63 Other Function Telecom Interface ICs 10

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

CC3235MODSF12MOBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BUTT

63

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

NICKEL GOLD

QUAD

R-XQMA-B63

3

2.4 mm

17.5 mm

e4

30

260

20.5 mm

CC3235MODSM2MOBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BUTT

63

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

NICKEL GOLD

QUAD

R-XQMA-B63

3

2.4 mm

17.5 mm

e4

30

260

20.5 mm

XCC3235MODSF12MOBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

63

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N63

2.45 mm

17.5 mm

20.5 mm

CC3135MODRNMMOBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BUTT

63

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

NICKEL GOLD

QUAD

R-XQMA-B63

3

2.4 mm

17.5 mm

e4

30

260

20.5 mm

XCC3135MODRNMMOBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

63

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N63

2.45 mm

17.5 mm

20.5 mm

XCC3235MODSM2MOBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

63

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N63

2.45 mm

17.5 mm

20.5 mm

CYW43438KUBGT

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B63

1

.55 mm

2.87 mm

4.87 mm

BCM43438KUBGT

Cypress Semiconductor

TELECOM CIRCUIT

OTHER

BALL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B63

.55 mm

2.87 mm

4.87 mm

BCM43438KUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B63

.55 mm

2.87 mm

4.87 mm

CYW43438KUBG

Infineon Technologies

TELECOM CIRCUIT

OTHER

BALL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

70 Cel

-30 Cel

BOTTOM

R-PBGA-B63

.55 mm

2.87 mm

4.87 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.