160 Other Function Telecom Interface ICs 24

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

GC4016-PBZ

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B160

3

1.75 mm

15 mm

Not Qualified

e1

30

260

15 mm

GC4016-PB-ASY

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B160

1.75 mm

15 mm

Not Qualified

15 mm

GC4116-PBZ

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B160

3

2.05 mm

15 mm

Not Qualified

e1

30

260

15 mm

DP83950BVQB

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

.65 mm

70 Cel

0 Cel

QUAD

S-PQFP-G160

4.1 mm

28 mm

28 mm

TNETX5105PCE

Texas Instruments

OTHER

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

780 mA

2.5/3.3

FLATPACK

QFP160,1.2SQ

Other Telecom ICs

.635 mm

95 Cel

0 Cel

QUAD

S-PQFP-G160

Not Qualified

GC3021A-PQ

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.15 mA

3.3 V

3.3

FLATPACK

QFP160,1.2SQ

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G160

3

4.07 mm

28 mm

Not Qualified

e4

20

220

28 mm

GC4116-PB

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B160

3

2.05 mm

15 mm

Not Qualified

e0

20

220

15 mm

GC4116-PB-ASY

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B160

15 mm

Not Qualified

15 mm

GC3021-PQ

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

.65 mm

70 Cel

0 Cel

QUAD

S-PQFP-G160

4.07 mm

28 mm

Not Qualified

28 mm

DP83952

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

.65 mm

70 Cel

0 Cel

QUAD

S-PQFP-G160

3.7 mm

28 mm

28 mm

GC4016-PB

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B160

3

1.75 mm

15 mm

Not Qualified

e0

20

220

15 mm

STLC5465

STMicroelectronics

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

5 V

5

FLATPACK

QFP160,1.2SQ

Other Telecom ICs

.635 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G160

Not Qualified

e0

MTC20455MB-I

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA160,14X14,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

S-PBGA-B160

1.7 mm

12 mm

Not Qualified

e1

12 mm

STLC5464

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

.65 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G160

4.07 mm

28 mm

Not Qualified

e0

28 mm

MTC20136MB-I1

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA160,14X14,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B160

1.7 mm

12 mm

Not Qualified

e1

12 mm

STLC5465B

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

5

FLATPACK

QFP160,1.2SQ

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G160

4.07 mm

28 mm

Not Qualified

e4

28 mm

MTC20455PQ-I

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

1.8,3.3

FLATPACK

QFP160,1.2SQ

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQFP-G160

4.07 mm

28 mm

Not Qualified

e4

28 mm

PXB4230

Infineon Technologies

TELECOM CIRCUIT

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

.65 mm

QUAD

S-PQFP-G160

2.75 mm

28 mm

Not Qualified

28 mm

BCM4339NKFFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

160

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B160

1 mm

8 mm

8 mm

CYW4339NKFFBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

160

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B160

1 mm

8 mm

8 mm

TECO3264

Broadcom

TELECOM CIRCUIT

OTHER

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.65 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G160

4.07 mm

28 mm

Not Qualified

e0

30

225

28 mm

SYM13FW600

Broadcom

TELECOM CIRCUIT

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK

.65 mm

QUAD

S-PQFP-G160

4.2 mm

28 mm

Not Qualified

28 mm

L64780

Broadcom

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

3.3 V

3.3

FLATPACK

QFP160,1.2SQ

Other Telecom ICs

.635 mm

70 Cel

0 Cel

QUAD

S-PQFP-G160

Not Qualified

BCM3125

Broadcom

TELECOM CIRCUIT

GULL WING

160

QFP

UNSPECIFIED

PLASTIC/EPOXY

YES

1

FLATPACK

QUAD

X-PQFP-G160

1

Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.