Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Fax Rate | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF |
e4 |
30 |
260 |
4 mm |
|||||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
||||||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.15SQ,20 |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF |
e4 |
NOT SPECIFIED |
260 |
4 mm |
||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
16 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
|||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.15SQ,20 |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.03125 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF |
e4 |
NOT SPECIFIED |
260 |
4 mm |
||||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.03125 Mbps |
S-PQFP-G32 |
3 |
1.2 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
|||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
16 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
19.304 mm |
|||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
12 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
19.304 mm |
|||||||||
|
Texas Instruments |
PROGRAMMABLE MODEM |
MILITARY |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.03125 Mbps |
S-PQFP-G32 |
3 |
1.2 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
|||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQFP-G52 |
2.43 mm |
10 mm |
Not Qualified |
FULL DUPLEX |
10 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
HALF DUPLEX; FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
S-PQFP-G52 |
2.43 mm |
10 mm |
Not Qualified |
FULL DUPLEX |
10 mm |
|||||||||||||||
Texas Instruments |
MODEM-MODULATOR |
GULL WING |
48 |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK |
QUAD |
S-PQFP-G48 |
Not Qualified |
|||||||||||||||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
IN-LINE |
DIP18,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T40 |
5.588 mm |
15.24 mm |
Not Qualified |
51.943 mm |
||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-GDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
27.559 mm |
|||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
DIP |
PLASTIC/EPOXY |
NO |
CMOS |
IN-LINE |
DIP(UNSPEC) |
Modems |
70 Cel |
0 Cel |
DUAL |
Not Qualified |
||||||||||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0024 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
27.686 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
27.686 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
27.686 mm |
|||||||||||||||
Texas Instruments |
MODEM-MODULATOR |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.75 V |
3.75 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
12 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
|||||||||
Texas Instruments |
MODEM-MODULATOR |
INDUSTRIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.75 V |
FLATPACK, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
1.2 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
FULL DUPLEX |
11.5062 mm |
|||||||||||||||
Texas Instruments |
MODEM |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
5 V |
5 |
SMALL OUTLINE |
SOP24,.4 |
Modems |
1.27 mm |
DUAL |
R-PDSO-G24 |
Not Qualified |
||||||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
208 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
6 Mbps |
S-PQFP-G208 |
4.1 mm |
28 mm |
Not Qualified |
28 mm |
||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
R-PQCC-J32 |
3.56 mm |
11.455 mm |
Not Qualified |
FULL DUPLEX |
13.995 mm |
|||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
IN-LINE |
DIP18,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
208 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
6 Mbps |
S-PQFP-G208 |
4.1 mm |
28 mm |
Not Qualified |
28 mm |
||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
-5 V |
5 V |
+-5 |
SMALL OUTLINE |
SOP20,.4 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
e0 |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
27.686 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
R-PQCC-J32 |
3.56 mm |
11.455 mm |
Not Qualified |
FULL DUPLEX |
13.995 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
S-PQFP-G52 |
2.43 mm |
10 mm |
Not Qualified |
FULL DUPLEX |
10 mm |
|||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
FULL DUPLEX |
15.4 mm |
|||||||||||||||
Texas Instruments |
MODEM |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Modems |
2.54 mm |
DUAL |
R-PDIP-T16 |
Not Qualified |
||||||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
|
Texas Instruments |
MODEM |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
33 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
120 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
2 |
e4 |
30 |
260 |
||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J44 |
5.08 mm |
16.5862 mm |
Not Qualified |
FULL DUPLEX |
16.5862 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
FULL DUPLEX |
10 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0024 Mbps |
S-PQCC-J44 |
5.08 mm |
16.5862 mm |
Not Qualified |
FULL DUPLEX |
16.5862 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T28 |
5.588 mm |
15.24 mm |
Not Qualified |
FULL DUPLEX |
35.941 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
THROUGH-HOLE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
.0012 Mbps |
R-PDIP-T22 |
5.08 mm |
10.16 mm |
Not Qualified |
FULL DUPLEX |
27.686 mm |
|||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
16 mA |
5 V |
5 |
SMALL OUTLINE |
SOP24,.4 |
Modems |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
FULL DUPLEX |
NOT SPECIFIED |
NOT SPECIFIED |
15.4 mm |
|||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
FULL DUPLEX |
11.5062 mm |
|||||||||||||||
Texas Instruments |
MODEM |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
IN-LINE |
DIP18,.3 |
Modems |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
Texas Instruments |
MODEM |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
.0012 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
FULL DUPLEX |
11.5062 mm |
A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.
Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.
Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.
There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.
Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.