33 Other Function Telecom Interface ICs 39

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BT121-A-V2-IAP	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N33		2.1 mm	11 mm					13.9 mm
BT121-A-V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N33		2.1 mm	11 mm					13.9 mm
RN4678-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
RN4677-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
BM70BLES1FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm					22 mm
BM78SPPS5MC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			1.9 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm		e4	40	255	22 mm
BM70BLES1FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
BM70BLES1FC2-0B03AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
BM70BLES1FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
RN4678-V/RM113	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			1.9 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
RN4870-V/RM118	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	NO	1			3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm					22 mm
BM78SPPS5NC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			1.9 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm		e4	40	255	22 mm
ETRX357HR-LRS	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	DMA	RECTANGULAR	UNSPECIFIED	NO	1			3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N33			19 mm					25 mm
RN4678APL-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			1.9 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
RN4678APL-V/RM122	Microchip Technology	TELECOM CIRCUIT		NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			1.9 V	MICROELECTRONIC ASSEMBLY		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
RN4678-V/RM111	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	1.9 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
RN4678-V/RM122	Microchip Technology	TELECOM CIRCUIT		NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			1.9 V	MICROELECTRONIC ASSEMBLY		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
RN4678APL-V/RM120	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			1.9 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
ETRX357HR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED	NO	1			3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N33			19 mm					25 mm
RN4678APL-V/RM113	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			1.9 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
ETRX357-LRS	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	DMA	RECTANGULAR	UNSPECIFIED	NO	1			3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N33			19 mm					25 mm
CC2564MODNCMOER	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.6 V	MICROELECTRONIC ASSEMBLY			85 Cel	-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N33	3		7 mm		e3			7 mm
CC2564MODNCMOET	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.6 V	MICROELECTRONIC ASSEMBLY			85 Cel	-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N33	3		7 mm		e3			7 mm
RN4870-I/RM140	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm					22 mm
ETRX357	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED	NO	1			3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N33	3		19 mm			40	250	25 mm
RN4870-I/RM130	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm					22 mm
RN4870-V/RM140	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm					22 mm
RN4678APL-V/RM111	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	1.9 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
WF111-E-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	QMA	RECTANGULAR	UNSPECIFIED	YES	1			1.5 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		QUAD	72.2 Mbps	R-XQMA-N33	3	2.3 mm	12 mm			40	260	19 mm
RN4870-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	NO	1			3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm					22 mm
ATA8352-7MQW	Microchip Technology	TELECOM CIRCUIT		BALL	33	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.25 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA33,6X6,25	.65 mm	105 Cel	-40 Cel		BOTTOM	1 Mbps	S-PBGA-B33		1.1 mm	4.5 mm					4.5 mm
BM78SPPS5MC2-0004AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			1.9 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm		e4	40	255	22 mm
XCC2564MODNCMOET	Texas Instruments	TELECOM CIRCUIT	OTHER	BUTT	33	BCC	SQUARE	UNSPECIFIED	YES	1			3.6 V	CHIP CARRIER			70 Cel	-20 Cel		BOTTOM		S-XBCC-B33		1.4 mm	7 mm					7 mm
RN4677-V/RM112	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
BT121-A-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N33		2.1 mm	11 mm					13.9 mm
BT121-A-V1-IAP	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N33		2.1 mm	11 mm					13.9 mm
XCC2564MODNCMOER	Texas Instruments	TELECOM CIRCUIT	OTHER	BUTT	33	BCC	SQUARE	UNSPECIFIED	YES	1			3.6 V	CHIP CARRIER			70 Cel	-20 Cel		BOTTOM		S-XBCC-B33		1.4 mm	7 mm					7 mm
SPBT2563C2A	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	33		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-X33				Not Qualified
MAX3910U/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	33	DIE	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		5 V	UNCASED CHIP			85 Cel	0 Cel	TIN LEAD	UPPER		S-XUUC-N33	3			Not Qualified	e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.