Modems

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Fax Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Length
STLC7546CFN	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3/5,5	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified		e3	11.5062 mm
ST75C50	STMicroelectronics	MODEM-DATA/FAX/VOICE	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			.65 mm	70 Cel	14.4 kbps	0 Cel		QUAD	.0144 Mbps	S-PQFP-G160		4.07 mm	28 mm	Not Qualified	FULL DUPLEX		28 mm
STLC7546TQFP4Y	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	3.3/5,5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQFP-G44		1.6 mm	10 mm	Not Qualified		e0	10 mm
STLC7545TQFP4Y	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	3.3/5,5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	.0384 Mbps	S-PQFP-G44		1.6 mm	10 mm	Not Qualified		e4	10 mm
TS75C250CP	STMicroelectronics	MODEM	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V	30 mA	5 V		IN-LINE			2.54 mm	70 Cel		0 Cel		DUAL	.0024 Mbps	R-PDIP-T48		5.08 mm	15.24 mm	Not Qualified	FULL DUPLEX
STLC7550TQFP	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G44		1.6 mm	10 mm	Not Qualified		e0	10 mm
ST75C540TQFP	STMicroelectronics	MODEM-DATA/FAX	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			.165 mA	5 V	5	FLATPACK, LOW PROFILE	QFP80,.64SQ	Modems	.65 mm	70 Cel	14.4 kbps	0 Cel	TIN LEAD	QUAD	.0144 Mbps	S-PQFP-G80		1.6 mm	14 mm	Not Qualified		e0	14 mm
TS7515CP	STMicroelectronics	MODEM	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V	30 mA	5 V	+-5	IN-LINE	DIP28,.6	Modems	2.54 mm	70 Cel		0 Cel	TIN LEAD	DUAL	.0012 Mbps	R-PDIP-T28			15.24 mm	Not Qualified		e0	36.83 mm
TS75C961CP-S	STMicroelectronics	MODEM	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE			2.54 mm	70 Cel		0 Cel	TIN LEAD	DUAL	.0096 Mbps	R-PDIP-T48			15.24 mm	Not Qualified	DATA RATE MIN:300BPS	e0
TS75C961CFN-S	STMicroelectronics	MODEM	COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.0096 Mbps	S-PQCC-J52		5.08 mm	19.1262 mm	Not Qualified	DATA RATE MIN:300BPS	e0	19.1262 mm
STLC1510	STMicroelectronics	MODEM	INDUSTRIAL	BALL	132	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA132,14X14,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	MATTE TIN	BOTTOM	1.5 Mbps	S-PBGA-B132	1	1.7 mm	12 mm	Not Qualified		e3	12 mm
ST7537	STMicroelectronics	MODEM	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES						5,10	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28				Not Qualified		e0
STLC75C53TQFP	STMicroelectronics	MODEM	COMMERCIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES				200 mA	5 V	5	FLATPACK	QFP80,.63SQ,32	Modems	.8 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G80				Not Qualified		e0
ST70135A	STMicroelectronics	MODEM	COMMERCIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK	QFP144,1.2SQ	Modems	.65 mm	70 Cel		0 Cel	TIN LEAD	QUAD	8 Mbps	S-PQFP-G144		4.07 mm	28 mm	Not Qualified		e0	28 mm
STLC60134TR	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		QUAD	8 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	DATA RATE:1MBPS UPSTREAM WITH 32KBPS GRANULARITY		10 mm
STLC7550	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	70 Cel		0 Cel	TIN LEAD	QUAD	.056 Mbps	S-PQFP-G44		1.6 mm	10 mm	Not Qualified		e0	10 mm
STLC60134S	STMicroelectronics	MODEM-SUPPORT CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3/3.3,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	80 Cel		-40 Cel	TIN LEAD	QUAD	.008192 Mbps	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	DATA RATE: 640K BITS/SEC UPSTREAM	e0	10 mm
TS75322CP	STMicroelectronics	MODEM-DEMODULATOR	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V	35 mA	5 V		IN-LINE			2.54 mm	70 Cel		0 Cel		DUAL	.0096 Mbps	R-PDIP-T48		5.08 mm	15.24 mm	Not Qualified	FULL DUPLEX
ST7544CFN	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		37 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Modems	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD	.0288 Mbps	S-PQCC-J44		4.57 mm	16.5862 mm	Not Qualified		e3	16.5862 mm
ST7538P	STMicroelectronics	MODEM	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BCDMOS			5 V	5,9	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Modems	.8 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.0048 Mbps	S-PQFP-G44		1.6 mm	10 mm	Not Qualified	HALF DUPLEX	e4	10 mm
MTC20174-TQ-C1	STMicroelectronics
TS75321CP	STMicroelectronics	MODEM-MODULATOR	COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V	35 mA	5 V		IN-LINE			2.54 mm	70 Cel		0 Cel		DUAL	.0096 Mbps	R-PDIP-T48		5.08 mm	15.24 mm	Not Qualified	FULL DUPLEX
E-STLC7550TQF7	STMicroelectronics	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel		0 Cel		QUAD	.056 Mbps	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e3/e4	7 mm
TS7514CFNTR	STMicroelectronics	PROGRAMMABLE MODEM	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	-5 V		5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel		QUAD	.0012 Mbps	S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified			11.5062 mm
ST75C530TQFP	STMicroelectronics	MODEM-DATA/FAX	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			.15 mA	5 V	5	FLATPACK, LOW PROFILE	QFP80,.64SQ	Modems	.65 mm	70 Cel	14.4 kbps	0 Cel	TIN LEAD	QUAD	.0144 Mbps	S-PQFP-G80		1.6 mm	14 mm	Not Qualified		e0	14 mm
UCB1100LP/X3	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Modems	.5 mm	70 Cel		0 Cel	TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3	7 mm
TDA8263HN/C1,518	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4	5 mm
NE5081N	NXP Semiconductors	MODEM-DEMODULATOR	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			50 mA	5 V		IN-LINE			2.54 mm	70 Cel		0 Cel		DUAL		R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified	HALF DUPLEX; FULL DUPLEX		26.73 mm
UCB1300BE	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified			7 mm
UCB1200BE	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified			7 mm
TDA8296HN	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40		SQUARE	PLASTIC/EPOXY	YES							CHIP CARRIER								QUAD		S-PQCC-N40				Not Qualified
NE5050D	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel		DUAL	.3 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified			12.8 mm
TDA8262HN	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-20 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified			5 mm
NE5080N	NXP Semiconductors	MODEM-MODULATOR	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			100 mA	5 V		IN-LINE			2.54 mm	70 Cel		0 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T16		4.2 mm	7.62 mm	Not Qualified	HALF DUPLEX; FULL DUPLEX	e3/e4	19.025 mm
UCB1300BE-T	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified			7 mm
NE5050N	NXP Semiconductors	MODEM	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				12 V		IN-LINE			2.54 mm	70 Cel		0 Cel		DUAL	.3 Mbps	R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified			26.73 mm
UCB1200BE-T	NXP Semiconductors	MODEM-SUPPORT CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		-20 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified			7 mm
TDA8262HN/C1,118	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4	5 mm
TDA8263HN	NXP Semiconductors	MODEM-DEMODULATOR	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified			5 mm
UCB1100	NXP Semiconductors
NE5050D-T	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	.3 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e4	12.8 mm
MC145444DW	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	SMALL OUTLINE	SOP20,.4	Modems	1.27 mm	70 Cel		-20 Cel	TIN LEAD	DUAL	.0003 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified	SIMPLEX; HALF DUPLEX; FULL DUPLEX	e0	12.8 mm
935288611518	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V		6 mm
MC145745FW	NXP Semiconductors	MODEM	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V	3.6	SMALL OUTLINE	SOP28,.4	Modems	1.27 mm	85 Cel		-30 Cel	TIN LEAD	DUAL	.0012 Mbps	R-PDSO-G28		2.65 mm	7.51 mm	Not Qualified	DATA RATE MIN:0.3BPS	e0	17.915 mm
935288611557	NXP Semiconductors	MODEM-DEMODULATOR		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		S-PQCC-N40		1 mm	6 mm		ALSO REQUIRES 3.3 V		6 mm
935234750512	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm		DATA RATE MIN:600BPS		10.3 mm
MC145442BDW	NXP Semiconductors	MODEM	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		10 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Modems	1.27 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL	.0003 Mbps	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e0	12.8 mm
935234750112	NXP Semiconductors	MODEM	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel		DUAL	.0012 Mbps	R-PDSO-G16		2.65 mm	7.5 mm		DATA RATE MIN:600BPS		10.3 mm

Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.