Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Fax Rate | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-PQFP-G32 |
3 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||
|
Onsemi |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-PQFP-G32 |
3 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||
|
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.506 mm |
Not Qualified |
e3 |
30 |
260 |
11.506 mm |
|||||
|
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.506 mm |
Not Qualified |
e3 |
30 |
260 |
11.506 mm |
|||||
|
Onsemi |
MODEM |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Modems |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.0012 Mbps |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Onsemi |
MODEM |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
.0006 mA |
3.3 V |
3.3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Modems |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||
|
Onsemi |
MODEM |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN/NICKEL PALLADIUM GOLD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
e3/e4 |
40 |
260 |
11.4808 mm |
||||||||||
|
Onsemi |
PROGRAMMABLE MODEM |
INDUSTRIAL |
NO LEAD |
52 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
.06 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC52,.31SQ,20 |
Modems |
.5 mm |
115 Cel |
-40 Cel |
QUAD |
S-PQCC-N52 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||
|
Onsemi |
PROGRAMMABLE MODEM |
INDUSTRIAL |
NO LEAD |
52 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 V |
3.3 |
CHIP CARRIER |
LCC52,.31SQ,20 |
Modems |
.5 mm |
115 Cel |
-40 Cel |
QUAD |
S-PQCC-N52 |
Not Qualified |
|||||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQFP-G32 |
1.6 mm |
7 mm |
Not Qualified |
e3/e4 |
40 |
260 |
7 mm |
|||||||||||
Onsemi |
MODEM-DEMODULATOR |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER |
1.27 mm |
QUAD |
1 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
11.5062 mm |
||||||||||||||||||||
|
Onsemi |
PROGRAMMABLE MODEM |
COMMERCIAL EXTENDED |
NO LEAD |
52 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC52,.31SQ,20 |
Modems |
.5 mm |
80 Cel |
-25 Cel |
QUAD |
S-PQCC-N52 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
11.4808 mm |
|||||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQFP-G32 |
1.6 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||
|
Onsemi |
PROGRAMMABLE MODEM |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
60 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
Modems |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N56 |
1 mm |
8 mm |
Not Qualified |
8 mm |
||||||||||||
|
Onsemi |
PROGRAMMABLE MODEM |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
60 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N56 |
1 mm |
8 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
|||||||||||||
Onsemi |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
.27 mA |
5 V |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
10 Mbps |
S-CQCC-J52 |
5.08 mm |
18.935 mm |
Not Qualified |
e0 |
18.935 mm |
|||||||||
|
Onsemi |
MODEM |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||
Onsemi |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
5 V |
IN-LINE |
70 Cel |
0 Cel |
DUAL |
.0003 Mbps |
R-PDIP-T28 |
Not Qualified |
|||||||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN/NICKEL PALLADIUM GOLD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
e3/e4 |
40 |
260 |
11.4808 mm |
||||||||||
Onsemi |
MODEM-DEMODULATOR |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3/5 |
SMALL OUTLINE |
SOP24,.4 |
Other Telecom ICs |
1.27 mm |
TIN LEAD |
DUAL |
R-PDSO-G24 |
Not Qualified |
e0 |
||||||||||||||||||
|
Onsemi |
MODEM |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC28(UNSPEC) |
Modems |
70 Cel |
-25 Cel |
QUAD |
.00144 Mbps |
S-PQCC-J28 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQFP-G32 |
1.6 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||
|
Onsemi |
PROGRAMMABLE MODEM |
INDUSTRIAL |
NO LEAD |
52 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
.06 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC52,.31SQ,20 |
Modems |
.5 mm |
115 Cel |
-40 Cel |
QUAD |
S-PQCC-N52 |
Not Qualified |
||||||||||||||||
|
Onsemi |
PROGRAMMABLE MODEM |
INDUSTRIAL |
NO LEAD |
56 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
.06 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC56,.31SQ,20 |
Modems |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N56 |
Not Qualified |
||||||||||||||||
|
Onsemi |
MODEM-DEMODULATOR |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3/5 |
FLATPACK |
QFP32,.35SQ,32 |
Other Telecom ICs |
.8 mm |
TIN |
QUAD |
S-PQFP-G32 |
3 |
Not Qualified |
e3 |
260 |
|||||||||||||||
Onsemi |
MODEM |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
.27 mA |
5 V |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
Modems |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
10 Mbps |
S-CQCC-J52 |
5.08 mm |
18.935 mm |
Not Qualified |
e0 |
18.935 mm |
|||||||||
Onsemi |
MODEM-DEMODULATOR |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
1.27 mm |
DUAL |
1 Mbps |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
15.4 mm |
||||||||||||||||||||
|
Onsemi |
PROGRAMMABLE MODEM |
COMMERCIAL EXTENDED |
NO LEAD |
52 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC52,.31SQ,20 |
Modems |
.5 mm |
80 Cel |
-25 Cel |
QUAD |
S-PQCC-N52 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
11.4808 mm |
|||||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
.0012 Mbps |
S-PQFP-G32 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||||||
|
Onsemi |
PROGRAMMABLE MODEM |
INDUSTRIAL |
NO LEAD |
52 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 V |
3.3 |
CHIP CARRIER |
LCC52,.31SQ,20 |
Modems |
.5 mm |
115 Cel |
-40 Cel |
QUAD |
S-PQCC-N52 |
Not Qualified |
|||||||||||||||||
|
Onsemi |
MODEM |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||
Onsemi |
MODEM-DEMODULATOR |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3/5 |
FLATPACK |
QFP32,.35SQ,32 |
Other Telecom ICs |
.8 mm |
TIN LEAD |
QUAD |
S-PQFP-G32 |
Not Qualified |
e0 |
||||||||||||||||||
Onsemi |
MODEM-DEMODULATOR |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3/5 |
FLATPACK |
QFP32,.35SQ,32 |
Other Telecom ICs |
.8 mm |
TIN LEAD |
QUAD |
S-PQFP-G32 |
Not Qualified |
e0 |
||||||||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
e0 |
11.4808 mm |
|||||||||||||
|
Onsemi |
MODEM-DEMODULATOR |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3/5 |
FLATPACK |
QFP32,.35SQ,32 |
Other Telecom ICs |
.8 mm |
TIN |
QUAD |
S-PQFP-G32 |
3 |
Not Qualified |
e3 |
260 |
|||||||||||||||
Onsemi |
MODEM-DEMODULATOR |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3/5 |
SMALL OUTLINE |
SOP24,.4 |
Other Telecom ICs |
1.27 mm |
TIN LEAD |
DUAL |
R-PDSO-G24 |
Not Qualified |
e0 |
||||||||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
.6 mA |
3.3/5 |
FLATPACK |
QFP32,.35SQ,32 |
Modems |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G32 |
Not Qualified |
||||||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.572 mm |
11.4808 mm |
Not Qualified |
e0 |
11.4808 mm |
|||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
.0012 Mbps |
S-PQFP-G32 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
|||||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
.6 mA |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
Not Qualified |
||||||||||||||||||
|
Onsemi |
MODEM |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
.0012 Mbps |
S-PQFP-G32 |
3 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
|||||||||||
Onsemi |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
.6 mA |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
Not Qualified |
||||||||||||||||||
|
Onsemi |
MODEM |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.
Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.
Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.
There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.
Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.