36 Other Function Telecom Interface ICs 115

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADL5354XCPZ-R21	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N36		1 mm	6 mm	Not Qualified				6 mm
PHY1070-01QD-RR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
ADL5354ACPZ-R2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N36	1	1 mm	6 mm	Not Qualified	e3			6 mm
ADL5354XCPZ-R71	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N36		1 mm	6 mm	Not Qualified				6 mm
ADL5354ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N36	1	1 mm	6 mm	Not Qualified	e3			6 mm
MAX2023ETX+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	.345 mA	5 V	5	CHIP CARRIER, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
MAX19985AETX+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
MAX2023ETX+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	.345 mA	5 V	5	CHIP CARRIER, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
MAX7042AAX+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE, SHRINK PITCH			.8 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G36	1	2.64 mm	7.495 mm	Not Qualified	e3			15.415 mm
MAX19985AETX+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3	30	260	6 mm
NL3HS644FCTAG	Onsemi	TELECOM CIRCUIT		BALL	36	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm				BOTTOM	S-PBGA-B36		.54 mm	2.34 mm			NOT SPECIFIED	NOT SPECIFIED	2.34 mm
NL3HS644BFCTAG	Onsemi	TELECOM CIRCUIT		BALL	36	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm				BOTTOM	S-PBGA-B36		.54 mm	2.34 mm			NOT SPECIFIED	NOT SPECIFIED	2.34 mm
BGX7221HN	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD	S-PQCC-N36		1 mm	6 mm					6 mm
BGX7221HN/1,518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD	S-PQCC-N36	3	1 mm	6 mm				260	6 mm
PBA31305	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BUTT	36	LLGA	SQUARE	UNSPECIFIED	YES	1	CMOS		2.6 V		GRID ARRAY, LOW PROFILE			1.27 mm	75 Cel	-20 Cel		BOTTOM	S-XBGA-B36		1.6 mm	8.8 mm	Not Qualified				8.8 mm
CYW20707UA2EKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	36	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B36		.55 mm	2.51 mm					2.77 mm
PI2EQX4401DZFE	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-XQCC-N36	1	.8 mm	5 mm	Not Qualified	e3			6 mm
PI2EQX4401DZFEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-XQCC-N36	1	.8 mm	5 mm	Not Qualified	e3			6 mm
PHY1070-01QH-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1075-01QD-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1071-01QS-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1071-01QS-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1070-01QS-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1075-01QS-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1071-01QH-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1075-01QH-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1075-01QH-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1070-01QS-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1071-01QH-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1075-01QS-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
PHY1076-01QH-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	1 mm	6 mm			30	260	6 mm
PHY1070-01QH-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
MAX3532EAX	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		90 mA	5 V		SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G36	1	2.64 mm	7.495 mm	Not Qualified	e0			15.415 mm
PHY1076-01QA-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel		QUAD	S-XQCC-N36		1 mm	6 mm					6 mm
MAX3532EAX-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		90 mA	5 V		SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G36	1	2.64 mm	7.495 mm	Not Qualified	e0			15.415 mm
PHY1071-01QD-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
MAX5935EAX+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G36	1	2.65 mm	7.5 mm		e3	30	260	15.375 mm
MAX2023ETX	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	.345 mA	5 V	5	CHIP CARRIER, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e0		245	6 mm
MAX19993ETX+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N36	1	.85 mm	6 mm		e3	30	260	6 mm
MAX5935EAX+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G36		2.65 mm	7.5 mm			30	260	15.375 mm
MAX5935CAX	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	70 Cel	0 Cel		DUAL	R-PDSO-G36		2.65 mm	7.5 mm			NOT SPECIFIED	NOT SPECIFIED	15.375 mm
MAX5935EAX	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G36		2.65 mm	7.5 mm			NOT SPECIFIED	NOT SPECIFIED	15.375 mm
MAX5935CAX+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G36	1	2.65 mm	7.5 mm		e3	30	260	15.375 mm
MAX5935EAX-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G36		2.65 mm	7.5 mm			20	240	15.375 mm
MAX5935CAX+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G36	1	2.65 mm	7.5 mm		e3	30	260	15.375 mm
MAX19993ETX+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	S-XQCC-N36	1	.85 mm	6 mm		e3	30	260	6 mm
MAX5935CAX-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	70 Cel	0 Cel		DUAL	R-PDSO-G36		2.65 mm	7.5 mm			20	240	15.375 mm
MAX2023ETX-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	.345 mA	5 V	5	CHIP CARRIER, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified				6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.