HTSON Network Interfaces 16

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TLE9255WLCXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	14	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N14	2A	1.05 mm	3 mm	e3			4.5 mm
TLE9251VLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm	e3			3 mm
IFX1051LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1					5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3		260	3 mm
TLE9250XLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm	e3			3 mm
TLE9250LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm	e3			3 mm
TLE72593LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			8 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
TLE7251VLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
TLE7257LEXUMA1	Infineon Technologies	LIN TRANSCEIVER		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100	1		7 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	TIN	DUAL	.02 Mbps	S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
TLE7250XLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
TLE7250LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
TLE9250VLE	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm	e3			3 mm
IFX1051LE	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			1	60 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel	TIN	DUAL	2 Mbps	S-PDSO-N8	2A	1.15 mm	3 mm	e3		260	3 mm
TLE7257LE	Infineon Technologies	LIN TRANSCEIVER		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100	1		7 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	TIN	DUAL	.02 Mbps	S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
TLE7251VLE	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100				SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
TLE7250LE	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	60 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	TIN	DUAL	2 Mbps	S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
TLE7250VLE	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			Tin (Sn)	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm	e3	NOT SPECIFIED	NOT SPECIFIED	3 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.