Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
NO LEAD |
28 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.16X.2,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100000 Mbps |
R-PQCC-N28 |
2 |
1 mm |
4 mm |
the 1.25-Gbps rate of the SGMII is excessive |
e4 |
260 |
5 mm |
|||||||||||
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
80 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
5 V |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G80 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
14 mm |
|||||||||||||||||
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G32 |
1.2 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
||||||||||
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
32 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G32 |
1.2 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
-9 V |
1 |
.065 mA |
9 V |
+-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
10 Mbps |
R-PDIP-T16 |
4.572 mm |
7.62 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
19.175 mm |
||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 |
.9 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
|||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 |
.9 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 |
.9 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
|||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
.11 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 |
.9 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
|||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
|||||||||||||||||||||||||||||||||||||
Analog Devices |
ETHERNET TRANSCEIVER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
10 Mbps |
S-XQCC-N40 |
1 mm |
6 mm |
6 mm |
||||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
40000 Mbps |
S-XQCC-N48 |
3 |
.8 mm |
7 mm |
30 |
260 |
7 mm |
||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
40000 Mbps |
S-XQCC-N48 |
3 |
.8 mm |
7 mm |
30 |
260 |
7 mm |
||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
BALL |
194 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
BGA194,17X17,87 |
2.2 mm |
85 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B194 |
3.56 mm |
38 mm |
38 mm |
||||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
BALL |
194 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
BGA194,17X17,87 |
2.2 mm |
85 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B194 |
3.56 mm |
38 mm |
NOT SPECIFIED |
NOT SPECIFIED |
38 mm |
||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
|||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.104 mA |
3/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||||||
Onsemi |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
6.5 mm |
||||||||||||||||||||
Onsemi |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
30 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
1 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G30 |
2.45 mm |
7.9 mm |
15.2 mm |
||||||||||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
8 |
3.3 V |
3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
Network Interfaces |
.5 mm |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-PQFP-G208 |
Not Qualified |
e4 |
|||||||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
3.3 V |
3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100 Mbps |
S-PQFP-G208 |
4.1 mm |
28 mm |
Not Qualified |
e4 |
28 mm |
||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.54 mm |
10 mm |
Not Qualified |
e4 |
10 mm |
|||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
-9 V |
1 |
180 mA |
-9 |
IN-LINE |
DIP16,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
4.2 mm |
7.62 mm |
Not Qualified |
19.025 mm |
|||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
1.1 mm |
6.1 mm |
11 mm |
|||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
1.1 mm |
6.1 mm |
11 mm |
|||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
11.5062 mm |
|||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
15.4 mm |
|||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
4.2 mm |
7.62 mm |
Not Qualified |
19.025 mm |
|||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
NO LEAD |
24 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
QUAD |
R-PQCC-N24 |
1 mm |
3.5 mm |
5.5 mm |
|||||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
1.1 mm |
6.1 mm |
11 mm |
||||||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.1 mm |
6.1 mm |
11 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.