36 Network Interfaces 44

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TJA1100HNZ	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N36	1	1 mm	6 mm			e4	30	260	6 mm
TJA1101BHN/0Z	NXP Semiconductors	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		60 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100 Mbps	S-PQCC-N36	1	1 mm	6 mm			e4		260	6 mm
BCM89811B1AWMLG	Broadcom	ETHERNET TRANSCEIVER		NO LEAD	36	HQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG							QUAD		S-XQCC-N36	3							260
DP83TG720SWRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	4	225 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-PQCC-N36	3	.9 mm	6 mm		IT ALSO REQUIRES 3.3V SUPPLY	e4	30	260	6 mm
DP83TG720SWRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	4	225 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-PQCC-N36	3	.9 mm	6 mm		IT ALSO REQUIRES 3.3V SUPPLY	e4	30	260	6 mm
TJA1101AHN/0Z	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100 Mbps	S-PQCC-N36	1	1 mm	6 mm			e4	30	260	6 mm
STULPI01BTBR	STMicroelectronics	SUPPORT CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		S-PBGA-B36	3	1.16 mm	3.6 mm	Not Qualified		e2		260	3.6 mm
DP83TG720RWRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	4	250 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-PQCC-N36	3	.9 mm	6 mm		IT ALSO REQUIRES 3.3V SUPPLY	e4	30	260	6 mm
PDP83TG720SWCSTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	4	260 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	1000 Mbps	S-PQCC-N36		1 mm	6 mm		ALSO OPERATES WITH 3.3 NOMINAL SUPPLY				6 mm
DP83TC811RWRNDTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	4		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQCC-N36	3	.9 mm	6 mm			e4	30	260	6 mm
TJA1100HN	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	27 mA	1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	100 Mbps	S-PQCC-N36	1	1 mm	6 mm		3.3V NOMINAL SUPPLY ALSO AVAILABLE		30	260	6 mm
DP83TC811RWRNDRQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	4		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQCC-N36	3	.9 mm	6 mm			e4	30	260	6 mm
LAN8770R-E/5KXVAO	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100	1		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N36		.9 mm	6 mm						6 mm
LAN8770RT-E/5KXVAO	Microchip Technology	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100	1		1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N36		.9 mm	6 mm						6 mm
DP83TC811SWRNDRQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQCC-N36	3	.9 mm	6 mm			e4	30	260	6 mm
TJA1101AHN	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N36	1	1 mm	6 mm			e4	30	260	6 mm
DP83TG720RWRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	4	250 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-PQCC-N36	3	.9 mm	6 mm		IT ALSO REQUIRES 3.3V SUPPLY	e4	30	260	6 mm
DP83TC811SWRNDTQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	100000 Mbps	S-PQCC-N36	3	.9 mm	6 mm			e4	30	260	6 mm
DP83TC814RRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
DP83TC814SRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
DP83TC812SRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
TLE7263EXUMA2	Infineon Technologies	LAN SWITCHING CIRCUIT		GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm				DUAL		R-PDSO-G36		2.55 mm	7.6 mm				NOT SPECIFIED	NOT SPECIFIED	12.8 mm
TLE7263E	Infineon Technologies	LAN SWITCHING CIRCUIT		GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm				DUAL		R-PDSO-G36	3	2.55 mm	7.6 mm	Not Qualified				260	12.8 mm
DP83TC814SRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
DP83TC812SRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
DP83TC814RRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
PDP83TC811QWRNDSQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	QCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100					CHIP CARRIER				125 Cel	-40 Cel		QUAD		S-XQCC-N36
PDP83TC812SRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	100000 Mbps	S-PQCC-N36		1 mm	6 mm						6 mm
DP83TC812RRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
DP83TC812RRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
MAX4892ETX+	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified		e3	30	260	6 mm
MAX4892EETX+T	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified		e3	30	260	6 mm
MAX4892EETX+	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified		e3	30	260	6 mm
MAX4892ETX+T	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified		e3	30	260	6 mm
NCV7471BDQ5R2G	Onsemi	CAN FD, LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	AEC-Q100	2		5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP36,.4,20		.5 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 Mbps	R-PDSO-G36	3	2.65 mm	7.5 mm			e4	30	260	10.3 mm
NCV7471CDQ5R2G	Onsemi	CAN FD, LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	2	CMOS	AEC-Q100	2		5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP36,.4,20		.5 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 Mbps	R-PDSO-G36	3	2.65 mm	7.5 mm			e4	30	260	10.3 mm
STULPI01ATBR	STMicroelectronics	SUPPORT CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B36	3	1.16 mm	3.6 mm	Not Qualified		e1	30	260	3.6 mm
TJA1100	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N36		1 mm	6 mm						6 mm
TLE7263EXUMA1	Infineon Technologies	LAN SWITCHING CIRCUIT		GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm				DUAL		R-PDSO-G36		2.55 mm	7.6 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	12.8 mm
TLE6260GP	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		13.5 V	13.5	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP36,.56	Network Interfaces	.65 mm			TIN LEAD	DUAL	.125 Mbps	R-PDSO-G36		3.5 mm	11 mm	Not Qualified		e0			15.9 mm
MAX4892EETX-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N36		.8 mm	6 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	6 mm
MAX4892ETX-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified		e0			6 mm
MAX4892EETX	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N36		.8 mm	6 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	6 mm
MAX4892ETX	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified		e0		245	6 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.