48 Other Function Telecom Interface ICs 324

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX19705ETM+TGH7	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm		e3	30	260	7 mm
MAX19700ETM-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.016 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e0		245	7 mm
MAX2822EGM	Maxim Integrated		INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES			185 mA		2.7/3	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	S-PQCC-N48	1			Not Qualified	e0
MAX2370ETM	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	.087 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e0			7 mm
MAX19708ETM	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.016 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e0		245	7 mm
MAX2742ECM-T	Maxim Integrated		INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS	20 mA		2.5/3.3	FLATPACK	TQFP48,.35SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G48				Not Qualified	e0
MAX19706ETM+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.02 mA	3 V	1.8/3.3,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3			7 mm
MAX19700ETM+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.016 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX1386AETM+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0043 mA	5 V	3/5,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N48		.8 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7 mm
MAX1385BETM+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.007 mA	5 V	3/5,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3			7 mm
MAX19705ETM+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0125 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX19705ETM	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0125 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e0		245	7 mm
MAX19700ETM	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.016 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e0		245	7 mm
MAX19705ETM+GH7	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N48		.8 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
TB31296FT	Toshiba	TELECOM CIRCUIT	OTHER	BALL	48	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA48,8X8,20	Other Telecom ICs	.5 mm	85 Cel	-35 Cel	TIN LEAD	BOTTOM	S-PBGA-B48		1.2 mm	5 mm	Not Qualified	e0			5 mm
92HD92B2X5NLGXYYX8	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm		e3			7 mm
92HD92B1X5NLGXYYX8	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm		e3			7 mm
ZIC2410QN48R	Renesas Electronics		INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES					1.5,3	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N48				Not Qualified
92HD92B2X5NLGXYYX	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm		e3			7 mm
IT6139	Renesas Electronics	TELECOM CIRCUIT		NO LEAD	48	QCCN	SQUARE	CERAMIC	YES			370 mA		-5,8	CHIP CARRIER	LCC48,.56SQ,40	Other Telecom ICs	1 mm				QUAD	S-XQCC-N48				Not Qualified
92HD92B1X5NLGXYYX	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm		e3			7 mm
IT6145	Renesas Electronics	TELECOM CIRCUIT			48			PLASTIC/EPOXY	YES			600 mA		-5,8		LCC48,.63SQ,40	Other Telecom ICs										Not Qualified
14315R-100	Renesas Electronics		INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES			15 mA	3.3 V	3.3	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N48				Not Qualified
P9036B-0NTGI8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	.8 mm	6 mm		e3			6 mm
P9036B-0NTGI	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	.8 mm	6 mm		e3			6 mm
BCM3418	Broadcom	TELECOM CIRCUIT		GULL WING	48	QFP	UNSPECIFIED	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK							QUAD	X-PQFP-G48	1			Not Qualified
BCM3416	Broadcom	TELECOM CIRCUIT		GULL WING	48	QFP	UNSPECIFIED	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK							QUAD	X-PQFP-G48				Not Qualified
AL2100KQT	Broadcom		COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		2.5 V	2.5	FLATPACK	TQFP48,.35SQ	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G48				Not Qualified
BCM59001	Broadcom	TELECOM CIRCUIT		NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER							QUAD	S-PQCC-N48				Not Qualified
CSP1027-S	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
AL2100IQT	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.2 mm	7 mm					7 mm
KB8528Q	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		FLATPACK			.75 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G48		2.3 mm	10 mm	Not Qualified				10 mm
KB8527AQ	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		FLATPACK			.75 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G48		2.3 mm	10 mm	Not Qualified				10 mm
KB8527A	Samsung	TELECOM CIRCUIT		GULL WING	48	LQFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK, LOW PROFILE			.75 mm				QUAD	S-PQFP-G48		1.55 mm	10 mm	Not Qualified				10 mm
S1M8660AX01-F0T0	Samsung	TELECOM CIRCUIT	OTHER	BUTT	48	BCC	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		BOTTOM	S-CBCC-B48			7 mm	Not Qualified				7 mm
KB8527BQ	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V	3.6	FLATPACK	QFP48,.5SQ,32	Other Telecom ICs	.75 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G48		2.3 mm	10 mm	Not Qualified				10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.