Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Silicon Labs |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
20 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
7.5 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC20,.15,20 |
.5 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
2 Mbps |
R-PDSO-N20 |
1 |
1 mm |
3.5 mm |
e4 |
30 |
260 |
5.5 mm |
||||||||||||
|
Holt Integrated Circuits |
MIL-STD-1553 DATA BUS TRANSCEIVER |
MILITARY |
GULL WING |
20 |
HSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG |
1.27 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G20 |
1 |
2.82 mm |
7.493 mm |
Not Qualified |
e3 |
40 |
260 |
12.79 mm |
||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
e3 |
4 mm |
||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
4 mm |
|||||||||||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
e3 |
4 mm |
||||||||||||||||
|
Atmel |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
1 mm |
5 mm |
Not Qualified |
5 mm |
|||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
e3 |
40 |
260 |
4 mm |
||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
1 |
53 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.2SQ,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
.9 mm |
5 mm |
e3 |
5 mm |
||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-9 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J20 |
4.572 mm |
8.94 mm |
Not Qualified |
8.94 mm |
|||||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-9 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T20 |
5.08 mm |
7.62 mm |
Not Qualified |
26.035 mm |
|||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQCC-N20 |
.8 mm |
4 mm |
4 mm |
||||||||||||||||||||
Texas Instruments |
LIN TRANSCEIVER |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5.2 mA |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20(UNSPEC) |
125 Cel |
-40 Cel |
QUAD |
.2 Mbps |
R-PQCC-N20 |
|||||||||||||||||||
Texas Instruments |
LIN TRANSCEIVER |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5.2 mA |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20(UNSPEC) |
125 Cel |
-40 Cel |
QUAD |
.2 Mbps |
R-PQCC-N20 |
|||||||||||||||||||
|
Texas Instruments |
LIN TRANSCEIVER |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5.2 mA |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20(UNSPEC) |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.2 Mbps |
R-PQCC-N20 |
2 |
e4 |
260 |
||||||||||||||
|
Texas Instruments |
LIN TRANSCEIVER |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5.2 mA |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20(UNSPEC) |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.2 Mbps |
R-PQCC-N20 |
2 |
e4 |
260 |
||||||||||||||
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
2.64 mm |
7.5 mm |
Not Qualified |
12.78 mm |
|||||||||||||||||||
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
2.64 mm |
7.5 mm |
Not Qualified |
12.78 mm |
|||||||||||||||||||
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
.1375 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
2.6416 mm |
7.5184 mm |
Not Qualified |
12.7762 mm |
||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
2 |
1.1 mm |
4.4 mm |
e3 |
30 |
260 |
6.5 mm |
||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
.1375 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
2.64 mm |
7.5 mm |
Not Qualified |
12.78 mm |
|||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T20 |
Not Qualified |
e0 |
||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T20 |
Not Qualified |
e0 |
||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T20 |
Not Qualified |
e0 |
||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J20 |
4.57 mm |
8.9662 mm |
Not Qualified |
8.9662 mm |
|||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
-9 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
6.575 mm |
||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
-9 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
6.575 mm |
||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
-9 V |
1 |
.09 mA |
-9 |
CHIP CARRIER |
LDCC20,.4SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J20 |
4.57 mm |
8.9662 mm |
Not Qualified |
8.9662 mm |
|||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
Not Qualified |
e4 |
7.2 mm |
||||||||||||||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
20 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC20,.14,20 |
.5 mm |
DUAL |
15 Mbps |
R-PDSO-N20 |
1 mm |
3.5 mm |
5.5 mm |
|||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
HSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1 |
3.4 mm |
11 mm |
Not Qualified |
30 |
220 |
15.9 mm |
|||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.062 mA |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
Network Interfaces |
.65 mm |
NICKEL PALLADIUM GOLD |
DUAL |
10 Mbps |
R-PDSO-G20 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e4 |
7.2 mm |
|||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
Not Qualified |
e4 |
7.2 mm |
||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
HSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
3 |
3.4 mm |
11 mm |
Not Qualified |
30 |
245 |
15.9 mm |
|||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e4 |
7.2 mm |
||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.