NXP Semiconductors Modems 41

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Peak Reflow Temperature (C)	Length
TDA5051AT/C1,518	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	.068 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16	3			Not Qualified			260
TDA5051AT/C1,512	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	.068 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16	3			Not Qualified			260
TDA5051AT/C1,118	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			68 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16				Not Qualified
TDA5051AT/C1,112	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			68 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16				Not Qualified
TDA5051AT	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.068 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	DATA RATE MIN:600BPS	e4		10.3 mm
TDA5051	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	DATA RATE MIN:600BPS			10.3 mm
TDA5051T	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.068 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Modems	1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
MC145443DW	NXP Semiconductors	MODEM	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified				12.8 mm
UCB1100LP/X3	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel	0 Cel	TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3		7 mm
TDA8263HN/C1,518	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4		5 mm
NE5081N	NXP Semiconductors	MODEM-DEMODULATOR	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		50 mA	5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified	HALF DUPLEX; FULL DUPLEX			26.73 mm
UCB1300BE	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
UCB1200BE	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
TDA8296HN	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40		SQUARE	PLASTIC/EPOXY	YES						CHIP CARRIER							QUAD		S-PQCC-N40				Not Qualified
NE5050D	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			12 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.3 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified				12.8 mm
TDA8262HN	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
NE5080N	NXP Semiconductors	MODEM-MODULATOR	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		100 mA	5 V		IN-LINE			2.54 mm	70 Cel	0 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T16		4.2 mm	7.62 mm	Not Qualified	HALF DUPLEX; FULL DUPLEX	e3/e4		19.025 mm
UCB1300BE-T	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
NE5050N	NXP Semiconductors	MODEM	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			12 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL	.3 Mbps	R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified				26.73 mm
UCB1200BE-T	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
TDA8262HN/C1,118	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4		5 mm
TDA8263HN	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
UCB1100	NXP Semiconductors
NE5050D-T	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			12 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	.3 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e4		12.8 mm
MC145444DW	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	SMALL OUTLINE	SOP20,.4	Modems	1.27 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	.0003 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified	SIMPLEX; HALF DUPLEX; FULL DUPLEX	e0		12.8 mm
935288611518	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V			6 mm
MC145745FW	NXP Semiconductors	MODEM	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V	3.6	SMALL OUTLINE	SOP28,.4	Modems	1.27 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	.0012 Mbps	R-PDSO-G28		2.65 mm	7.51 mm	Not Qualified	DATA RATE MIN:0.3BPS	e0		17.915 mm
935288611557	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V			6 mm
935234750512	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm		DATA RATE MIN:600BPS			10.3 mm
MC145442BDW	NXP Semiconductors	MODEM	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	10 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Modems	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	.0003 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e0		12.8 mm
935234750112	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm		DATA RATE MIN:600BPS			10.3 mm
935288611551	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V			6 mm
935234750518	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm		DATA RATE MIN:600BPS			10.3 mm
MC145444P	NXP Semiconductors	MODEM	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		5 V	5	IN-LINE	DIP20,.3	Modems	2.54 mm	70 Cel	-20 Cel		DUAL		R-PDIP-T20				Not Qualified
935234750118	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm		DATA RATE MIN:600BPS			10.3 mm
MC145443BDW	NXP Semiconductors	MODEM	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.01 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Modems	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	.0003 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e0		12.8 mm
MC145443BP	NXP Semiconductors	MODEM	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	.0003 Mbps	R-PDIP-T20		4.57 mm	7.62 mm	Not Qualified				26.415 mm
MC145442BP	NXP Semiconductors	MODEM	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	10 mA	5 V	5	IN-LINE	DIP20,.3	Modems	2.54 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	.0003 Mbps	R-PDIP-T20		4.57 mm	7.62 mm	Not Qualified		e0		26.415 mm
TDA5051T-T	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
TDA5051TD	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
TDA5051AT-T	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	DATA RATE MIN:600BPS			10.3 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.