34 Other Function Telecom Interface ICs 20

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

DWM1001C

Qorvo

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

DUAL

6.8 Mbps

R-XDMA-N34

3.4 mm

19.13 mm

26.12 mm

XB3-24Z8UM-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

NOT SPECIFIED

NOT SPECIFIED

19 mm

BLUENRG-134

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

34

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

105 Cel

-40 Cel

BOTTOM

R-PBGA-B34

.5 mm

2.56 mm

NOT SPECIFIED

NOT SPECIFIED

2.66 mm

CC2640R2FYFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

34

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B34

1

.575 mm

2.684 mm

e1

30

260

2.684 mm

XB3-24Z8CM-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

NOT SPECIFIED

NOT SPECIFIED

19 mm

XB3-24Z8UM

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

19 mm

BLUENRG-MSCSP

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BUTT

34

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B34

1

.5 mm

2.56 mm

2.66 mm

CC2640R2FYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

34

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B34

1

.575 mm

2.684 mm

e1

30

260

2.684 mm

XB3-24Z8RM-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

NOT SPECIFIED

NOT SPECIFIED

19 mm

XB3-24Z8CM

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

19 mm

XB3-24Z8RM

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

19 mm

ABBTM-2.4GHZ-T2

Abracon

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

3

2.5 mm

13 mm

26.9 mm

MAX1471ATJ/V+

Analog Devices

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

34

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

AEC-Q100

.0086 mA

3 V

2.4/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N34

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

BLUENRGCSP

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

34

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B34

.5 mm

2.56 mm

NOT SPECIFIED

NOT SPECIFIED

2.66 mm

BGB110

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

50 Cel

-10 Cel

UNSPECIFIED

R-XXMA-N34

Not Qualified

PBA31301/2S

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

34

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.8 V

GRID ARRAY

75 Cel

-10 Cel

BOTTOM

R-PBGA-B34

Not Qualified

PBA31301/3

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

34

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.775 V

GRID ARRAY, LOW PROFILE

1.27 mm

75 Cel

-10 Cel

BOTTOM

R-PBGA-B34

1.6 mm

10.2 mm

Not Qualified

14 mm

PBA31301/2

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

34

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.775 V

GRID ARRAY, LOW PROFILE

1.27 mm

75 Cel

-10 Cel

BOTTOM

R-PBGA-B34

1.6 mm

10.2 mm

Not Qualified

14 mm

PBA31301/3S

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

34

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.8 V

GRID ARRAY, LOW PROFILE

1.27 mm

75 Cel

-10 Cel

BOTTOM

R-PBGA-B34

1.6 mm

10.2 mm

Not Qualified

14 mm

DA14581-00UNA

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

34

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B34

3

.551 mm

2.436 mm

2.436 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.