P9 |
Not Qualified |
NOT SPECIFIED |
260 |
|||||||||||||||||||
|
Silicon Labs |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.018 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
.0024 Mbps |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
||||||||
|
Silicon Labs |
MODEM |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
32 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
.0024 Mbps |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
e3 |
9.9 mm |
||||||||
|
Littelfuse |
MODEM-SUPPORT CIRCUIT |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
SOP16,.4 |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
2.21 mm |
7.493 mm |
10.16 mm |
||||||||||||||||||
|
Littelfuse |
MODEM-SUPPORT CIRCUIT |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
SOP16,.4 |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
2.21 mm |
7.493 mm |
10.16 mm |
||||||||||||||||||
NXP Semiconductors |
MODEM |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
12.8 mm |
||||||||||||||||
National Semiconductor |
MODEM |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
10 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
.0003 Mbps |
R-PDSO-G20 |
2.6 mm |
7.5 mm |
Not Qualified |
FULL DUPLEX |
e0 |
12.8 mm |
||||||||
|
Silicon Labs |
MODEM |
COMMERCIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
.056 Mbps |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
7.8 mm |
|||||||||||||
Silicon Labs |
MODEM |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.032 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
.0024 Mbps |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
9.9 mm |
||||||||||
Silicon Labs |
MODEM |
COMMERCIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
DUAL |
.0336 Mbps |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7.8 mm |
||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
HALF DUPLEX; FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
IN-LINE |
DIP18,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T40 |
5.588 mm |
15.24 mm |
Not Qualified |
51.943 mm |
||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-GDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
27.559 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0024 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
27.686 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
27.686 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
27.686 mm |
|||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
12 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
|||||||||
Texas Instruments |
MODEM |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
5 V |
5 |
SMALL OUTLINE |
SOP24,.4 |
Modems |
1.27 mm |
DUAL |
R-PDSO-G24 |
Not Qualified |
||||||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
R-PQCC-J32 |
3.56 mm |
11.455 mm |
Not Qualified |
FULL DUPLEX |
13.995 mm |
|||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
IN-LINE |
DIP18,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
-5 V |
5 V |
+-5 |
SMALL OUTLINE |
SOP20,.4 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
e0 |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
27.686 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
R-PQCC-J32 |
3.56 mm |
11.455 mm |
Not Qualified |
FULL DUPLEX |
13.995 mm |
|||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
FULL DUPLEX |
15.4 mm |
|||||||||||||||
Texas Instruments |
MODEM |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
DUAL |
R-PDIP-T16 |
Not Qualified |
||||||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.
Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.
Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.
There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.
Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.