LAN SWITCHING CIRCUIT Network Interfaces 52

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
RN131G-I/RM	Microchip Technology	LAN SWITCHING CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	MICROELECTRONIC ASSEMBLY		2 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N44		3.5 mm	20 mm			NOT SPECIFIED	NOT SPECIFIED	37 mm
KSZ8893MQLI	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	2	3.3 V	FLATPACK, FINE PITCH	QFP128,.68X.91,20	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	R-PQFP-G128		3.4 mm	14 mm	Not Qualified	e3			20 mm
RN171-I/RM481	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		QUAD		R-XQMA-N49		3.175 mm	17.78 mm					26.67 mm
RN171-I/RM	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel	MATTE TIN	QUAD		R-XQMA-N49		3.175 mm	17.78 mm		e3			26.67 mm
KSZ8893MBLI	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	2	3.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	100 Mbps	S-PBGA-B100	1	1.38 mm	9 mm	Not Qualified	e1			9 mm
KSZ8893MQL	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	2	3.3 V	FLATPACK, FINE PITCH	QFP128,.68X.91,20	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified	e3			20 mm
KSZ8873MLLJ	Microchip Technology	LAN SWITCHING CIRCUIT	AUTOMOTIVE			LFQFP	SQUARE			1				1.8 V			.5 mm	125 Cel	-40 Cel	MATTE TIN					1.6 mm	10 mm		e3			10 mm
KSZ8893MBL	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	2	3.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	100 Mbps	S-PBGA-B100		1.38 mm	9 mm	Not Qualified	e1			9 mm
KSZ8842-PMQLI	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V	FLATPACK, FINE PITCH		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified	e3			20 mm
RN131G-I/RM475	Microchip Technology	LAN SWITCHING CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	MICROELECTRONIC ASSEMBLY		2 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N44		3.5 mm	20 mm			NOT SPECIFIED	NOT SPECIFIED	37 mm
KSZ8842-16MVLI-TR	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V	FLATPACK, LOW PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G128		1.6 mm	14 mm		e3			14 mm
KSZ8993F	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2	1.8 V	FLATPACK, FINE PITCH	QFP128,.68X.91,20	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	R-PQFP-G128		3.4 mm	14 mm	Not Qualified	e3			20 mm
RN-131G	Microchip Technology	LAN SWITCHING CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	MICROELECTRONIC ASSEMBLY		2 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N44		3.5 mm	20 mm			NOT SPECIFIED	NOT SPECIFIED	37 mm
TLE7263EXUMA2	Infineon Technologies	LAN SWITCHING CIRCUIT		GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				13.5 V	SMALL OUTLINE, SHRINK PITCH		.65 mm				DUAL		R-PDSO-G36		2.55 mm	7.6 mm			NOT SPECIFIED	NOT SPECIFIED	12.8 mm
TLE7263E	Infineon Technologies	LAN SWITCHING CIRCUIT		GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm				DUAL		R-PDSO-G36	3	2.55 mm	7.6 mm	Not Qualified			260	12.8 mm
MAX4890EETJ	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX4890EETJ+	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
PI3L2500ZHEX	Diodes Incorporated	LAN SWITCHING CIRCUIT		NO LEAD	42	QCCN	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER						QUAD		R-XQCC-N42
MAX4892ETX+	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
MAX4891ETJ+T	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX4890ETJ+	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX4890ETJ+T	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX4892EETX+T	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
MAX4892EETX+	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
MAX4892ETX+T	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
MAX4891ETJ+	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX4890EETJ+T	Analog Devices	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
BGS8424	NXP Semiconductors	LAN SWITCHING CIRCUIT
BGS8424Z	NXP Semiconductors	LAN SWITCHING CIRCUIT
TLE7263EXUMA1	Infineon Technologies	LAN SWITCHING CIRCUIT		GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				13.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm				DUAL		R-PDSO-G36		2.55 mm	7.6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	12.8 mm
MAX4892EETX-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N36		.8 mm	6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
MAX4890EETJ-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX4891ETJ	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0		245	5 mm
MAX4892ETX-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e0			6 mm
MAX4892EETX	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N36		.8 mm	6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
MAX4892ETX	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e0		245	6 mm
MAX4891ETJ-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32		.8 mm	5 mm	Not Qualified	e0			5 mm
MAX4890ETJ-T	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX4890ETJ	Maxim Integrated	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0		245	5 mm
L-ET3048-50B1-DB	Broadcom	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	717	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	GRID ARRAY		1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B717			40 mm	Not Qualified				40 mm
BCM8021	Broadcom	LAN SWITCHING CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				GRID ARRAY						BOTTOM		S-PBGA-B	1			Not Qualified
L-ET3048-50B-DB	Broadcom	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	717	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	GRID ARRAY		1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B717			40 mm	Not Qualified				40 mm
ET3048-50B1-DB	Broadcom	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	717	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	GRID ARRAY		1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B717			40 mm	Not Qualified				40 mm
BCM84540A1IFSBG	Broadcom	LAN SWITCHING CIRCUIT		UNSPECIFIED			SQUARE	UNSPECIFIED		1
L-ET3028-50B-DB	Broadcom	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	524	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	GRID ARRAY		1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B524			31 mm	Not Qualified	e1	40	245	31 mm
ET3028-50B-DB	Broadcom	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	524	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	GRID ARRAY		1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B524			31 mm	Not Qualified	e0	30	225	31 mm
L-ET3048-50C-DB	Broadcom	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	717	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	GRID ARRAY		1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B717			40 mm	Not Qualified				40 mm
ET3028-50B1-DB	Broadcom	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	524	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	GRID ARRAY		1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B524			31 mm	Not Qualified	e0	30	225	31 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.