NXP Semiconductors Network Interfaces 1,733

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NTS0104UK,012	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	-40 Cel		BOTTOM		R-PBGA-B12	1	.615 mm	1.2 mm					1.6 mm
TJA1054AT/S900VM,5	NXP Semiconductors	CAN TRANSCEIVER		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	.027 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			MATTE TIN	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e3			8.65 mm
TJA1055T/3,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8.65 mm
UJA1167ATK	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	28 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm					4.5 mm
MC33901SEF	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.065 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified	e3	40	260	4.9 mm
MC33FS4503CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3					40	260
MC35FS6513CAER2	NXP Semiconductors	INTERFACE CIRCUIT										AEC-Q100															3					40	260
PCA82C250T/N,118	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
UJA1169TKZ	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	20	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	7.5 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC20,.15,20		.5 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	2 Mbps	R-PDSO-N20	1	1 mm	3.5 mm		e4	30	260	5.5 mm
MC33897CTEF,574	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
MC33FS4503CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3					40	260
MC33FS6520LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3					40	260
MC33FS6520LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3					40	260
MC33FS6521CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3					40	260
PCA82C250	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS		1	.07 mA	5 V	5	IN-LINE	DIP8,.3	Network Interfaces	2.54 mm	125 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		40	250	9.5 mm
TJA1020T/N/S490,11	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
TJA1020T/N1,112	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
TJA1029T/2Z	NXP Semiconductors	INTERFACE CIRCUIT																									1						260
TJA1041T/H/V,512	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
TJA1043T/1U	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm				260	8.65 mm
TJA1054AT/N,112	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e0			8.65 mm
TJA1054AT/S900,512	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.027 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.125 Mbps	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
TJA1081TS,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	.037 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	Network Interfaces	.65 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	10 Mbps	R-PDSO-G16	1	2 mm	5.3 mm	Not Qualified	e4	30	260	6.2 mm
UJA1075ATW/5V0/WDJ	NXP Semiconductors	ETHERNET TRANSCEIVER																					NICKEL PALLADIUM GOLD SILVER				1				e4	30	260
UJA1167TK/VX,118	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	67 mA		3/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm				DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified			260
MC33FS4508CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS4508CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6502LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100															3					40	260
MC34901SEF	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.065 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified	e3	40	260	4.9 mm
PN5331B3HN/C270:55	NXP Semiconductors	SUPPORT CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	1 mm	6 mm	Not Qualified	e4		260	6 mm
TJA1020T	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
TJA1020T/N,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
TJA1020T/VM,112	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1020T/VM,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1021T/10/C,112	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4		260	4.9 mm
TJA1021TK/10/C/S90	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N8		.8 mm	3 mm					3 mm
TJA1028T/5V0/10/2Z	NXP Semiconductors	MIL-STD-1553 DATA BUS TRANSCEIVER																									1						260
TJA1029T	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm					4.9 mm
TJA1041AT	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.08 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified	e4	30	260	8.65 mm
TJA1041AT,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.08 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
TJA1041T/N,112	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e0			8.65 mm
TJA1041T/N,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e0			8.65 mm
TJA1054AT/S900,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
UJA1018TK	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC16,.13,25		.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N16		1 mm	5.5 mm					3.5 mm
UJA1069TW24/3V3,51	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	24	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	2	1.1 mm	4.4 mm	Not Qualified	e4			7.8 mm
UJA1069TW24/3V3:51	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	2	1.1 mm	4.4 mm	Not Qualified	e4			7.8 mm
UJA1075ATW/3V3/WDJ	NXP Semiconductors	ETHERNET TRANSCEIVER																					NICKEL PALLADIUM GOLD SILVER				1				e4	30	260
UJA1168TK/VX/FDJ	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100	1	67 mA		3/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified	e4	30	260

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.