43 Other Function Telecom Interface ICs 13

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

CYBLE-416045-02

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

43

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.9 mm

85 Cel

-40 Cel

UNSPECIFIED

8000 Mbps

R-XXMA-N43

3

2 mm

14 mm

18.5 mm

EVA-M8M-0-10

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

43

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-B43

3

1.16 mm

7 mm

7 mm

EVA-M8M-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

43

XMA

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N43

1.16 mm

7 mm

7 mm

EVA-M8Q-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

43

XMA

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N43

1.16 mm

7 mm

7 mm

BM23SPKS1NB9-0B02AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

43

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.7 V

MICROELECTRONIC ASSEMBLY

MODULE,43LEAD(UNSPEC)

1.2 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N43

1.9 mm

15 mm

29 mm

EFR32BG1P332F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B43

1

.54 mm

3.143 mm

e1

40

260

3.295 mm

EFR32BG1V132F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B43

.54 mm

3.143 mm

3.295 mm

BM23SPKS1NB9-0001AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

43

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.7 V

MICROELECTRONIC ASSEMBLY

MODULE,43LEAD(UNSPEC)

1.2 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N43

1.9 mm

15 mm

29 mm

BM23SPKA1NB9-0001AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

43

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.7 V

MICROELECTRONIC ASSEMBLY

MODULE,43LEAD(UNSPEC)

1.2 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N43

1.9 mm

15 mm

29 mm

BM23SPKA1NB9-0B02AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

43

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.7 V

MICROELECTRONIC ASSEMBLY

MODULE,43LEAD(UNSPEC)

1.2 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N43

1.9 mm

15 mm

29 mm

EFR32BG1B232F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B43

.54 mm

3.143 mm

3.295 mm

ZWIR4532-S001

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

43

LGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY

1.6 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-N43

2.25 mm

12 mm

15.6 mm

ZWIR4532-U

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

43

LGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY

1.6 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-XBGA-N43

3

2.25 mm

12 mm

e0

NOT SPECIFIED

260

15.6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.