HLFQFP Network Interfaces 142

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MC33FS6525KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6508NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6517LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6507NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6506NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4505CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6505CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4507NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6517LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4507KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6525LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6517KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6505LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6517CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6505LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6507CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6527LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4508NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6517CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4505KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6515NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6505NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6506CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6507LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6527LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6515CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6508CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4507CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6525NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6515LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33907AE	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm		NOT SPECIFIED	NOT SPECIFIED	7 mm
MC33FS6526CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4505NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6516NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6525LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6515KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6507KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6507KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33908LAER2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQFP-G48	3	1.6 mm	7 mm	e3	40	260	7 mm
MC33FS6505KAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6515NAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS4506CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33907LAER2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G48	3	1.6 mm	7 mm	e3	40	260	7 mm
MC33FS6517KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6515LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	2	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6525KAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6517NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
MC33FS6507CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.