J BEND Modems 81

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Fax Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Length
ST7543CFN	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		37 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Modems	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.0192 Mbps	S-PQCC-J44	4.57 mm	16.5862 mm	Not Qualified		e0	16.5862 mm
TS68951CFN	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	-5 V	.04 mA	5 V	+-5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQCC-J28	4.57 mm	11.5062 mm	Not Qualified		e0	11.5062 mm
TS75C320CFN	STMicroelectronics	MODEM	COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	CHIP CARRIER	LDCC52,.8SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.0096 Mbps	S-PQCC-J52	5.08 mm	19.1262 mm	Not Qualified	DATA RATE MIN:300BPS	e0	19.1262 mm
ST7546CFN	STMicroelectronics		COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS				3.3/5,5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28			Not Qualified		e0
TS75C960CFN-S	STMicroelectronics	MODEM	COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	CHIP CARRIER	LDCC52,.8SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.0096 Mbps	S-PQCC-J52	5.08 mm	19.1262 mm	Not Qualified	DATA RATE MIN:300BPS	e0	19.1262 mm
ST7536CFN	STMicroelectronics	MODEM	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		-5 V	35 mA	5 V	+-5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	70 Cel		-10 Cel	TIN LEAD	QUAD	.0012 Mbps	S-PQCC-J28	4.57 mm	11.5062 mm	Not Qualified	HALF DUPLEX	e0	11.5062 mm
ST7536CFNTR	STMicroelectronics	MODEM	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		-5 V	35 mA	5 V		CHIP CARRIER			1.27 mm	70 Cel		-10 Cel		QUAD	.0012 Mbps	S-PQCC-J28	4.57 mm	11.5062 mm	Not Qualified	HALF DUPLEX		11.5062 mm
STLC7546CFN	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3/5,5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-PQCC-J28	4.57 mm	11.5062 mm	Not Qualified		e3	11.5062 mm
TS75C961CFN-S	STMicroelectronics	MODEM	COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.0096 Mbps	S-PQCC-J52	5.08 mm	19.1262 mm	Not Qualified	DATA RATE MIN:300BPS	e0	19.1262 mm
ST7537	STMicroelectronics	MODEM	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES						5,10	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28			Not Qualified		e0
ST7544CFN	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		37 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Modems	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD	.0288 Mbps	S-PQCC-J44	4.57 mm	16.5862 mm	Not Qualified		e3	16.5862 mm
TS7514CFNTR	STMicroelectronics	PROGRAMMABLE MODEM	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	-5 V		5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel		QUAD	.0012 Mbps	S-PQCC-J28	4.57 mm	11.5062 mm	Not Qualified			11.5062 mm
SAB82511-N	Infineon Technologies	MODEM	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		290 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Modems	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44			Not Qualified		e0
73K324L-28IHR/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	S-PQCC-J28	4.572 mm	11.54 mm	Not Qualified			11.54 mm
73K222AL-IH	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.012 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	S-PQCC-J28	4.572 mm	11.5062 mm	Not Qualified	FULL DUPLEX		11.5062 mm
73K222BL-IH/F	Maxim Integrated	MODEM		J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12 mA	5 V		CHIP CARRIER	LDCC32,.5X.6		1.27 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	R-PQCC-J32	3.56 mm	11.455 mm				13.995 mm
73K222BL-IHR/F	Maxim Integrated	MODEM		J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		12 mA	5 V		CHIP CARRIER	LDCC32,.5X.6		1.27 mm	85 Cel		-40 Cel		QUAD	.0012 Mbps	R-PQCC-J32	3.56 mm	11.455 mm				13.995 mm
73K324BL-IHR/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32	3.56 mm	11.455 mm	Not Qualified			14 mm
73K324L-28IH/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	S-PQCC-J28	4.572 mm	11.54 mm	Not Qualified			11.54 mm
73K224L-28IHR/F	Maxim Integrated	MODEM		J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		25 mA	5 V		CHIP CARRIER	LDCC28,.5SQ		1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	S-PQCC-J28	4.572 mm	11.54 mm				11.54 mm
73K224L-28IH/F	Maxim Integrated	MODEM		J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		25 mA	5 V		CHIP CARRIER	LDCC28,.5SQ		1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	S-PQCC-J28	4.572 mm	11.54 mm				11.54 mm
73K224BL-IHR/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32	3.56 mm	11.455 mm	Not Qualified			13.995 mm
73K324BL-IH/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32	3.56 mm	11.455 mm	Not Qualified			14 mm
73K224BL-IH/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32	3.56 mm	11.455 mm	Not Qualified			13.995 mm
73M2901CL-IH/F	Maxim Integrated	MODEM	INDUSTRIAL	J BEND	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER			1.27 mm	85 Cel		-40 Cel		QUAD	.0024 Mbps	R-PQCC-J32	3.56 mm	11.455 mm	Not Qualified			13.995 mm
UPD77810L	Renesas Electronics		COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			5 V	5	CHIP CARRIER	LDCC68,1.0SQ	Modems	1.27 mm	70 Cel		-10 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J68			Not Qualified		e0
UPD77811L	Renesas Electronics			J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS	-5 V		5 V	+-5	CHIP CARRIER	LDCC44,.7SQ	Modems	1.27 mm				Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44			Not Qualified		e0
UPD77812L	Renesas Electronics			J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			5 V	5	CHIP CARRIER	LDCC68,1.0SQ	Modems	1.27 mm				Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J68			Not Qualified		e0
UPD77811LM	Renesas Electronics			J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS	-5 V		5 V	+-5	CHIP CARRIER	LDCC44,.7SQ	Modems	1.27 mm				Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44			Not Qualified		e0
KS16112	Samsung	MODEM-FAX		J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER			1.27 mm		9.6 kbps			QUAD		S-PQCC-J68	4.52 mm	24.2316 mm	Not Qualified			24.2316 mm
KS16114	Samsung	MODEM		J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER			1.27 mm		14.4 kbps			QUAD		S-PQCC-J68	4.52 mm	24.2316 mm	Not Qualified			24.2316 mm
KS16112L	Samsung	MODEM-FAX	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		-5 V		5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel		QUAD	.0096 Mbps	S-PQCC-J68	4.52 mm	24.2316 mm	Not Qualified			24.2316 mm
KS16114L	Samsung	MODEM-FAX	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		-5 V		5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel		QUAD	.0144 Mbps	S-PQCC-J68	4.52 mm	24.2316 mm	Not Qualified	DATA RATE MIN:7.2KBPS		24.2316 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.