Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.111 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1600 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.111 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1600 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.26 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
1250 Mbps |
S-PQFP-G64 |
1.2 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
FLAT |
64 |
HQFP |
SQUARE |
300k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
1 |
1.8 V |
FLATPACK, HEAT SINK/SLUG |
QFL64,.43SQ,20 |
.5 mm |
125 Cel |
-55 Cel |
NICKEL GOLD |
QUAD |
1000000 Mbps |
S-CQFP-F64 |
1 |
3.53 mm |
10.9 mm |
Qualified |
e4 |
10.9 mm |
||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
FLAT |
64 |
HQFP |
SQUARE |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
1 |
1.1 V |
FLATPACK, HEAT SINK/SLUG |
QFL64,.43SQ,20 |
.5 mm |
125 Cel |
-55 Cel |
NICKEL GOLD |
QUAD |
1000000 Mbps |
S-CQFP-F64 |
1 |
3.53 mm |
10.9 mm |
e4 |
10.9 mm |
||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.1 V |
FLATPACK, HEAT SINK/SLUG |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
|||||||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.113 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
1 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||||
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
||||||||||
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||||
|
Analog Devices |
REED-SOLOMON ENCODER/DECODER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1.2 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.54 mm |
10 mm |
Not Qualified |
e4 |
10 mm |
|||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
TIN |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
|||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
TIN |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
|||||||||||||||||
|
Diodes Incorporated |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.51SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1250 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
||||||||||
|
Diodes Incorporated |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK |
QFP64,.51SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
1250 Mbps |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||
Diodes Incorporated |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
1250 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
|||||||||||||
Diodes Incorporated |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||||
|
Phoenix Contact |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
40 mA |
5 V |
5 |
FLATPACK |
TQFP64,.63SQ,32 |
Network Interfaces |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
2 Mbps |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||
|
Phoenix Contact |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
40 mA |
5 V |
5 |
FLATPACK |
TQFP64,.63SQ,32 |
Network Interfaces |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
2 Mbps |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||
|
Maxim Integrated |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||
|
Maxim Integrated |
MANCHESTER ENCODER/DECODER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
|||||||||||||
|
Maxim Integrated |
REED-SOLOMON ENCODER/DECODER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1.2 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
|||||||||||||||
|
Renesas Electronics |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.16 mA |
3.3 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||
|
Renesas Electronics |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.16 mA |
3.3 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||
|
Renesas Electronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
10 mm |
|||||||||||||||||||
Renesas Electronics |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
|||||||||||||||
|
Renesas Electronics |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
|||||||||||||
Broadcom |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
64 |
QFP |
SQUARE |
METAL |
YES |
1 |
BIPOLAR |
3.3 V |
FLATPACK |
.8 mm |
85 Cel |
0 Cel |
QUAD |
S-MQFP-G64 |
2.35 mm |
13.8 mm |
Not Qualified |
13.8 mm |
||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
2.45 mm |
10 mm |
Not Qualified |
10 mm |
|||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e0 |
30 |
240 |
10 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.