54 Other Function Telecom Interface ICs 19

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

ZED-F9P-02B

U-blox Ag

GNSS Module

INDUSTRIAL

BUTT

54

LGA

RECTANGULAR

YES

1

TS 16949

3 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-XBGA-B54

NOT SPECIFIED

NOT SPECIFIED

ZED-F9P-01B

U-blox Ag

GNSS Module

INDUSTRIAL

BUTT

54

LGA

RECTANGULAR

YES

1

TS 16949

3 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-XBGA-B54

ZED-F9P-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

54

LGA

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

3 V

GRID ARRAY

1.1 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-N54

2.6 mm

17 mm

22 mm

ZED-F9T-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

54

LGA

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

3 V

GRID ARRAY

1.1 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B54

4

2.6 mm

17 mm

22 mm

CC2564BYFVR-XI

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 Mbps

R-XBGA-B54

1

.575 mm

2.93 mm

e1

30

260

3.26 mm

CC2564BYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 Mbps

R-XBGA-B54

1

.575 mm

2.93 mm

e1

30

260

3.26 mm

WFI32E01PE-I

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

54

QMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

MODULE,54LEAD,.7

1.27 mm

85 Cel

-40 Cel

QUAD

R-XQMA-N54

2.6 mm

20.5 mm

24.5 mm

WFI32E01PC-I

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

54

QMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

MODULE,54LEAD,.7

1.27 mm

85 Cel

-40 Cel

QUAD

R-XQMA-N54

2.6 mm

20.5 mm

24.5 mm

CC2560BYFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

.575 mm

2.925 mm

e1

30

260

3.265 mm

CC2564NSYFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-PBGA-B54

1

30

260

CC2560BYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

.575 mm

2.925 mm

e1

30

260

3.265 mm

CC2564BYFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 Mbps

R-XBGA-B54

1

e1

30

260

CC2564NSYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

CC2564YFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

CC2564YFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

CC2564NYFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-PBGA-B54

1

30

260

CC2564NYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

PBA31308

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

54

LGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

1.2 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-N54

1.8 mm

8.7 mm

Not Qualified

11.6 mm

PBA31308/2

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

54

LGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

1.2 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-N54

8.7 mm

Not Qualified

11.6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.