Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
FLATPACK, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
20 mm |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.32SQ,16 |
.4 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1000 Mbps |
S-XQCC-N64 |
3 |
.9 mm |
8 mm |
Not Qualified |
e4 |
30 |
260 |
8 mm |
|||||||||
|
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
120 mA |
3.3 V |
3.3 |
FLATPACK |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
Not Qualified |
|||||||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
COMMERCIAL |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
2 |
3.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA100,10X10,32 |
.8 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
100 Mbps |
S-PBGA-B100 |
1.38 mm |
9 mm |
Not Qualified |
e1 |
9 mm |
||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
2 |
.9 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 V |
FLATPACK, FINE PITCH |
QFP128,.68X.91,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
20 mm |
||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.8 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
2 |
1 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3 |
2.794 mm |
7.493 mm |
Not Qualified |
e3 |
15.875 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
40 mA |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
|||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
8 |
2.1 V |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G208 |
3.8 mm |
28 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
28 mm |
||||||||||||||
|
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.05,2.5,3.3 |
FLATPACK |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-PQFP-G48 |
Not Qualified |
||||||||||||||||||
|
Davicom Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N56 |
1 mm |
8 mm |
e3 |
8 mm |
|||||||||||||
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
QFP100,.75X.99 |
.65 mm |
70 Cel |
0 Cel |
QUAD |
R-PQFP-G100 |
3.3 mm |
14 mm |
20 mm |
|||||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
40 |
260 |
10 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N56 |
1 mm |
8 mm |
e3 |
8 mm |
|||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N56 |
1 mm |
8 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
||||||||||||||||
|
M/a-com Technology Solutions |
MANCHESTER ENCODER |
COMMERCIAL |
BALL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B144 |
3 |
1.68 mm |
13 mm |
e1 |
260 |
13 mm |
|||||||||||||||
|
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
7 mm |
||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
65 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC56,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100000 Mbps |
S-PQCC-N56 |
3 |
.8 mm |
9 mm |
Not Qualified |
e3 |
30 |
260 |
9 mm |
|||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
1 |
58.3 mA |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
|||||||||||
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
7 mm |
|||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
1 |
58.3 mA |
3.3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.2 mm |
7 mm |
e3 |
7 mm |
|||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
2 |
.9 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||
|
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
QFP100,.75X.99 |
.65 mm |
70 Cel |
0 Cel |
QUAD |
R-PQFP-G100 |
3.3 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
||||||||||||||||
Realtek Semiconductor |
MANCHESTER ENCODER/DECODER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
120 mA |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.7 mm |
7 mm |
Not Qualified |
7 mm |
||||||||||||
|
Cortina Systems |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||
Ic Plus |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.5 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.5 mm |
70 Cel |
0 Cel |
DUAL |
S-PDSO-G48 |
1.6 mm |
7 mm |
7 mm |
||||||||||||||||||||
|
Micrel |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||||
|
Microchip Technology |
SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
FLATPACK, FINE PITCH |
QFP128,.68X.91,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
30 |
260 |
20 mm |
|||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.26 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.55SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
10 mm |
||||||
Ic Plus |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
48 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
5 |
1.1 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
.4 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-XQCC-N48 |
.9 mm |
6 mm |
6 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
e4 |
5 mm |
||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
212 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B212 |
3 |
1.017 mm |
11 mm |
11 mm |
|||||||||||||||||
NXP Semiconductors |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
11.5062 mm |
|||||||||||||||||||
|
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
120 mA |
3.3 V |
3.3 |
FLATPACK |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
Not Qualified |
|||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
812 mA |
1.2 V |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B256 |
3 |
1.7 mm |
17 mm |
17 mm |
|||||||||||||||
|
Cortina Systems |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
2.5 V |
FLATPACK |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
R-PQFP-G100 |
|||||||||||||||||||||
|
Cortina Systems |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
2.5 V |
FLATPACK |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
R-PQFP-G100 |
|||||||||||||||||||||
|
Marvell Technology |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
2.5 V |
2.5/3.3 |
CHIP CARRIER |
LCC56,.31SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-N56 |
3 |
1 mm |
8 mm |
Not Qualified |
e3 |
30 |
260 |
8 mm |
||||||||
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
Not Qualified |
|||||||||||||||||
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
120 mA |
3.3 V |
3.3 |
FLATPACK |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
Not Qualified |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.32SQ,16 |
.4 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1000 Mbps |
S-XQCC-N64 |
3 |
.9 mm |
8 mm |
e4 |
30 |
260 |
8 mm |
||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.26 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.55SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
Intel |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
160 |
HQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, HEAT SINK/SLUG |
.65 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G160 |
4.07 mm |
28 mm |
Not Qualified |
28 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.