Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Fax Rate | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Analog Devices |
MODEM |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
.000285 mA |
3/3.3 |
CHIP CARRIER |
LCC20,.20SQ,25 |
Modems |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N20 |
1 |
Not Qualified |
e3 |
||||||||||||||
|
Analog Devices |
MODEM |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.000285 mA |
3/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.20SQ,25 |
Modems |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.0012 Mbps |
S-XQCC-N20 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
e3 |
260 |
4 mm |
|||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Analog Devices |
MODEM |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
30 |
260 |
4 mm |
||||||||||||||
|
Analog Devices |
MODEM |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||
|
Analog Devices |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
15.5 mA |
3/3.3 |
FLATPACK |
TQFP32,.35SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G32 |
Not Qualified |
|||||||||||||||||
|
Analog Devices |
MODEM |
INDUSTRIAL |
GULL WING |
48 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.2304 Mbps |
S-PQFP-G48 |
1 |
1.6 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
|||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
OTHER |
NO LEAD |
40 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER |
85 Cel |
-25 Cel |
QUAD |
S-XQCC-N40 |
||||||||||||||||||||||
Analog Devices |
MODEM-DATA/FAX/VOICE |
OTHER |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
1.4 Mbps |
R-PQFP-G128 |
3.4 mm |
14 mm |
Not Qualified |
e0 |
20 mm |
||||||||||||||
Analog Devices |
MODEM |
BALL |
304 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
GRID ARRAY |
BGA304,23X23,50 |
Modems |
1.27 mm |
8 kbps |
TIN LEAD |
BOTTOM |
.056 Mbps |
S-PBGA-B304 |
2.54 mm |
31 mm |
Not Qualified |
e0 |
31 mm |
|||||||||||||
Analog Devices |
MODEM |
COMMERCIAL |
BALL |
304 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3 |
GRID ARRAY |
BGA304(UNSPEC) |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
.056 Mbps |
S-PBGA-B304 |
2.54 mm |
31 mm |
Not Qualified |
e0 |
31 mm |
||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
20 mA |
5 V |
5 |
SMALL OUTLINE |
SOP28,.4 |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
17.9 mm |
|||||||||||
Analog Devices |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
Not Qualified |
e0 |
|||||||||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.227 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Modems |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
||||||||||
Analog Devices |
MODEM-DATA/FAX/VOICE |
OTHER |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
1.4 Mbps |
R-PQFP-G128 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
20 mm |
||||||||||||||
Analog Devices |
MODEM |
BALL |
304 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
GRID ARRAY |
BGA304,23X23,50 |
Modems |
1.27 mm |
8 kbps |
TIN LEAD |
BOTTOM |
.056 Mbps |
S-PBGA-B304 |
2.54 mm |
31 mm |
Not Qualified |
e0 |
31 mm |
|||||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
20 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
4.57 mm |
16.585 mm |
Not Qualified |
e0 |
16.585 mm |
|||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
20 mA |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
Not Qualified |
e0 |
36.205 mm |
|||||||||||
|
Analog Devices |
MODEM-DEMODULATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N24 |
1 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
|||||||||||
|
Analog Devices |
MODEM-DEMODULATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N24 |
1 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
|||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
20 mA |
5 V |
5 |
FLATPACK, LOW PROFILE |
TQFP44,.47SQ,32 |
Modems |
1 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G44 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
|||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
OTHER |
NO LEAD |
32 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER |
85 Cel |
-25 Cel |
QUAD |
S-XQCC-N32 |
||||||||||||||||||||||
|
Analog Devices |
MODEM-SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
|||||||||||||
Analog Devices |
MODEM |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
8 kbps |
TIN LEAD |
QUAD |
.056 Mbps |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
||||||||||||||||
Analog Devices |
MODEM-SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.227 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Modems |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
||||||||||
Analog Devices |
MODEM-DATA/FAX/VOICE |
OTHER |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
1.4 Mbps |
R-PQFP-G128 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
20 mm |
||||||||||||||
|
Analog Devices |
MODEM |
INDUSTRIAL |
64 |
QCCN |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
3 |
e3 |
260 |
||||||||||||||||||
|
Analog Devices |
MODEM-SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
|||||||||||||
Analog Devices |
MODEM |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
8 kbps |
TIN LEAD |
QUAD |
.056 Mbps |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
||||||||||||||||
|
Analog Devices |
MODEM |
INDUSTRIAL |
64 |
QCCN |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
3 |
e3 |
260 |
||||||||||||||||||
Analog Devices |
MODEM |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Modems |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
.056 Mbps |
S-PQFP-G100 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
J BEND |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
62 mA |
5 V |
5 |
CHIP CARRIER |
LDCC32,.5X.6 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQCC-J32 |
Not Qualified |
|||||||||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
.012 mA |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Modems |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
J BEND |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
R-PQCC-J32 |
3.55 mm |
11.43 mm |
Not Qualified |
13.97 mm |
||||||||||||||||
Analog Devices |
MODEM |
COMMERCIAL |
30 |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
SIP30,.2 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
SINGLE |
Not Qualified |
e0 |
||||||||||||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
25 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
Not Qualified |
||||||||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
J BEND |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
R-PQCC-J32 |
3.56 mm |
11.455 mm |
Not Qualified |
13.995 mm |
||||||||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T40 |
5.588 mm |
15.24 mm |
Not Qualified |
DATA RATE MIN:300BPS |
51.943 mm |
||||||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J44 |
5.08 mm |
16.5862 mm |
Not Qualified |
DATA RATE MIN:300BPS |
16.5862 mm |
||||||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
S-PQFP-G32 |
1.2 mm |
7 mm |
Not Qualified |
7 mm |
||||||||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
J BEND |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
R-PQCC-J32 |
3.55 mm |
11.43 mm |
Not Qualified |
DATA RATE MIN:300BPS |
13.97 mm |
||||||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
S-PQFP-G44 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||
Analog Devices |
|||||||||||||||||||||||||||||||||||||
Analog Devices |
MODEM |
INDUSTRIAL |
J BEND |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
12 mA |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
R-PQCC-J32 |
3.55 mm |
11.43 mm |
Not Qualified |
FULL DUPLEX |
13.97 mm |
A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.
Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.
Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.
There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.
Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.