Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
ETHERNET TRANSCEIVER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-9 V |
IN-LINE |
2.54 mm |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
19.2405 mm |
||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
4 |
2.65 mm |
7.5 mm |
e4 |
30 |
260 |
10.3 mm |
||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
4 |
2.65 mm |
7.5 mm |
e4 |
30 |
260 |
10.3 mm |
||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
-9 V |
1 |
.065 mA |
9 V |
+-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
10 Mbps |
R-PDIP-T16 |
4.572 mm |
7.62 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
19.175 mm |
||||||||
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
10.3 mm |
|||||||||||||||||||
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
10.3 mm |
|||||||||||||||||||
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
10.3 mm |
||||||||||||||||||
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
10.3 mm |
||||||||||||||||||
|
Onsemi |
FLEXRAY TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
37 mA |
5 V |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.3 |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
10 Mbps |
R-PDSO-G16 |
3 |
1.99 mm |
5.3 mm |
e4 |
30 |
260 |
6.2 mm |
|||||||||
|
Onsemi |
FLEXRAY TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
72 mA |
5 V |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.3 |
.65 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
10 Mbps |
R-PDSO-G16 |
2 |
1.99 mm |
5.3 mm |
e4 |
30 |
260 |
6.2 mm |
|||||||||
|
Onsemi |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
16 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
6 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
5 Mbps |
R-PDSO-G16 |
2 |
1.1 mm |
4.4 mm |
e3 |
30 |
260 |
5 mm |
|||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
-9 V |
1 |
180 mA |
-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
4.2 mm |
7.62 mm |
Not Qualified |
19.025 mm |
|||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-9 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
4.06 mm |
7.62 mm |
Not Qualified |
19.09 mm |
|||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
4.2 mm |
7.62 mm |
Not Qualified |
19.025 mm |
|||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
10.3 mm |
|||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
-9 V |
1 |
.09 mA |
-9 |
SMALL OUTLINE |
SOP16,.4 |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
10.3 mm |
|||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
-9 V |
1 |
.09 mA |
-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
4.2 mm |
7.62 mm |
Not Qualified |
19.025 mm |
|||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
2 mm |
5.3 mm |
6.2 mm |
|||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
2 mm |
5.3 mm |
6.2 mm |
|||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
e3 |
40 |
260 |
10.3 mm |
||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
37 mA |
5 V |
SMALL OUTLINE, SHRINK PITCH |
SOP16,.31 |
.65 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
10 Mbps |
R-PDSO-G16 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e4 |
30 |
260 |
6.2 mm |
|||||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.07 mA |
5 V |
3.3/5,5 |
SMALL OUTLINE |
SOP16,.4 |
Network Interfaces |
1.27 mm |
105 Cel |
-40 Cel |
DUAL |
1 Mbps |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10.3 mm |
||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
16 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N16 |
.5 mm |
1.8 mm |
Not Qualified |
2.6 mm |
|||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
e3 |
40 |
260 |
10.3 mm |
||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
2 mm |
5.3 mm |
6.2 mm |
|||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.037 mA |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.3 |
Network Interfaces |
.65 mm |
MATTE TIN |
DUAL |
10 Mbps |
R-PDSO-G16 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e3 |
30 |
260 |
6.2 mm |
|||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.07 mA |
5 V |
3.3/5,5 |
SMALL OUTLINE |
SOP16,.4 |
Network Interfaces |
1.27 mm |
105 Cel |
-40 Cel |
DUAL |
1 Mbps |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
30 |
260 |
10.3 mm |
|||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.07 mA |
5 V |
3.3/5,5 |
SMALL OUTLINE |
SOP16,.4 |
Network Interfaces |
1.27 mm |
105 Cel |
-40 Cel |
DUAL |
1 Mbps |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
10.3 mm |
|||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
60 mA |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.3 |
Network Interfaces |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
10 Mbps |
R-PDSO-G16 |
1 |
2 mm |
5.3 mm |
Not Qualified |
30 |
260 |
6.2 mm |
||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G16 |
1 |
2 mm |
5.3 mm |
e4 |
6.2 mm |
|||||||||||||||
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G16 |
1.75 mm |
4 mm |
Not Qualified |
10 mm |
||||||||||||||||||||||
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G16 |
1.75 mm |
4 mm |
Not Qualified |
10 mm |
||||||||||||||||||||||
Maxim Integrated |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
-9 V |
1 |
.065 mA |
9 V |
+-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
10 Mbps |
R-PDIP-T16 |
4.572 mm |
7.62 mm |
Not Qualified |
19.175 mm |
|||||||||||
|
Maxim Integrated |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
-9 V |
1 |
.065 mA |
9 V |
+-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T16 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e3 |
19.175 mm |
||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
245 |
3 mm |
||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
245 |
3 mm |
||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
3 mm |
||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
245 |
3 mm |
||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
3 mm |
||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
-9 V |
1 |
120 mA |
-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
e0 |
|||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
-9 V |
1 |
120 mA |
-9 V |
-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
e0 |
||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
-9 V |
1 |
130 mA |
-9 V |
-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
19.175 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.