Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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STMicroelectronics |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
40 |
260 |
5 mm |
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|
STMicroelectronics |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
40 |
260 |
5 mm |
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|
STMicroelectronics |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.45 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM |
DUAL |
S-PDSO-N12 |
3 |
1 mm |
3 mm |
e4 |
260 |
3 mm |
|||||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.0006 mA |
3.3 V |
3,5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
|||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||
|
STMicroelectronics |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
36 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
S-PBGA-B36 |
3 |
1.16 mm |
3.6 mm |
Not Qualified |
e2 |
260 |
3.6 mm |
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|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
110 Cel |
-40 Cel |
TIN |
DUAL |
.5 Mbps |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
250 |
4.9 mm |
||||||
|
STMicroelectronics |
MANCHESTER DECODER |
3 |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
10 mm |
|||||||||||||||||||
|
STMicroelectronics |
MANCHESTER DECODER |
MATTE TIN |
3 |
e3 |
260 |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
110 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
4.9 mm |
||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
|||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
AEC-Q100 |
1 |
80 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
4.9 mm |
|||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T20 |
Not Qualified |
e0 |
||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
25 mA |
5 V |
5 |
IN-LINE |
DIP48,.6 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T48 |
Not Qualified |
e0 |
|||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
8 |
3.3 V |
3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
Network Interfaces |
.5 mm |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-PQFP-G208 |
Not Qualified |
e4 |
|||||||||||||||||
STMicroelectronics |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T20 |
Not Qualified |
e0 |
||||||||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
Not Qualified |
||||||||||||||||
STMicroelectronics |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
36 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B36 |
3 |
1.16 mm |
3.6 mm |
Not Qualified |
e1 |
30 |
260 |
3.6 mm |
||||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
3.3 V |
3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100 Mbps |
S-PQFP-G208 |
4.1 mm |
28 mm |
Not Qualified |
e4 |
28 mm |
||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
e0 |
||||||||||||||||||
|
STMicroelectronics |
MANCHESTER DECODER |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
Not Qualified |
e0 |
||||||||||||||||||
|
STMicroelectronics |
||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.044 mA |
2.5 V |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e3 |
40 |
260 |
7 mm |
|||||||||
|
STMicroelectronics |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.044 mA |
2.5 V |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e3 |
40 |
260 |
7 mm |
|||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP20,.3 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T20 |
Not Qualified |
e0 |
||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
5 V |
5,14 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
.125 Mbps |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
8.65 mm |
|||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
25 mA |
5 V |
5 |
IN-LINE |
DIP48,.6 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T48 |
Not Qualified |
e0 |
|||||||||||||||||
STMicroelectronics |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.45 mm |
125 Cel |
-40 Cel |
DUAL |
S-PDSO-N12 |
1 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||
|
STMicroelectronics |
MANCHESTER DECODER |
3 |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.54 mm |
10 mm |
Not Qualified |
e4 |
10 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.