CAN TRANSCEIVER Network Interfaces 290

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TJA1051TK/3	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.19,25		.65 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm	Not Qualified		e4	30	260	3 mm
MAX33041EASA+	Analog Devices	CAN TRANSCEIVER																					Matte Tin (Sn) - annealed				1					e3	30	260
TJA1145T/FDJ	NXP Semiconductors	CAN TRANSCEIVER		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	1.5 mA		4.5/28	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-G14	1			Not Qualified		e4	30	260
TJA1145TK/FDJ	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	1.5 mA		4.5/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified		e4	30	260
MCP2551-E/SNVAO	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1	75 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
MCP2562-E/P	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		TS 16949	1	70 mA	5 V		IN-LINE	DIP8,.3		2.54 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDIP-T8		5.334 mm	7.62 mm			e3			9.271 mm
MCP2561-E/SNVAO	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1	70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			e3			4.9 mm
MAX33041EASA+T	Analog Devices	CAN TRANSCEIVER																					Matte Tin (Sn) - annealed				1					e3	30	260
IFX1050GVIOXUMA1	Infineon Technologies	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.07 mA	3.3 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G8	3	1.75 mm	4 mm			e3		260	5 mm
TJA1044GTK/3	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm		ESD on pins CANH and CANL ESD is 8kV		NOT SPECIFIED	NOT SPECIFIED	3 mm
TJA1145AT/FD/0Z	NXP Semiconductors	CAN TRANSCEIVER		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	65 mA	5 V		SMALL OUTLINE	SOP14,.25		1.27 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	5 Mbps	R-PDSO-G14	1	1.75 mm	3.9 mm			e4	30	260	8.65 mm
MCP2562T-E/SNVAO	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1	70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			e3			4.9 mm
MCP2561-E/MF	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	40	260	3 mm
MCP2562-E/MFVAO	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8		1 mm	3 mm			e3			3 mm
MCP2561T-E/MF	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	40	260	3 mm
MAX33040EAKA+T	Analog Devices	CAN TRANSCEIVER																					NICKEL PALLADIUM GOLD				1					e4	30	260
TJA1145TKJ	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	1.5 mA		4.5/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified		e4	30	260
ATA6563-GAQW0	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1	85 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
MCP2562T-E/MFVAO	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8		1 mm	3 mm			e3			3 mm
MCP2561T-E/SNVAO	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1	70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			e3			4.9 mm
MAX13054AEASA+	Analog Devices	CAN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	2 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm			e3	30	260	4.9 mm
TJA1145T,118	NXP Semiconductors	CAN TRANSCEIVER		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	1.5 mA		4.5/28	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm				DUAL	1 Mbps	R-PDSO-G14	1			Not Qualified			30	260
ATA6563-GAQW1	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1	85 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
ATA6563-GBQW1	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
MAX13054ESA+T	Analog Devices	CAN TRANSCEIVER	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		1		5 V	3.3,5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e3	30	260	4.9 mm
TJA1145ATK/FD	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	65 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm				DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm						4.5 mm
MCP2562T-H/SN	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	1	70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			e3			4.9 mm
TJA1051T/2Z	NXP Semiconductors	CAN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE	SOP8,.24		1.27 mm				DUAL	5 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm					260	4.9 mm
TJA1049TK/3J	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	65 mA	5 V	5	SMALL OUTLINE	SOLCC8,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N8	1			Not Qualified				260
TJA1051T/E,112	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	70 mA	5 V	3/5,5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
MCP2562-H/MF	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	40	260	3 mm
ATA6563-GBQW0	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
MAX3051EKA+	Analog Devices	CAN TRANSCEIVER	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS		1	70 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.1	Network Interfaces	.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1			Not Qualified		e3	30	260
TJA1042TK,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	70 mA	5 V	5	SMALL OUTLINE	SOLCC8,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N8				Not Qualified
UJA1167ATK/0Z	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	28 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14	1	1 mm	3 mm					260	4.5 mm
UJA1167ATK/X/0Z	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	28 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14	1	1 mm	3 mm					260	4.5 mm
PCA82C251/N3	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			1	78 mA	5 V		IN-LINE	DIP8,.3		2.54 mm	125 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	9.5 mm
MCP2551T-E/SNVAO	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1	75 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
TLE6250GXT	Infineon Technologies	CAN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8		1.75 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
TJA1051T/E	NXP Semiconductors	CAN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE	SOP8,.24		1.27 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	5 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
MAX13041ASD+T	Analog Devices	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		1	.08 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified		e3	30	260	8.65 mm
MCP2562T-H/MF	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	40	260	3 mm
MCP2561-H/SN	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	1	70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			e3			4.9 mm
PCA82C250T/YMX,118	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS		1	70 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8				Not Qualified
MCP2021AT-330E/MD	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm			e3			4 mm
MC33897CTEFR2	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.009 mA	12 V	5/26.5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	.08333 Mbps	R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified		e3	40	260	8.65 mm
TJA1049TKJ	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	65 mA	5 V	5	SMALL OUTLINE	SOLCC8,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N8	1			Not Qualified				260
TLE6250G	Infineon Technologies	CAN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100	1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm			TIN	DUAL	1 Mbps	R-PDSO-G8	3	1.75 mm	4 mm	Not Qualified		e3		260	5 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.