38 Other Function Telecom Interface ICs 37

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

ESP32-WROOM-32D

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

3.2 mm

18 mm

30

250

25.5 mm

ESP32-WROOM-32U

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

3.3 mm

18 mm

30

260

19.2 mm

ESP32-WROVER-E

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3

3.45 mm

18 mm

250

31.4 mm

ESP32-WROVER-IB

Espressif Systems (Shanghai)

TELECOM CIRCUIT

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3.45 mm

18 mm

31.4 mm

ESP32-D0WD

Espressif Systems (Shanghai)

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3.45 mm

18 mm

31.4 mm

ESP32-WROOM-32U(4MB)

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

3

3.3 mm

18 mm

250

19.2 mm

ESP32-WROVER(8MB)

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

150 Mbps

R-XXMA-N38

3

3.4 mm

18 mm

250

31.4 mm

ESP32-WROVER-B(M213DH6464PC3Q0)

Espressif Systems (Shanghai)

TELECOM CIRCUIT

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3

3.45 mm

18 mm

30

250

31.4 mm

ESP32-WROVER-B

Espressif Systems (Shanghai)

TELECOM CIRCUIT

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3.45 mm

18 mm

31.4 mm

ESP32-WROVER-IE

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3

3.45 mm

18 mm

250

31.4 mm

ETRX2-PA

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

20.5 mm

37.5 mm

ESP32-WROVER-IE(4MB)

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3

3.45 mm

18 mm

250

31.4 mm

ETRX2HR-PA

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

20.5 mm

37.5 mm

ETRX2HR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

20.5 mm

37.5 mm

SKY77916-11

Skyworks Solutions

TELECOM CIRCUIT

38

RECTANGULAR

1

NOT SPECIFIED

NOT SPECIFIED

ETRX2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

20.5 mm

37.5 mm

HMC980

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

38

DIE

RECTANGULAR

UNSPECIFIED

YES

1

12 V

UNCASED CHIP

85 Cel

-55 Cel

UPPER

R-XUUC-N38

1.4 mm

NOT SPECIFIED

NOT SPECIFIED

2.26 mm

WLAN8101C

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

38

HLGA

RECTANGULAR

UNSPECIFIED

YES

1

3.85 V

GRID ARRAY, HEAT SINK/SLUG

LGA38(UNSPEC)

.35 mm

85 Cel

-40 Cel

BOTTOM

R-XLGA-N38

.685 mm

3 mm

4 mm

WLAN8101H

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

38

HLGA

RECTANGULAR

UNSPECIFIED

YES

1

3.85 V

GRID ARRAY, HEAT SINK/SLUG

LGA38(UNSPEC)

.35 mm

85 Cel

-40 Cel

BOTTOM

R-XLGA-N38

.685 mm

3 mm

4 mm

PSB4450V1.1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

Not Qualified

9.7 mm

TDA5255E1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

2.5/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP38,.25,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

Not Qualified

9.7 mm

TDA5255XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

9.7 mm

TDA5251

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

260

9.7 mm

TDA5251F1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

2.5/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP38,.25,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

TDA5250

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

2.1/5.5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP38,.25,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

Not Qualified

e3

260

9.7 mm

TDA5251XUMA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

TDA5250XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

TDA5252XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

9.7 mm

TDA5252G1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

Not Qualified

9.7 mm

TDA5252

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

9.7 mm

TDA5250D2

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

2.5/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP38,.25,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

TDA5250XUMA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

Not Qualified

9.7 mm

TDA5251XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

9.7 mm

TDA5252XUMA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

9.7 mm

TDA5252G2

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

2.5/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP38,.25,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

TDA5255

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

260

9.7 mm

TDA5255XUMA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

9.7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.