INTERFACE CIRCUIT Network Interfaces 1,797

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

935290794112

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

935288956112

NXP Semiconductors

INTERFACE CIRCUIT

935316094528

NXP Semiconductors

INTERFACE CIRCUIT

935287961118

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

4.9 mm

MC34CM0902WEF

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

2

.13 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Network Interfaces

1.27 mm

85 Cel

-40 Cel

Tin (Sn)

DUAL

1 Mbps

R-PDSO-G14

3

1.75 mm

3.9 mm

Not Qualified

e3

40

260

8.65 mm

935306202118

NXP Semiconductors

INTERFACE CIRCUIT

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

1

e4

30

260

935360614557

NXP Semiconductors

INTERFACE CIRCUIT

MC35FS6512CAER2

NXP Semiconductors

INTERFACE CIRCUIT

AEC-Q100

3

40

260

935312346557

NXP Semiconductors

INTERFACE CIRCUIT

TIN

3

e3

40

260

935312883528

NXP Semiconductors

INTERFACE CIRCUIT

935360605557

NXP Semiconductors

INTERFACE CIRCUIT

MC34901SEFR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

.065 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G8

3

1.75 mm

3.9 mm

Not Qualified

e3

40

260

4.9 mm

935343932431

NXP Semiconductors

INTERFACE CIRCUIT

935320777557

NXP Semiconductors

INTERFACE CIRCUIT

935297572118

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

5 V

SMALL OUTLINE

1.27 mm

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

935316247528

NXP Semiconductors

INTERFACE CIRCUIT

935304867431

NXP Semiconductors

INTERFACE CIRCUIT

NICKEL PALLADIUM GOLD SILVER

1

e4

30

260

935287981518

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G14

3

1.75 mm

3.9 mm

Not Qualified

e4

8.65 mm

935313009557

NXP Semiconductors

INTERFACE CIRCUIT

935316303528

NXP Semiconductors

INTERFACE CIRCUIT

MC35FS6501NAE

NXP Semiconductors

INTERFACE CIRCUIT

3

40

260

935316217557

NXP Semiconductors

INTERFACE CIRCUIT

935316187557

NXP Semiconductors

INTERFACE CIRCUIT

MC34901WEF

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

.065 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G8

3

1.75 mm

3.9 mm

Not Qualified

e3

40

260

4.9 mm

935285284112

NXP Semiconductors

INTERFACE CIRCUIT

935296091012

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

4

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.615 mm

1.2 mm

1.6 mm

935360594557

NXP Semiconductors

INTERFACE CIRCUIT

935285279112

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

e4

30

260

4.9 mm

935312584557

NXP Semiconductors

INTERFACE CIRCUIT

935316311557

NXP Semiconductors

INTERFACE CIRCUIT

935287967112

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

935286689112

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

12 V

SMALL OUTLINE

1.27 mm

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

935362502528

NXP Semiconductors

INTERFACE CIRCUIT

935360436557

NXP Semiconductors

INTERFACE CIRCUIT

935360438528

NXP Semiconductors

INTERFACE CIRCUIT

MC35FS4502CAE

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

150 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

935314228574

NXP Semiconductors

INTERFACE CIRCUIT

TIN

3

e3

40

260

935360443557

NXP Semiconductors

INTERFACE CIRCUIT

935360596557

NXP Semiconductors

INTERFACE CIRCUIT

935295291118

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

SMALL OUTLINE

1.27 mm

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

8.65 mm

MC35FS6500CAER2

NXP Semiconductors

INTERFACE CIRCUIT

AEC-Q100

3

40

260

935325014528

NXP Semiconductors

INTERFACE CIRCUIT

TIN

3

e3

40

260

935303528518

NXP Semiconductors

INTERFACE CIRCUIT

NICKEL PALLADIUM GOLD SILVER

3

e4

30

260

935295727118

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

MC35FS4501NAE

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

150 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

935313228557

NXP Semiconductors

INTERFACE CIRCUIT

935285353118

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

e4

4.9 mm

935296782118

NXP Semiconductors

INTERFACE CIRCUIT

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.