Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
TIN |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
4 mm |
Not Qualified |
e3 |
5 mm |
|||||||||||||||||
|
Infineon Technologies |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1.75 mm |
4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||||||||||
|
Infineon Technologies |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
AEC-Q100 |
1 |
.07 mA |
3.3 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
TIN |
DUAL |
1 Mbps |
R-PDSO-G8 |
3 |
1.75 mm |
4 mm |
Not Qualified |
e3 |
260 |
5 mm |
|||||||||
|
Infineon Technologies |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
TIN |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
4 mm |
Not Qualified |
e3 |
5 mm |
|||||||||||||||||
Infineon Technologies |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1.75 mm |
4 mm |
5 mm |
||||||||||||||||||||||
|
Infineon Technologies |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1.75 mm |
4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
Tin (Sn) |
DUAL |
R-PDSO-G8 |
2A |
1.75 mm |
4 mm |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.75 mm |
4 mm |
5 mm |
|||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.73 mm |
3.94 mm |
4.93 mm |
|||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
TIN |
3 |
e3 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CAN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.07 mA |
3.3 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
1 Mbps |
R-PDSO-G8 |
3 |
1.75 mm |
4 mm |
e3 |
260 |
5 mm |
|||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
8 V |
SMALL OUTLINE |
1.27 mm |
TIN |
DUAL |
R-PDSO-G8 |
2A |
1.73 mm |
3.94 mm |
e3 |
4.93 mm |
||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
TIN |
2A |
e3 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
48 mA |
5 V |
SMALL OUTLINE |
SOP14,.24 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
DUAL |
5 Mbps |
R-PDSO-G14 |
2A |
1.75 mm |
4 mm |
8.75 mm |
|||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.51 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
Network Interfaces |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1500 Mbps |
S-PBGA-B100 |
3 |
1.4 mm |
11 mm |
Not Qualified |
e1 |
20 |
260 |
11 mm |
||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
TIN |
DUAL |
R-PDSO-G14 |
3 |
1.75 mm |
4 mm |
e3 |
8.75 mm |
||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.75 mm |
4 mm |
5 mm |
|||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
14 |
HTSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE |
.65 mm |
TIN |
DUAL |
S-PDSO-N14 |
2A |
1.05 mm |
3 mm |
e3 |
4.5 mm |
||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
4 mm |
5 mm |
|||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HTSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE |
.65 mm |
TIN |
DUAL |
S-PDSO-N8 |
2A |
1.1 mm |
3 mm |
e3 |
3 mm |
||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
HTSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-N8 |
2A |
1.15 mm |
3 mm |
e3 |
260 |
3 mm |
|||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HTSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE |
.65 mm |
TIN |
DUAL |
S-PDSO-N8 |
2A |
1.1 mm |
3 mm |
e3 |
3 mm |
||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.73 mm |
3.94 mm |
4.93 mm |
|||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
COMMERCIAL |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.5 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
Network Interfaces |
1 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1500 Mbps |
S-PBGA-B100 |
3 |
1.4 mm |
11 mm |
Not Qualified |
e1 |
20 |
260 |
11 mm |
||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
TIN |
DUAL |
R-PDSO-G8 |
2A |
1.75 mm |
4 mm |
e3 |
5 mm |
||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.73 mm |
3.94 mm |
4.93 mm |
|||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.73 mm |
3.94 mm |
4.93 mm |
|||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.75 mm |
4 mm |
260 |
5 mm |
||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G14 |
2A |
1.75 mm |
4 mm |
30 |
260 |
8.75 mm |
|||||||||||||||||
Infineon Technologies |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HTSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE |
.65 mm |
TIN |
DUAL |
S-PDSO-N8 |
2A |
1.1 mm |
3 mm |
e3 |
3 mm |
||||||||||||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
6.5 mA |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
5 Mbps |
S-PQCC-N48 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||
|
Infineon Technologies |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
4 |
1.1 mA |
3.3 V |
3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA256,20X20,50 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1500 Mbps |
S-PBGA-B256 |
3 |
1.745 mm |
27 mm |
Not Qualified |
e1 |
20 |
260 |
27 mm |
||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.75 mm |
4 mm |
5 mm |
|||||||||||||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
6.5 mA |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
5 Mbps |
S-PQCC-N48 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||
|
Infineon Technologies |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1.75 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
Nickel/Gold/Palladium (Ni/Au/Pd) |
DUAL |
R-PDSO-G14 |
2A |
1.75 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8.75 mm |
|||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
8 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
.65 mm |
TIN |
DUAL |
S-PDSO-N8 |
2A |
1.1 mm |
3 mm |
e3 |
3 mm |
||||||||||||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
6.5 mA |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
5 Mbps |
S-PQCC-N48 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
48 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.73 mm |
3.94 mm |
4.93 mm |
||||||||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
6.5 mA |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
5 Mbps |
S-PQCC-N48 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
4 mm |
5 mm |
|||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
TIN |
2A |
e3 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
AEC-Q100 |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
TIN |
DUAL |
1 Mbps |
R-PDSO-G8 |
3 |
1.75 mm |
4 mm |
Not Qualified |
e3 |
260 |
5 mm |
|||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
GULL WING |
24 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
.65 mm |
TIN |
DUAL |
R-PDSO-G24 |
2A |
1.15 mm |
3.9 mm |
8.65 mm |
|||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
4 mm |
e3 |
260 |
5 mm |
|||||||||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
6.5 mA |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
2 Mbps |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
7 mm |
||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G14 |
3 |
1.75 mm |
4 mm |
e3 |
8.75 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.