NXP Semiconductors Network Interfaces 1,733

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

935292423118

NXP Semiconductors

ETHERNET TRANSCEIVER

MC35FS6513NAE

NXP Semiconductors

INTERFACE CIRCUIT

3

40

260

935307179431

NXP Semiconductors

INTERFACE CIRCUIT

MC35FS4506CAER2

NXP Semiconductors

CAN FD TRANSCEIVER

AEC-Q100

3

40

260

MC35FS6515NAER2

NXP Semiconductors

CAN FD TRANSCEIVER

AEC-Q100

3

40

260

935287967118

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

935360707557

NXP Semiconductors

INTERFACE CIRCUIT

935300644118

NXP Semiconductors

CAN TRANSCEIVER

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

70 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

e4

30

260

4.9 mm

MC92603VM

NXP Semiconductors

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

GRID ARRAY

1 mm

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.6 mm

17 mm

Not Qualified

e1

40

260

17 mm

935303435118

NXP Semiconductors

INTERFACE CIRCUIT

NICKEL PALLADIUM GOLD SILVER

1

e4

30

260

935288869518

NXP Semiconductors

ETHERNET TRANSCEIVER

935330069431

NXP Semiconductors

ETHERNET TRANSCEIVER

NICKEL PALLADIUM GOLD SILVER

1

e4

30

260

935320782557

NXP Semiconductors

INTERFACE CIRCUIT

935316221528

NXP Semiconductors

INTERFACE CIRCUIT

935360514557

NXP Semiconductors

INTERFACE CIRCUIT

935312534557

NXP Semiconductors

INTERFACE CIRCUIT

MC34901WNEFR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.065 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

Not Qualified

935294212118

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

DUAL

S-PDSO-N8

1 mm

3 mm

3 mm

MC35FS6517NAE

NXP Semiconductors

CAN FD TRANSCEIVER

AEC-Q100

3

40

260

935314228518

NXP Semiconductors

INTERFACE CIRCUIT

TIN

3

e3

40

260

935300641118

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

e4

30

260

4.9 mm

935285353518

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

e4

4.9 mm

935360607557

NXP Semiconductors

INTERFACE CIRCUIT

935316673518

NXP Semiconductors

INTERFACE CIRCUIT

935316187528

NXP Semiconductors

INTERFACE CIRCUIT

MC34CM3120EPR2

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

1 mm

5 mm

5 mm

935288866518

NXP Semiconductors

ETHERNET TRANSCEIVER

AUTOMOTIVE

GULL WING

32

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G32

1.1 mm

6.1 mm

11 mm

935311339528

NXP Semiconductors

INTERFACE CIRCUIT

TIN

3

e3

40

260

MC35FS6503NAER2

NXP Semiconductors

INTERFACE CIRCUIT

AEC-Q100

3

40

260

935323778528

NXP Semiconductors

INTERFACE CIRCUIT

MC35FS6513NAER2

NXP Semiconductors

INTERFACE CIRCUIT

3

40

260

935285282118

NXP Semiconductors

CAN TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

70 mA

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

e4

30

260

4.9 mm

935360445557

NXP Semiconductors

INTERFACE CIRCUIT

935286689118

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

12 V

SMALL OUTLINE

1.27 mm

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

935316247557

NXP Semiconductors

INTERFACE CIRCUIT

935293621132

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, VERY THIN PROFILE

.35 mm

125 Cel

-40 Cel

DUAL

S-PDSO-N6

.5 mm

1 mm

1 mm

MC34FS6408NAER2

NXP Semiconductors

ETHERNET TRANSCEIVER

3

40

260

MC35FS4503CAE

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1

SMARTMOS

AEC-Q100

1

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

150 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

935304819431

NXP Semiconductors

INTERFACE CIRCUIT

NICKEL PALLADIUM GOLD SILVER

1

e4

30

260

MC35FS6508CAER2

NXP Semiconductors

CAN FD TRANSCEIVER

3

40

260

935318512557

NXP Semiconductors

INTERFACE CIRCUIT

935285293118

NXP Semiconductors

INTERFACE CIRCUIT

935314696574

NXP Semiconductors

INTERFACE CIRCUIT

TIN

3

e3

40

260

935300811118

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-N14

1

1 mm

3 mm

e4

30

260

4.5 mm

935285279118

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

e4

30

260

4.9 mm

MC34901SNEF

NXP Semiconductors

MC35FS6505CAER2

NXP Semiconductors

CAN FD TRANSCEIVER

AEC-Q100

3

40

260

935312584528

NXP Semiconductors

INTERFACE CIRCUIT

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.