42 Other Function Telecom Interface ICs 30

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SIM800C

Simcom Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

42

QMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

.0856 Mbps

R-XQMA-N42

Operates with 3.4-4.4 V Supply

SIM7020E

Simcom Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

42

QMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

.0625 Mbps

R-XQMA-N42

SI32170-C-GM1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BUTT

42

HVBCC

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B42

.9 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

PI3EQX1004ZHEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

42

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

R-XQCC-N42

.84 mm

3.5 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

ATZB-S1-256-3-0-CR

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

42

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N42

3.2 mm

20 mm

30 mm

SKY77643-21

Skyworks Solutions

TELECOM CIRCUIT

42

RECTANGULAR

UNSPECIFIED

1

NOT SPECIFIED

NOT SPECIFIED

SKY77643-11

Skyworks Solutions

TELECOM CIRCUIT

42

RECTANGULAR

UNSPECIFIED

1

NOT SPECIFIED

NOT SPECIFIED

SI32170-C-FM1

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL

BUTT

42

HVBCC

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

BOTTOM

R-XBCC-B42

.9 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

ATZB-RF-233-1-CR

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

42

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N42

3.2 mm

20 mm

25 mm

TPS9104Y

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

42

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

1 mA

4 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N42

Not Qualified

BQ51020YFPR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

8.8

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

BQ51021YFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

BQ51020YFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

8.8

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

BQ51025YFPR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

BQ51021YFPR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

BQ51025YFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

DS2190-003

Analog Devices

COMMERCIAL

THROUGH-HOLE

42

DIP

RECTANGULAR

NO

110 mA

5 V

5

IN-LINE

DIP42,1.8

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-XDIP-T42

Not Qualified

e0

FIN210ACGFX

Onsemi

TELECOM CIRCUIT

OTHER

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B42

1 mm

3.5 mm

4.5 mm

NB7NPQ1204MMTTWG

Onsemi

TELECOM CIRCUIT

NO LEAD

42

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC42,.14X.35,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

10000 Mbps

R-XQCC-N42

1

.8 mm

3.5 mm

30

260

9 mm

PN7150B0UK/C11003

NXP Semiconductors

TELECOM CIRCUIT

OTHER

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.75 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA42,6X7,16

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B42

.58 mm

2.8 mm

2.88 mm

BCM20715A1KUBXG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B42

.6 mm

2.509 mm

3.019 mm

BCM20710A1KUBXG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B42

.6 mm

2.509 mm

3.019 mm

BCM20713A1KUBG

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B42

.6 mm

2.509 mm

3.019 mm

CYW89071A1CUBXG

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B42

.6 mm

2.509 mm

3.019 mm

CYW20710A1KUFBXG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B42

.6 mm

4 mm

4.5 mm

CYW20713A1KUBG

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B42

.6 mm

2.509 mm

3.019 mm

CYW20715A1KUBXG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.22 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B42

.6 mm

2.509 mm

3.019 mm

PI3EQX1004B1ZHEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

42

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

R-XQCC-N42

.84 mm

3.5 mm

9 mm

RY7011A0000DZ00#002

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BUTT

42

LLGA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

GRID ARRAY, LOW PROFILE

.85 mm

75 Cel

-25 Cel

BOTTOM

R-XBGA-B42

3

1.7 mm

8.95 mm

13.35 mm

RY7011A0000DZ00#001

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BUTT

42

LLGA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

GRID ARRAY, LOW PROFILE

.85 mm

75 Cel

-25 Cel

BOTTOM

R-XBGA-B42

3

1.7 mm

8.95 mm

13.35 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.