Maxim Integrated Network Interfaces 163

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

78Q2120C09-CGTR/F

Maxim Integrated

MANCHESTER ENCODER/DECODER

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

e3

30

260

10 mm

78Q2133R/F1

Maxim Integrated

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.9 mm

5 mm

e3

5 mm

MAX4892ETX

Maxim Integrated

LAN SWITCHING CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N36

1

.8 mm

6 mm

Not Qualified

e0

245

6 mm

78Q2123R/F1

Maxim Integrated

ETHERNET TRANSCEIVER

COMMERCIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N32

.9 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX4891ETJ-T

Maxim Integrated

LAN SWITCHING CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

e0

5 mm

78Q8430-100IGT/F

Maxim Integrated

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

1.6 mm

14 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

14 mm

MAX4890ETJ-T

Maxim Integrated

LAN SWITCHING CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

5 mm

78Q8392LA03-CHR/F

Maxim Integrated

ETHERNET TRANSCEIVER

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BICMOS

-9 V

1

.065 mA

9 V

+-9

IN-LINE

LDCC28,.5SQ

Network Interfaces

2.54 mm

70 Cel

0 Cel

DUAL

R-PDIP-T28

3

4.191 mm

10.16 mm

Not Qualified

11.54 mm

MAX4890ETJ

Maxim Integrated

LAN SWITCHING CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

245

5 mm

78Q8392L-28CH

Maxim Integrated

ETHERNET TRANSCEIVER

COMMERCIAL

NO LEAD

28

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

-9 V

1

.065 mA

9 V

+-9

CHIP CARRIER

LDCC28,.5SQ

Network Interfaces

1.27 mm

70 Cel

0 Cel

QUAD

10 Mbps

S-PQCC-N28

1

4.572 mm

11.5316 mm

Not Qualified

20

240

11.5316 mm

MAX2821AETM-T

Maxim Integrated

SUPPORT CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

MAX2821ETM+

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2828ETN-D

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.8 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

MAX2820ETM+

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX13342EEBC+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.12 mm

MAX3952EGK-D

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N68

3

.9 mm

10 mm

Not Qualified

e0

10 mm

MAX2828ETN+D

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.8 mm

8 mm

e3

30

260

8 mm

MAX13345EEBC+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.12 mm

MAX2820ETM+T

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2828ETN

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.8 mm

8 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

8 mm

MAX13482EETE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

245

3 mm

DS33X162+

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.77 mm

17 mm

Not Qualified

e1

30

260

17 mm

MAX13053ASA/AUT

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

4.9 mm

MAX3981UTH+T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

44

VQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

QUAD

S-XQCC-N44

.8 mm

7 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7 mm

MAX13052AUT

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

5 V

3.3,5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

TIN LEAD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

MAX3059ASA

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

.07 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

TIN LEAD

DUAL

1 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

MAX2821ETM-TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.11 mA

2.7 V

3/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e0

7 mm

MAX3952EGK

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N68

3

.9 mm

10 mm

Not Qualified

e0

10 mm

DS33Z11+C01

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

169

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.5 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

MAX13054AUT

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

5 V

3.3,5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

TIN LEAD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

DS33Z41

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

169

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

3

1.5 mm

14 mm

Not Qualified

14 mm

MAX3980UGH-TD

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

44

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC44,.28SQ,20

Analog Transmission Interfaces

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N44

1

.8 mm

7 mm

Not Qualified

e0

7 mm

MAX13050ASA/AUT

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

4.9 mm

MAX3782UGK-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

68

VQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-5 Cel

TIN LEAD

QUAD

S-XQCC-N68

.9 mm

10 mm

Not Qualified

e0

10 mm

MAX2820AETM

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX3981UTH+

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

44

VQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N44

1

.8 mm

7 mm

Not Qualified

e3

30

260

7 mm

MAX13483EETE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

245

3 mm

MAX2830E/W-T

Maxim Integrated

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

.8 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

MAX3782UGK

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

68

VQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.62 mA

3.3 V

3.3

CHIP CARRIER, VERY THIN PROFILE

LCC68,.4SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-5 Cel

Tin/Lead (Sn/Pb)

QUAD

S-XQCC-N68

.9 mm

10 mm

Not Qualified

e0

10 mm

MAX13050ESA

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

5 V

3.3,5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

MAX2829ETN+TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.8 mm

8 mm

e3

30

260

8 mm

MAX2821AETM+TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.11 mA

2.7 V

3/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e3

7 mm

MAX13342EEBC+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.12 mm

MAX13482EETE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX3056ASD+

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

8.65 mm

MAX3980UGH-D

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

44

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC44,.28SQ,20

Analog Transmission Interfaces

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N44

1

.8 mm

7 mm

Not Qualified

e0

7 mm

MAX13053AUT

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

5 V

3.3,5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

TIN LEAD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

MAX2821AETM+T

Maxim Integrated

SUPPORT CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.