Analog Devices Network Interfaces 236

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3055ASD+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	8.65 mm
MAX3055ASD+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	8.65 mm
MAX2830ETM+	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N48	1	.8 mm	7 mm		e3	30	260	7 mm
MAX13051ASA+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		1	.072 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
MAX3987ETM+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N48	1	.8 mm	7 mm		e3	30	260	7 mm
MAX2828ETN+T	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm		e3	30	260	8 mm
MAX13345EETD+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	VSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				2.5 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-N14	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX14819AATM+	Analog Devices	INTERFACE CIRCUIT																					Matte Tin (Sn) - annealed				1				e3	30	260
MAX13345EETD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	VSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				2.5 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-N14	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3050ASA+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
MAX3054ASD+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	8.65 mm
MAX33040EAWA+	Analog Devices	CAN TRANSCEIVER
MAX3980UTH+T	Analog Devices	INTERFACE CIRCUIT	OTHER	NO LEAD	44	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.28SQ,20	Analog Transmission Interfaces	.5 mm	85 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N44	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX33042EASA+	Analog Devices	CAN TRANSCEIVER																					Matte Tin (Sn) - annealed				1				e3	30	260
MAX3053ASA+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
MAX33042EAKA+T	Analog Devices	CAN TRANSCEIVER																					NICKEL PALLADIUM GOLD				1				e4	30	260
MAX3058ASA+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
MAX13342EETD+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	VSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				2.5 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-N14	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX13050ASA+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		1		5 V	3.3,5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
MAX13053ESA+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		1		5 V	3.3,5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
MAX13054AEASA+T	Analog Devices	INTERFACE CIRCUIT																					Matte Tin (Sn) - annealed				1				e3	30	260
MAX13342EETD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	VSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				2.5 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-N14	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3059ASA+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
MAX2830ETM+T	Analog Devices	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			.104 mA		3/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX13053ESA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		1		5 V	3.3,5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
MAX33040EAWA+T	Analog Devices	CAN TRANSCEIVER
MAX3050ASA+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		1	.072 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	2 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
MAX33042EAKA+	Analog Devices	CAN TRANSCEIVER																					NICKEL PALLADIUM GOLD				1				e4	30	260
MAX33015EATB+	Analog Devices	CAN TRANSCEIVER		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5 Mbps	R-PDSO-N10	1	.8 mm	3 mm		e4	30	260	4 mm
MAX33012EASA+T	Analog Devices	INTERFACE CIRCUIT																					Matte Tin (Sn) - annealed				1				e3	30	260
MAX2828ETN+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm	Not Qualified	e3	30	260	8 mm
MAX33014EATB+T	Analog Devices	CAN TRANSCEIVER		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20		.5 mm	125 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N10		.8 mm	3 mm					4 mm
DS33X81+W	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B256	3	1.82 mm	17 mm					17 mm
DS33Z44DK	Analog Devices	SUPPORT CIRCUIT
MAX13345EEBC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	e1	30	260	2.12 mm
DS33W11DK+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B256		1.82 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
MAX3987ETM+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL			HVQCCN				1					2.5 V					.5 mm	85 Cel	-40 Cel	MATTE TIN				1	.8 mm	7 mm		e3	30	260	7 mm
DS33Z11-W	Analog Devices	SUPPORT CIRCUIT
DS33Z41DK	Analog Devices	SUPPORT CIRCUIT
MAX2992ECB+	Analog Devices	REED-SOLOMON ENCODER/DECODER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			1.2 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G64	3	1.6 mm	10 mm		e3	30	260	10 mm
DS33X162+W	Analog Devices	SUPPORT CIRCUIT
DS33X11+W	Analog Devices	SUPPORT CIRCUIT
DS33X82+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified	e1	30	260	17 mm
DS33W11+W	Analog Devices	SUPPORT CIRCUIT

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.