CAN FD TRANSCEIVER Network Interfaces 347

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TCAN1044ADRBRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	130 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	S-PDSO-N8	2	1 mm	3 mm	ESD Value for CANH, CANL wrt GND is 3B	e4		260	3 mm
PTCAN1057ADRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1		5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G8		1.71 mm	3.895 mm					4.905 mm
PTCAN1057AVDRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1		5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N8
MCP2544FDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1	140 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm		e3	30	260	3 mm
TLE9261BQXXUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
UJA1169ATK/F/3	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20	.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm					5.5 mm
MCP2542WFDT-E/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
MCP2561FD-H/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm		e3			4.9 mm
MCP2562FDT-E/MFVAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	70 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
TCAN1462VDRQ1	Texas Instruments	CAN FD TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	130 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm		e4		260	4.905 mm
TLE9261BQXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TCAN1057ADRBRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	130 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	S-PDSO-N8	2	1 mm	3 mm	ESD Value for CANH, CANL wrt GND is 3B	e4		260	3 mm
MCP2544FDT-E/MNY	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-N8		.8 mm	2 mm		e4	30	260	3 mm
PTCAN1044VDRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	S-PDSO-N8	2	1 mm	3 mm		e4	30	260	3 mm
MCP25612FD-E/SL	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2			TS 16949	2	70 mA	5 V	SMALL OUTLINE	SOP14,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-G14		1.75 mm	3.9 mm		e3			8.65 mm
MCP2561FDT-H/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm		e3			4.9 mm
TJA1462ATK	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
PTCAN1043ADYYRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1		5 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.13,20	.5 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G14		1.1 mm	2 mm					4.2 mm
MCP2542FDT-E/SNVAO	Microchip Technology	CAN FD TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
MCP2542WFD-E/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm		e3	30	260	4.9 mm
TLE9351VSJXTMA1	Infineon Technologies	CAN FD TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	48 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-G8	1	1.73 mm	3.94 mm					4.93 mm
TCAN1057ADDFRQ1	Texas Instruments	CAN FD TRANSCEIVER		GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	130 mA	5 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.11	.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-G8	1	1.1 mm	1.6 mm	ESD Value for CANH, CANL wrt GND is 3B	e4		260	2.9 mm
MCP2544FDT-H/MNY	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	.5 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-N8		.8 mm	2 mm		e4	30	260	3 mm
MCP2544FDT-E/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1	140 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8	1	1 mm	3 mm		e3	40	260	3 mm
TCAN1043ATDRQ1	Texas Instruments	CAN FD TRANSCEIVER		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE	SOP14,.25	1.27 mm	150 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	8 Mbps	R-PDSO-G14	1	1.75 mm	3.9 mm		e4			8.65 mm
TLE92613BQXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	150 Cel	-40 Cel		QUAD	5 Mbps	S-PQCC-N48		.9 mm	7 mm					7 mm
TCAN1043ADRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE	SOP14,.25	1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-G14	1	1.75 mm	3.9 mm		e4	30	260	8.65 mm
NCV7344AMW3R2G	Onsemi	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	70 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-XDSO-N8	1	.9 mm	3 mm		e3	30	260	3 mm
ATA6560-GAQW-VAO	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
MCP2542WFD-H/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
MCP2542WFDT-E/MNY	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-N8		.8 mm	2 mm		e3	30	260	3 mm
MCP25612FD-H/SL	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	2			TS 16949	2	70 mA	5 V	SMALL OUTLINE	SOP14,.25	1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-G14		1.75 mm	3.9 mm		e3			8.65 mm
NCV7344D10R2G	Onsemi	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	70 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	R-PDSO-G8	2	1.75 mm	4.9 mm		e3	30	260	6 mm
MCP2561FDT-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8	1	1 mm	3 mm		e3	40	260	3 mm
TJA1044VTK/3Z	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	8	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	110 mA	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-G8	1	1 mm	3 mm				260	3 mm
TJA1463AT/0Z	NXP Semiconductors	CAN FD TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100	1	70 mA	5 V	SMALL OUTLINE	SOP14,.25	1.27 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
PTCAN3413DR	Texas Instruments	CAN FD TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			1	60 mA	3.3 V	SMALL OUTLINE	SOP8,.24	1.27 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G8		1.75 mm	4.905 mm					3.895 mm
PTCAN3413DRBR	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1			1	60 mA	3.3 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm					3 mm
MCP2544FDT-H/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm		e3			4.9 mm
TLE94613ESV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		GULL WING	24	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1		13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	.65 mm			TIN	DUAL		R-PDSO-G24	2A	1.15 mm	3.9 mm					8.65 mm
TCAN1043ATDMTRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	.65 mm	150 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	8 Mbps	R-PDSO-N14	2	1 mm	3 mm		e4			4.5 mm
MCP2542WFDT-H/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	140 mA	5 V	SMALL OUTLINE	SOP8,.25	1.27 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
MCP2561FD-H/MF	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	S-PDSO-N8	1	1 mm	3 mm		e3	40	260	3 mm
PTCAN1043ADMTRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25	.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N14		1 mm	3 mm					4.5 mm
UJA1169ATK	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20	.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm					5.5 mm
UJA1169ATK/3	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20	.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm					5.5 mm
UJA1169ATK/F	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	67 mA	13 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.14,20	.5 mm				DUAL	15 Mbps	R-PDSO-N20		1 mm	3.5 mm					5.5 mm
MCP2561FD-H/P	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			TS 16949	1	70 mA	5 V	IN-LINE	DIP8,.3	2.54 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDIP-T8		5.334 mm	7.62 mm		e3			9.271 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.